中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

104 records (took 0.016 seconds)

    Induction Thermography Method
    21.
    发明申请
    Induction Thermography Method 有权
    感应热成像法

    公开(公告)号：US20160231261A1

    公开(公告)日：2016-08-11

    申请号：US15024039

    申请日：2014-09-11

    Applicant: SIEMENS AKTIENGESELLSCHAFT

    Inventor： Lukasz Adam Bienkowski ,  Matthias Goldammer ,  Christian Homma ,  Max Rothenfusser

    IPC: G01N25/72 ,  G01J5/02

    CPC classification number: G01N25/72 ,  G01J5/02 ,  G01J2005/0085

    Abstract: A method for induction thermography includes acquiring a plurality of images or an object at each of a plurality of imaging directions, and deriving a combined Fourier-transformed image from the images taken at different imaging directions to detect defects in the object.

    Abstract translation: 一种用于感应热成影片的方法包括在多个成像方向中的每一个处获取多个图像或物体，以及从在不同成像方向拍摄的图像中导出组合的傅里叶变换图像，以检测物体中的缺陷。

    Infrared sensor array based temperature monitoring systems for data centers and related methods
    23.
    发明授权
    Infrared sensor array based temperature monitoring systems for data centers and related methods 有权
    基于红外传感器阵列的数据中心温度监测系统及相关方法

    公开(公告)号：US09347834B2

    公开(公告)日：2016-05-24

    申请号：US14520563

    申请日：2014-10-22

    Applicant: Redwood Systems, Inc.

    Inventor： Luc W. Adriaenssens ,  Stewart Findlater

    IPC: G01J5/10 ,  H05B37/02 ,  G01J5/04 ,  H05K7/20 ,  G01J5/08 ,  G01J5/00

    CPC classification number: G01J5/10 ,  G01J5/04 ,  G01J5/089 ,  G01J2005/0085 ,  G01J2005/106 ,  H05B37/0227 ,  H05K7/20836

    Abstract: Temperature monitoring systems for data centers include a plurality of ceiling-mounted infrared sensor arrays. Each infrared sensor array includes a two-dimensional array of infrared emission sensors, and at least some of the infrared emission sensors have field of view patterns that project onto aisle faces of equipment racks that are mounted in rows in the data center. These systems may further include a controller that is remote from at least some of the infrared sensor arrays and that is in communications with the infrared sensor arrays, the controller configured to provide a two-dimensional thermal map of the aisle faces of the equipment racks based at least in part on temperature data received from the infrared sensor arrays.

    Abstract translation: 用于数据中心的温度监测系统包括多个天花板安装的红外传感器阵列。 每个红外传感器阵列包括二维阵列的红​​外发射传感器，并且至少一些红外发射传感器具有投影到安装在数据中心行中的设备机架的通道面上的视野图案。 这些系统还可以包括远离至少一些红外传感器阵列并且与红外传感器阵列通信的控制器，该控制器被配置为提供设备机架的通道面的二维热图 至少部分地基于从红外传感器阵列接收的温度数据。

    Automated object classification using temperature profiles
    25.
    发明授权
    Automated object classification using temperature profiles 有权
    使用温度曲线自动对象分类

    公开(公告)号：US09310251B2

    公开(公告)日：2016-04-12

    申请号：US13475086

    申请日：2012-05-18

    Applicant: Rajarshi Das ,  Canturk Isci ,  Jeffrey O. Kephart ,  Jonathan Lenchner

    Inventor： Rajarshi Das ,  Canturk Isci ,  Jeffrey O. Kephart ,  Jonathan Lenchner

    IPC: G01J5/00 ,  G06N3/08

    CPC classification number: G01J5/0003 ,  G01J2005/0085 ,  G06N3/08

    Abstract: Methods and apparatus are provided for automated object classification using temperature profiles. An object in an environment (such as an exemplary data center) is classified by obtaining a surface temperature profile of the object; and classifying the object as a particular type of equipment based on the obtained surface temperature profile. The surface temperature profile of the object can be compared to a plurality of predefined characteristic surface temperature profiles each associated with a given type of equipment.

    Abstract translation: 提供了使用温度曲线自动对象分类的方法和装置。 环境（例如示例性数据中心）中的对象通过获得对象的表面温度分布来分类; 并根据获得的表面温度曲线将物体分类为特定类型的设备。 可以将物体的表面温度分布与各自与给定类型的设备相关联的多个预定义的特征表面温度曲线进行比较。

    PYROMETER BACKGROUND ELIMINATION
    26.
    发明申请
    PYROMETER BACKGROUND ELIMINATION 有权
    染色体背景消除

    公开(公告)号：US20150131699A1

    公开(公告)日：2015-05-14

    申请号：US14522858

    申请日：2014-10-24

    Applicant: Applied Materials, Inc.

    Inventor： Wolfgang R. ADERHOLD

    IPC: G01J5/06

    CPC classification number: G01J5/06 ,  G01J5/0007 ,  G01J2005/0085 ,  G01J2005/065 ,  H01L21/67115

    Abstract: Embodiments disclosed herein provide an RTP system for processing a substrate. An RTP chamber has a radiation source configured to deliver radiation to a substrate disposed within a processing volume. One or more pyrometers are coupled to the chamber body opposite the radiation source. In one example, the radiation source is disposed below the substrate and the pyrometers are disposed above the substrate. In another example, the radiation source is disposed above the substrate and the pyrometers are disposed below the substrate. The substrate may be supported in varying manners configured to reduce physical contact between the substrate support and the substrate. An edge ring and shield are disposed within the processing volume and are configured to reduce or eliminate background radiation from interfering with the pyrometers. Additionally, an absorbing surface may be coupled to the chamber body to further reduce background radiation interference.

    Abstract translation: 本文公开的实施例提供了一种用于处理衬底的RTP系统。 RTP室具有被配置为将辐射传送到设置在处理容积内的衬底的辐射源。 一个或多个高温计耦合到与辐射源相对的腔体。 在一个示例中，辐射源设置在衬底下方，高温计设置在衬底上方。 在另一示例中，辐射源设置在衬底上方，高温计设置在衬底下方。 衬底可以以不同的方式被支撑，其被配置为减少衬底支撑件和衬底之间的物理接触。 边缘环和屏蔽件设置在处理体积内并且被配置为减少或消除背景辐射干扰高温计。 此外，吸收表面可以联接到腔体，以进一步减少背景辐射干扰。

    Temperature measuring method for semiconductor wafers and processing apparatus
    29.
    发明授权
    Temperature measuring method for semiconductor wafers and processing apparatus 有权
    半导体晶圆和加工设备的温度测量方法

    公开(公告)号：US6142663A

    公开(公告)日：2000-11-07

    申请号：US234368

    申请日：1999-01-21

    Applicant: Eiryo Takasuka

    Inventor： Eiryo Takasuka

    IPC: G01K11/12 ,  G01J5/00 ,  G01J5/02 ,  G01J5/08 ,  H01L21/205 ,  H01L21/22 ,  H01L21/26 ,  H01L21/66 ,  G01K7/00 ,  G01K11/32

    CPC classification number: G01J5/06 ,  G01J5/0003 ,  G01J5/0007 ,  G01J5/0044 ,  G01J5/08 ,  G01J5/0831 ,  G01J5/0856 ,  G01J5/0893 ,  G01J2005/0085

    Abstract: This invention is intended to provide a semiconductor wafer temperature measuring method for use in reflector plate-equipped infrared annealing furnaces, infrared heating epitaxy furnaces, and other semiconductor wafer processing equipment that employs lamps as the heat source, the method affording easy and accurate measurement of substrate surface temperature, thereby enabling control of the heat source on the basis of these measurements. Characterizing features are the provision of a slit or small hole to the reflector plate and measuring light from the semiconductor wafer surface in the perpendicular direction by means of a scanning CCD sensor to allow substrate temperature to be measured on the basis of the radiant light distribution peak; and the provision of slits in a plurality of locations on the reflecting plate without impairing the function thereof, so that substrate temperature distribution can be measured accurately.

    Abstract translation: 本发明旨在提供一种半导体晶片温度测量方法，该方法用于装有反射板的红外退火炉，红外加热外延炉以及采用灯作为热源的其它半导体晶片加工设备，该方法提供容易且准确的测量 基板表面温度，从而能够基于这些测量来控制热源。 表征特征是向反射板设置狭缝或小孔，并通过扫描CCD传感器在垂直方向测量来自半导体晶片表面的光，以基于辐射光分布峰值来测量衬底温度 ; 以及在反射板上的多个位置设置狭缝，而不损害其功能，从而可以准确地测量衬底温度分布。

    Apparatus and method for monitoring the coating process of a thermal coating apparatus
    30.
    发明授权
    Apparatus and method for monitoring the coating process of a thermal coating apparatus 失效
    用于监测热涂覆装置的涂布过程的装置和方法

    公开(公告)号：US5912471A

    公开(公告)日：1999-06-15

    申请号：US951253

    申请日：1997-10-16

    Applicant: Matthias Schutz

    Inventor： Matthias Schutz

    IPC: G01N15/02 ,  C23C4/12 ,  G01J5/00 ,  G01J5/08 ,  H01J37/32 ,  H05H1/00 ,  G01N21/86

    CPC classification number: G01J1/4257 ,  C23C4/12 ,  G01J1/04 ,  G01J1/0411 ,  G01J1/0414 ,  G01J5/0022 ,  G01J5/08 ,  G01J5/0806 ,  G01J5/0809 ,  G01J5/0862 ,  G01J5/0893 ,  H01J37/32935 ,  G01J1/0271 ,  G01J2005/0085 ,  G01J5/026

    Abstract: In order to render it possible to give a forecast relating to the quality of a coating layer applied to a substrate by a thermal coating apparatus, an apparatus is provided, comprising a plurality of sensors and/or comprises optical means, in order to separately monitor the radiation emitted by the heated particles entrained by the coating jet in particular areas along a section of the coating jet extending crosswise to the direction of the coating jet. The apparatus further comprises electronic circuitry connected to the outputs of the sensors for further processing the measured values. By means of such an apparatus, the coating jet can be systematically and representatively scanned and monitored. On the basis of the signals supplied by the sensors, the spatial distribution of the intensity of the electromagnetic radiation emitted by the heated particles can be determined and can be used as a relevant parameter for qualitatively judging the coating layer or for regulating the coating process.

    Abstract translation: 为了能够通过热涂覆装置给出与施加到基板的涂层的质量有关的预测，提供了包括多个传感器和/或包括光学装置的装置，以便分别监视 由涂覆射流夹带的加热颗粒发射的辐射沿涂层喷射部分的特定区域沿涂覆射流的方向横向延伸。 该装置还包括连接到传感器的输出的电子电路，用于进一步处理测量值。 通过这样的装置，可以系统地和代表性地扫描和监视涂布射流。 基于由传感器提供的信号，可以确定由加热颗粒发射的电磁辐射的强度的空间分布，并且可以用作定性判断涂层或调节涂布过程的相关参数。

Patent Agency Ranking