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公开(公告)号:US2137005A
公开(公告)日:1938-11-15
申请号:US17498137
申请日:1937-11-17
Applicant: HYGRADE SYLVANIA CORP
Inventor: MILLER CARL F
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公开(公告)号:US2108847A
公开(公告)日:1938-02-22
申请号:US13573637
申请日:1937-04-08
Applicant: SAVE ELECTRIC CORP
Inventor: CALKINS LYLE E , LEVI ORMONDE S
IPC: H01J5/08
CPC classification number: H01J5/08
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公开(公告)号:US1830165A
公开(公告)日:1931-11-03
申请号:US23924427
申请日:1927-12-10
Applicant: WESTINGHOUSE LAMP CO
Inventor: GUSTIN DANIEL S
IPC: H01J5/08
CPC classification number: H01J5/08
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公开(公告)号:US1631100A
公开(公告)日:1927-05-31
申请号:US9050626
申请日:1926-02-25
Applicant: DYAL COMPANY
Inventor: LAURITSEN CHARLES C
IPC: H01J5/08
CPC classification number: H01J5/08
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公开(公告)号:US20140091699A1
公开(公告)日:2014-04-03
申请号:US14097640
申请日:2013-12-05
Applicant: Robert E. Levin , Ronald Blose , Richard Comtois
Inventor: Robert E. Levin , Ronald Blose , Richard Comtois
IPC: H01K1/32
CPC classification number: H01K1/32 , H01J5/08 , H01J61/40 , H01K1/34 , Y02B20/125
Abstract: There is herein described a lamp having a light-transmissive envelope, a tungsten-halogen capsule and a coating disposed on the surface of the light-transmissive envelope or doped in the light-transmissive material. The light-transmissive envelope may comprise a light-transmissive material. The tungsten-halogen capsule can be positioned inside the light-transmissive envelope.
Abstract translation: 这里描述了具有透光外壳,钨 - 卤素胶囊和设置在透光外壳的表面上或掺杂在透光材料中的涂层的灯。 透光外壳可以包括透光材料。 卤钨胶囊可以位于透光外壳的内部。
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公开(公告)号:US20130063016A1
公开(公告)日:2013-03-14
申请号:US13476452
申请日:2012-05-21
Applicant: Robert E. Levin , Ronald Blose , Richard Comtois
Inventor: Robert E. Levin , Ronald Blose , Richard Comtois
IPC: H01K1/32
CPC classification number: H01K1/32 , H01J5/08 , H01J61/40 , H01K1/34 , Y02B20/125
Abstract: There is herein described a lamp having a light-transmissive envelope, a tungsten-halogen capsule and a coating disposed on the surface of the light-transmissive envelope or doped in the light-transmissive material. The light-transmissive envelope may comprise a light-transmissive material. The tungsten-halogen capsule can be positioned inside the light-transmissive envelope.
Abstract translation: 这里描述了具有透光外壳,钨 - 卤素胶囊和设置在透光外壳的表面上或掺杂在透光材料中的涂层的灯。 透光外壳可以包括透光材料。 卤钨胶囊可以位于透光外壳的内部。
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公开(公告)号:US20120292591A1
公开(公告)日:2012-11-22
申请号:US13575149
申请日:2011-01-26
Applicant: Viktor D. Bochkov
Inventor: Viktor D. Bochkov
CPC classification number: H01J5/08
Abstract: A high-voltage electronic device comprising high-voltage electrodes, located in a dielectric envelope with an internal surface coated with a material having a conductivity which is greater than the conductivity of the envelope, characterized in that the areas subject to high field strength are coated with composite material, based on a polycrystalline material with a bulk conductivity of particles 10−9 to 10−13 Ohm−1 cm−1, each of which contains a surface nanolayer of bonding inorganic material. The high-voltage electrodes may be placed in a vacuum envelope and fixed on coated insulators. Preferred coating materials include materials from a group of materials comprising; oxides of chromium, boron or zirconium in the form of polycrystalline porous substance with a particle size of 30 nm-30 microns, connected to each other with an inorganic material, for instance silicon oxide (SiO2) with a layer thickness not more than 100 nm.
Abstract translation: 一种高电压电子装置,包括位于电介质外壳内的高电压电极,所述电介质外壳的内表面涂覆有电导率大于封套导电性的材料,其特征在于,具有高场强的区域被涂覆 与复合材料,基于体积电导率为10-9至10-13Ohm-1cm-1的多晶材料,其各自包含粘合无机材料的表面纳米层。 高压电极可以放置在真空封壳中并固定在涂覆的绝缘体上。 优选的涂层材料包括来自一组材料的材料,包括: 粒径为30nm-30微米的多晶多孔物质形式的铬,硼或锆的氧化物用无机材料彼此连接,例如层厚度不大于100nm的氧化硅(SiO 2) 。
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公开(公告)号:US20060200983A1
公开(公告)日:2006-09-14
申请号:US11436705
申请日:2006-05-19
Applicant: Masayoshi Shimamura , Ryohei Okamoto , Yoshiyuki Atsuchi
Inventor: Masayoshi Shimamura , Ryohei Okamoto , Yoshiyuki Atsuchi
CPC classification number: H05K9/0096 , H01J5/08 , H01J9/20 , H01J2211/446 , H05K3/20 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49156 , Y10T428/14 , Y10T428/1438 , Y10T428/1471 , Y10T428/1476 , Y10T428/1481 , Y10T428/1486 , Y10T428/24851 , Y10T428/24917 , Y10T428/25
Abstract: A radiation shielding structure includes a first adhesive layer, a resin layer, and a metal foil laminated sequentially on a release layer of a plastic film. A metal layer pattern is formed from the metal foil. The first adhesive layer, the resin layer, and the metal layer pattern are formed sequentially from the bottom on a transparent substrate by separating the release layer from the first adhesive layer along an interface and then adhering the first adhesive layer to the transparent substrate.
Abstract translation: 辐射屏蔽结构包括依次层叠在塑料膜的剥离层上的第一粘合剂层,树脂层和金属箔。 由金属箔形成金属层图案。 通过沿着界面将剥离层从第一粘合剂层分离,然后将第一粘合剂层粘合到透明基板上,从透明基板的底部依次形成第一粘合层,树脂层和金属层图案。
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公开(公告)号:US20050285536A1
公开(公告)日:2005-12-29
申请号:US11122048
申请日:2005-05-05
Applicant: Kazuhiko Machida
Inventor: Kazuhiko Machida
CPC classification number: H01J5/06 , H01J5/08 , H01J2217/38
Abstract: A discharge tube comprised of a cylinder ceramic envelope sealed at its two ends by plate-shaped positive electrode and negative electrode, wherein the entire outside circumference of at least the negative electrode end of the ceramic envelope is printed with insulating ink, whereby it is possible to prevent insulation degradation due to deposition or dirt or moisture on the surface of the envelope and greatly lighten the burden of handling and maintenance and management.
Abstract translation: 一种放电管,包括由其两端由板状正电极和负电极密封的圆柱形陶瓷外壳,其中陶瓷外壳的至少负极端的整个外圆周印有绝缘油墨,由此可能 以防止由于信封表面上的沉积或污垢或水分引起的绝缘降解,并大大减轻处理和维护和管理的负担。
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公开(公告)号:US20040231873A1
公开(公告)日:2004-11-25
申请号:US10871374
申请日:2004-06-21
Inventor: Masayoshi Shimamura , Ryohei Okamoto , Yoshiyuki Atsuchi
IPC: H05K009/00
CPC classification number: H05K9/0096 , H01J5/08 , H01J9/20 , H01J2211/446 , H05K3/20 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49156 , Y10T428/14 , Y10T428/1438 , Y10T428/1471 , Y10T428/1476 , Y10T428/1481 , Y10T428/1486 , Y10T428/24851 , Y10T428/24917 , Y10T428/25
Abstract: A radiation shielding structure includes a first adhesive layer, a resin layer, and a metal foil laminated sequentially on a release layer of a plastic film. A metal layer pattern is formed from the metal foil. The first adhesive layer, the resin layer, and the metal layer pattern are formed sequentially from the bottom on a transparent substrate by separating the release layer from the first adhesive layer along an interface and then adhering the first adhesive layer to the transparent substrate.
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