摘要:
Disclosed is a turning tool for cutting circumferential grooves into a surface of a polishing pad formed of a resin material and utilized for polishing semiconductor devices. The turning tool comprising a cutting part arranged to have a tooth width within a range of 0.005-1.0 mm, a wedge angle within a range of 15-35 degrees, and a front clearance angle within a range of 65-45 degrees. A polishing pad effectively formed by using the turning tool, and an apparatus and a method of producing such a polishing pad by utilizing the turning tool are also disclosed.
摘要:
Disclosed is a turning tool for cutting circumferential grooves into a surface of a polishing pad formed of a resin material and utilized for polishing semiconductor devices. The turning tool comprising a cutting part arranged to have a tooth width within a range of 0.005-1.0 mm, a wedge angle within a range of 15-35 degrees, and a front clearance angle within a range of 65-45 degrees. A polishing pad effectively formed by using the turning tool, and an apparatus and a method of producing such a polishing pad by utilizing the turning tool are also disclosed.
摘要:
A method of forming a low-friction, helically ridged skirt surface of an engine piston 30 (FIG. 2(a)) comprises cutting a continuous groove (40) in a piston body rotating about axis (34) so that adjacent groove turns intersect as ridges (42) and carry lubricating oil which forms a film on the ridged surface. The groove (40) is cut by way of a diamond tool tip (60) traversing along the axis (34). Whereas in a known, standard finish the ridges (42) have sharp peaks that can rupture the oil film, the tool is here modified to include a planing tip (70) fixed spatially with respect to the tip (60) so that after formation each ridge is planed flat to provide a plateau (44) between groove turns that exerts less film rupturing pressure against a cylinder wall whilst defining a uniformly flat outer surface for the piston. The cuting may vary the piston diameter towards the ends of the body to effect barreling in which the relationship between plateau width and groove depth vary.
摘要:
Disclosed is a turning tool for cutting circumferential grooves into a surface of a polishing pad formed of a resin material and utilized for polishing semiconductor devices. The turning tool comprising a cutting part arranged to have a tooth width within a range of 0.005-1.0 mm, a wedge angle within a range of 15-35 degrees, and a front clearance angle within a range of 65-45 degrees. A polishing pad effectively formed by using the turning tool, and an apparatus and a method of producing such a polishing pad by utilizing the turning tool are also disclosed.
摘要:
A cutting tool assembly comprising a cutter body which mounts at each of its opposite sides on one end and at the proper cutting angles a relatively narrow rectangular shaped cutter blade and a triangular shaped cutter blade. These cutter blades are maintained in an operative position in engagement with each other by a clamping element that is releasably joined to the cutter body at an angle that is related to the cutter cutting angles. Support and locking provisions further facilitate maintaining this operative position. Between these cutter blades a holder for another cutter blade is supported on the cutter body. This latter cutter blade and the triangular shaped blades are aligned along with the rectangular shaped cutter blades so as to machine a plural surface profile on a work piece.
摘要:
A lathe has a plurality of turret positions with at least one having a toolholder, a pair of blades projecting from one end of the toolholder with the toolholder structured to assume a first position with a first blade machining said workpiece which is rotating in a first direction and a second position with a second blade structured to assume a second position with the workpiece rotating in the other direction. The toolholder remains fixed during machining, Related methods and toolholders are disclosed.
摘要:
Tube ends such as those of boiler tube banks, are prepared utilizing any of various combinations of processes which include a step of micro-diameter tube film removal from a portion of a tube end, including an area below a beveled segment, or segment to be beveled. The micro-diameter film removal step provides the tube with an exposed, clean metal surface which is conducive to a subsequent welding or bonding operation performed on the tube. In yet a further embodiment, tube film removal blades are provided having a curved or rounded edge which can be utilized in milling operations having close quarters. In a further embodiment, milling head cutting blades are provided which are adjustable. In a preferred embodiment, the milling head cutting blades and/or bevel blades are provided with elongated, slotted bores.
摘要:
Tube ends such as those of boiler tube banks, are prepared utilizing any of various combinations of processes which include a step of micro-diameter tube film removal from a portion of a tube end, including an area below a beveled segment, or segment to be beveled. The micro-diameter film removal step provides the tube with an exposed, clean metal surface which is conducive to a subsequent welding or bonding operation performed on the tube. Preferably, the process is performed with a tube milling tool having interchangeable milling or cutting heads. A specialized milling head is also disclosed and, in one embodiment, is at least used to perform the micro-diameter tube film removal step. Advantageously, the tube film removal milling head also removes a weld overlay on one or both sides of a tube in one embodiment. The tube film removal milling head includes an attached blade having a planar face configuration which enables tube film removal.
摘要:
Disclosed is a turning tool for cutting circumferential grooves into a surface of a polishing pad formed of a resin material and utilized for polishing semiconductor devices. The turning tool comprising a cutting part arranged to have a tooth width within a range of 0.005–1.0 mm, a wedge angle within a range of 15–35 degrees, and a front clearance angle within a range of 65–45 degrees. A polishing pad effectively formed by using the turning tool, and an apparatus and a method of producing such a polishing pad by utilizing the turning tool are also disclosed.