公开(公告)号：US20160107452A1

公开(公告)日：2016-04-21

申请号：US14980765

申请日：2015-12-28

Applicant: ROHM CO., LTD.

Inventor： Hideaki HOKI ,  Tomohiko HORIKAWA ,  Shinobu OBATA ,  Tomoharu HORIO ,  Minoru SAKAMOTO

IPC: B41J2/335

CPC classification number: B41J2/3351 ,  B41J2/335 ,  B41J2/33515 ,  B41J2/3354 ,  B41J2/33545 ,  B41J2/3357 ,  B41J2/33585 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The object is to provide a thermal print head capable of improving printing quality on a medium. The Solution is to provide a base member 11 including a recess 113a, a heat storage region 2 formed in the recess 113a, a resistor layer 4 formed on the base member 11, and an electrode layer 3 formed on the base member 11 and electrically connected to the resistor layer 4. The resistor layer 4 includes a heating portion 41 spanned between two portions of the electrode layer 3 spaced from each other as viewed in a thickness direction Z of the base member 11. The heating portion 41 is located so as to overlap the recess 113a as viewed in the thickness direction Z. The base member 11 is made of a material having a thermal conductivity of 100 to 300 W/(m·K).

Abstract translation: 本发明的目的是提供一种能够提高介质上的打印质量的热敏打印头。 该解决方案是提供一种基底构件11，其包括凹部113a，形成在凹部113a中的蓄热区域2，形成在基底构件11上的电阻层4和形成在基底构件11上的电极层3， 电阻层4包括在基底部件11的厚度方向Z上观察时彼此隔开的电极层3的两部分之间的加热部分41。加热部分41位于 在厚度方向Z上与凹部113a重叠。基材11由热传导率为100〜300W /（m·K）的材料构成。

公开(公告)号：US20160227607A1

公开(公告)日：2016-08-04

申请号：US14610320

申请日：2015-01-30

Applicant: ROHM CO., LTD.

Inventor： Yasuyuki ARITAKI ,  Tomoharu HORIO ,  Masatoshi NAKANISHI ,  Masashi TAKAGI ,  Nobuhito KINOSHITA

IPC: H05B3/02 ,  H05B3/00

CPC classification number: H05B3/265 ,  H05B2203/013

Abstract: A heater includes an elongated substrate, a heating resistor formed on. the substrate, a resistor electrode that is formed and is in contact with the heating resistor, and a heat conducting film. The substrate includes a heat generating section and a non-heat generating section. The heat generating section is a section that is overlapped with, out of the heating resistor and the resistor electrode, only the heating resistor in the lengthwise direction of the substrate. The non-heat generating section is a section that is different from the heat generating section and is adjacent to the heat generating section in the lengthwise direction of the substrate. The heat conducting film is formed so as to extend from the heat generating section into the non-heat generating section on the substrate.

Abstract translation: 加热器包括细长基板，形成在其上的加热电阻器。 衬底，形成并与加热电阻器接触的电阻器电极和导热膜。 基板包括发热部和非发热部。 发热部是与加热电阻体和电阻电极重叠的部分，仅在基板的长度方向上的加热电阻体。 非发热部是与发热部不同的部分，与基板的长度方向的发热部相邻。 导热膜形成为从发热部延伸到基板上的非发热部。

公开(公告)号：US20160040832A1

公开(公告)日：2016-02-11

申请号：US14816564

申请日：2015-08-03

Applicant: ROHM CO., LTD.

Inventor： Sachio SAKAGAMI ,  Yoshifumi FUJIMOTO ,  Hideharu OSAWA ,  Tomoharu HORIO

IPC: F21K99/00

CPC classification number: F21K9/60 ,  F21K9/20 ,  F21S8/033 ,  F21S8/04 ,  F21V19/0055 ,  F21V29/507 ,  F21V29/74 ,  F21Y2115/10

Abstract: An LED illumination module includes: an LED light emission unit that has at least one LED chip; and a covering that allows light from the LED light emission unit to pass through. The covering has an inner surface that is located on the LED light emission unit's side and an outer surface opposite to the inner surface. The covering has at least one of: an inner recessed surface that is formed in the inner surface so as to be recessed in a direction away from the LED light emission unit; and an outer recessed surface that is formed in the outer surface so as to be recessed in a direction toward the LED light emission unit.

Abstract translation: LED照明模块包括：具有至少一个LED芯片的LED发光单元; 以及允许来自LED发光单元的光通过的覆盖物。 覆盖物具有位于LED发光单元侧的内表面和与内表面相对的外表面。 所述覆盖物具有至少一个：形成在所述内表面中以沿远离所述LED发光单元的方向凹陷的内凹表面; 以及形成在外表面上以沿朝向LED发光单元的方向凹陷的外凹面。

公开(公告)号：US20150003077A1

公开(公告)日：2015-01-01

申请号：US14486385

申请日：2014-09-15

Applicant: ROHM CO., LTD.

Inventor： Yuki TANUMA ,  Tomoharu HORIO

IPC: F21V5/04

CPC classification number: H01L33/486 ,  F21V5/04 ,  F21V7/22 ,  F21V17/101 ,  F21Y2101/00 ,  F21Y2105/00 ,  F21Y2115/10 ,  H01L24/97 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/12042 ,  H01L2924/3025 ,  H05B33/02 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device includes a light emitting element, a wire connected to the light emitting element, and a substrate supporting the light emitting element. The substrate is formed with a first recess and a second recess that are open in a common surface of the substrate. The first recess includes a first bottom surface and a first side surface connected to the first bottom surface, and the light emitting element is disposed on the first bottom surface. The second recess includes a second bottom surface and a second side surface connected to the second bottom surface, and the wire is bonded to the second bottom surface. Both of the first side surface and the second side surface reach the common surface. The first side surface is connected to both of the second bottom surface and the second side surface. The opening area of the first recess is larger than the opening area of the second recess.

Abstract translation: 发光器件包括发光元件，连接到发光元件的线以及支撑发光元件的衬底。 衬底形成有在衬底的公共表面中开口的第一凹部和第二凹部。 第一凹部包括第一底表面和连接到第一底表面的第一侧表面，并且发光元件设置在第一底表面上。 第二凹部包括与第二底面连接的第二底面和第二侧面，并且线接合到第二底面。 第一侧表面和第二侧表面都到达公共表面。 第一侧表面连接到第二底表面和第二侧表面。 第一凹部的开口面积大于第二凹部的开口面积。

公开(公告)号：US20130207532A1

公开(公告)日：2013-08-15

申请号：US13852639

申请日：2013-03-28

Applicant: ROHM CO., LTD.

Inventor： Yuki TANUMA ,  Tomoharu HORIO

IPC: H05B33/02

CPC classification number: H01L33/486 ,  F21V5/04 ,  F21V7/22 ,  F21V17/101 ,  F21Y2101/00 ,  F21Y2105/00 ,  F21Y2115/10 ,  H01L24/97 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/12042 ,  H01L2924/3025 ,  H05B33/02 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device includes a light emitting element, a wire connected to the light emitting element, and a substrate supporting the light emitting element. The substrate is formed with a first recess and a second recess that are open in a common surface of the substrate. The first recess includes a first bottom surface and a first side surface connected to the first bottom surface, and the light emitting element is disposed on the first bottom surface. The second recess includes a second bottom surface and a second side surface connected to the second bottom surface, and the wire is bonded to the second bottom surface. Both of the first side surface and the second side surface reach the common surface. The first side surface is connected to both of the second bottom surface and the second side surface. The opening area of the first recess is larger than the opening area of the second recess.

公开(公告)号：US20170012178A1

公开(公告)日：2017-01-12

申请号：US15276508

申请日：2016-09-26

Applicant: ROHM CO., LTD.

Inventor： Yuki TANUMA ,  Tomoharu HORIO

IPC: H01L33/48 ,  F21V5/04 ,  H01L33/62 ,  H01L33/56 ,  H01L33/58 ,  F21V17/10 ,  F21V7/22

CPC classification number: H01L33/486 ,  F21V5/04 ,  F21V7/22 ,  F21V17/101 ,  F21Y2101/00 ,  F21Y2105/00 ,  F21Y2115/10 ,  H01L24/97 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/12042 ,  H01L2924/3025 ,  H05B33/02 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device includes a light emitting element, a wire connected to the light emitting element, and a substrate supporting the light emitting element. The substrate is formed with a first recess and a second recess that are open in a common surface of the substrate. The first recess includes a first bottom surface and a first side surface connected to the first bottom surface, and the light emitting element is disposed on the first bottom surface. The second recess includes a second bottom surface and a second side surface connected to the second bottom surface, and the wire is bonded to the second bottom surface. Both of the first side surface and the second side surface reach the common surface. The first side surface is connected to both of the second bottom surface and the second side surface. The opening area of the first recess is larger than the opening area of the second recess.

Abstract translation: 发光器件包括发光元件，连接到发光元件的线以及支撑发光元件的衬底。 衬底形成有在衬底的公共表面中开口的第一凹部和第二凹部。 第一凹部包括第一底表面和连接到第一底表面的第一侧表面，并且发光元件设置在第一底表面上。 第二凹部包括与第二底面连接的第二底面和第二侧面，并且线接合到第二底面。 第一侧表面和第二侧表面都到达公共表面。 第一侧表面连接到第二底表面和第二侧表面。 第一凹部的开口面积大于第二凹部的开口面积。

公开(公告)号：US20140084329A1

公开(公告)日：2014-03-27

申请号：US14036584

申请日：2013-09-25

Applicant: ROHM CO., LTD.

Inventor： Tomoharu HORIO

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting unit includes: a light emitting element; a first lead having a first principal surface on which the light emitting element is disposed, a first rear surface configured to face opposite the first principal surface, and a first side configured to connect the first principal surface and the first rear surface; a second lead having a second side configured to face the first side; and a first resin molding body configured to hold the first lead and the second lead. The first resin molding body covers the first principal surface to expose a region of the first principal surface where the light emitting element is disposed, and at least a portion of the first side is exposed from the first resin molding body.

Abstract translation: 发光单元包括：发光元件; 第一引线，其具有设置有发光元件的第一主面，配置成与第一主表面相对的第一后表面和被配置为连接第一主表面和第一后表面的第一侧; 第二引线，其具有构造成面对第一侧的第二侧; 以及构造成保持所述第一引线和所述第二引线的第一树脂成型体。 第一树脂成形体覆盖第一主表面，以露出设置有发光元件的第一主表面的区域，并且第一侧的至少一部分从第一树脂成型体露出。