摘要:
According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.
摘要:
The object is to provide a thermal print head capable of improving printing quality on a medium. The Solution is to provide a base member 11 including a recess 113a, a heat storage region 2 formed in the recess 113a, a resistor layer 4 formed on the base member 11, and an electrode layer 3 formed on the base member 11 and electrically connected to the resistor layer 4. The resistor layer 4 includes a heating portion 41 spanned between two portions of the electrode layer 3 spaced from each other as viewed in a thickness direction Z of the base member 11. The heating portion 41 is located so as to overlap the recess 113a as viewed in the thickness direction Z. The base member 11 is made of a material having a thermal conductivity of 100 to 300 W/(m·K).
摘要:
The object is to provide a thermal print head capable of improving printing quality on a medium. The Solution is to provide a base member 11 including a recess 113a, a heat storage region 2 formed in the recess 113a, a resistor layer 4 formed on the base member 11, and an electrode layer 3 formed on the base member 11 and electrically connected to the resistor layer 4. The resistor layer 4 includes a heating portion 41 spanned between two portions of the electrode layer 3 spaced from each other as viewed in a thickness direction Z of the base member 11. The heating portion 41 is located so as to overlap the recess 113a as viewed in the thickness direction Z. The base member 11 is made of a material having a thermal conductivity of 100 to 300 W/(m·K).
摘要:
A thermal head includes a substrate, a glass-made thermal storage layer disposed on one main surface of the substrate so as to extend to an edge of the substrate; electrodes disposed on or above the thermal storage layer apart from the edge of the substrate; heat-generating resistors disposed above the thermal storage layer apart from the edge of the substrate, the heat-generating resistors being connected to the electrodes; and a first covering layer disposed on or above the electrodes and the heat-generating resistors. The first covering layer extends from atop the electrodes and the heat-generating resistors toward atop the thermal storage layer on the edge of the substrate, and a protection film is disposed on or above the first covering layer disposed on or above the electrodes and the heat-generating resistors and an edge of the protection film is not disposed above the edge of the substrate.
摘要:
A thermal head includes: a substrate; a heat storage layer disposed on the substrate; a heat-generating section disposed on the heat storage layer; an electrode electrically connected to the heat-generating section; a protection layer which coats the heat-generating section and a part of the electrode; and a first coating layer which coats a part of the protection layer and is disposed downstream in a transportation direction of a recording medium, with respect to the heat-generating section, the first coating layer including a first protrusion protruding towards a recording medium side, an end on a heat-generating section side of the first coating layer being positioned between the first protrusion and the heat-generating section, and the end on the heat-generating section side of the first coating layer being positioned in a range of L/2 from the heat-generating section, in which L is a distance between the heat-generating section and the first protrusion.
摘要:
According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.
摘要:
A recording head applicable to a recording device is disclosed. The recording head comprises a substrate, a conductive pattern layer, and an electric resistor layer. The conductive pattern layer is formed on the substrate and comprises a first conductive portion, a second conductive portion, and an insulating portion. The second conductive portion is paired with the first conductive portion. The insulating portion insulates the first conductive portion and the second conductive portion. The electrical resistance layer: is formed on the conductive pattern layer; is connected to the first conductive portion and the second conductive portion; and comprises a heat-generating region between the first conductive portion and the second conductive portion.
摘要:
A thermal head that includes a bonding portion and a protective layer. The thermal head prevents electrostatic discharge damage from occurring in the bonding portion of the thermal head due to the protective layer being electrostatically charged.
摘要:
A thermal printhead (A1) comprises an insulating substrate (1), a common electrode (31) which is formed on the insulating substrate (1) and includes a plurality of comb teeth (31a), a plurality of individual electrodes (41) formed on the insulating substrate (1), and a resistor layer (51) formed on the insulating substrate (1) and electrically connected to the comb teeth (31a) and the individual electrodes (41). The resistor layer (51) comprises a thin film, whereas the common electrode (31) and the individual electrodes (41) comprise a thick film.
摘要:
A thermal transfer image receiving sheet comprising a support having an image receiving layer on one surface of the support and a backing layer on the other surface of the support, wherein, (a) a first electrical resistance of the thermal transfer image receiving sheet is in a range of 1×108–1×1012 ohms per square before the transferable protection layer is transferred; and (b) a second electrical resistance of the thermal transfer image receiving sheet is in a range of 1×108–1×1012 ohms per square after the transferable protection layer is transferred and after the backing layer is removed, the first and second electrical resistances being measured by a salt bridge method.