公开(公告)号：US20220310479A1

公开(公告)日：2022-09-29

申请号：US17746760

申请日：2022-05-17

申请人： ROHM CO., LTD.

发明人： Maiko HATANO ,  Takukazu OTSUKA ,  Hirotaka OTAKE ,  Tatsuya MIYAZAKI

IPC分类号： H01L23/373 ,  H01L23/367 ,  H01L23/495 ,  H01L23/00 ,  H01L25/11 ,  H01L25/00 ,  H01L23/498 ,  H01L25/18

摘要： A power module (PM) includes: an insulating substrate; a semiconductor device disposed on the insulating substrate, the semiconductor device including electrodes on a front surface side and a back surface side thereof; and a graphite plate having an anisotropic thermal conductivity, the graphite plate of which one end is connected to the front surface side of the semiconductor device and the other end is connected to the insulating substrate, wherein heat of the front surface side of the semiconductor device is transferred to the insulating substrate through the graphite plate. There is provide an inexpensive power module capable of reducing a stress and capable of exhibiting cooling performance not inferior to that of the double-sided cooling structures.

公开(公告)号：US11431255B2

公开(公告)日：2022-08-30

申请号：US16634658

申请日：2018-08-02

申请人： NEC CORPORATION

发明人： Sangwon Hwang

IPC分类号： H02M7/00 ,  H04N5/232 ,  H04N5/247 ,  H01L23/50 ,  H01L23/52 ,  H01L25/07 ,  H01L25/18 ,  H01L27/06 ,  H01L27/07 ,  H01L29/66 ,  H01L25/11

摘要： In order to provide a feature for processing an image of an object being photographed using photographic data having better quality, an image analyzer 1 is provided with a selection unit 104 and a bandwidth control request unit 105. The selection unit 104 selects a second photographing device associated with a first photographing device from among a plurality of photographing devices. The bandwidth control request unit 105 transmits, to a network control device, a request for change of the transmission data amount transmittable by the second photographing device.

公开(公告)号：US11410970B2

公开(公告)日：2022-08-09

申请号：US16913524

申请日：2020-06-26

申请人： UltraMemory Inc.

发明人： Ryuji Takishita ,  Takao Adachi

IPC分类号： H01L25/065 ,  H01L23/367 ,  H01L23/498 ,  H01L23/00 ,  H01L25/04 ,  H01L25/07 ,  H01L25/11 ,  H01L27/02

摘要： The present invention provides a semiconductor module capable of improving a bandwidth between a logic chip and a RAM. According to the present invention, a semiconductor module 1 is provided with: a logic chip; a pair of RAM units 30 each composed of a lamination-type RAM module; a first interposer 10 electrically connected to the logic chip and to each of the pair of RAM units 30; and a connection unit 40 that communicatively connects the logic chip and each of the pair of RAM units 30, wherein one RAM unit 30a is placed on the first interposer 10, and has one end portion disposed so as to overlap, in the lamination direction C, one end portion of the logic chip with the connection unit 40 therebetween, and the other RAM unit 30b is disposed so as to overlap the one RAM unit 30a with the connection unit 40 therebetween, and is also disposed along the outer periphery of the logic chip.

公开(公告)号：US20220158556A1

公开(公告)日：2022-05-19

申请号：US17590513

申请日：2022-02-01

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Ying-Chih Hsu ,  Eric Soenen ,  Alan Roth

IPC分类号： H02M3/158 ,  H03H7/01 ,  H02M3/155 ,  H01L25/11

摘要： A power converter module includes a ground terminal, an input voltage terminal configured to receive a raw input voltage, and an interconnection terminal configured to provide a regulated output voltage to a load such as a SOC or SIP system to be powered. A voltage regulator is connected to the ground terminal and the input voltage terminal. An inductor has an inductor output connected to the interconnection terminal.

公开(公告)号：US11289536B2

公开(公告)日：2022-03-29

申请号：US16899522

申请日：2020-06-11

申请人： SEOUL VIOSYS CO., LTD.

发明人： Jong Hyeon Chae ,  Seong Gyu Jang ,  Ho Joon Lee ,  Chang Yeon Kim ,  Chung Hoon Lee

IPC分类号： H01L27/15 ,  H01L27/32 ,  H01L25/07 ,  H01L25/13 ,  H01L33/00 ,  H01L33/10 ,  H01L33/40 ,  H01L33/42 ,  H01L33/50 ,  H01L33/62 ,  H01L33/38 ,  H01L25/075 ,  H01L25/065 ,  H01L25/11

摘要： A display apparatus including a thin film transistor (TFT) substrate, a first LED sub-unit disposed on the TFT substrate, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, electrode pads disposed between the TFT substrate and the first LED sub-unit, and connectors connecting the first, second, and third LED sub-units to a respective one of the electrode pads, in which the first LED sub-unit, the second LED sub-unit, and the third LED sub-unit are configured to be independently driven, light generated from the first LED sub-unit is configured to be emitted to the outside of the display apparatus by passing through the second LED sub-unit and the third LED sub-unit, and light generated from the second LED sub-unit is configured to be emitted to the outside of the display apparatus by passing through the third LED sub-unit.

公开(公告)号：US20220094124A1

公开(公告)日：2022-03-24

申请号：US17544443

申请日：2021-12-07

申请人： Transportation IP Holdings, LLC

发明人： Henry Todd Young ,  Alvaro Jorge Mari Curbelo ,  Jason Daniel Kuttenkuler ,  Tiziana Bertoncelli ,  Sean Patrick Cillessen

IPC分类号： H01R25/16 ,  H02M7/00 ,  H02G5/00 ,  H02M3/155 ,  H05K7/20 ,  H01L23/46 ,  H01L23/492 ,  H01L23/00 ,  H01L25/11 ,  H01R43/16

摘要： A bus bar includes a load terminal connector comprising a conductive plate that extends from a first edge to an opposite second edge and extends from a third edge to an opposite fourth edge. The third and fourth edges extend from the first edge to the second edge. The plate includes a window opening located between the first and second edges and between the third and fourth edges. The plate also includes a slot extending into the plate from the first edge to the window opening. The plate includes first and second sets of openings configured to receive connections with first and second power terminals of switch packages. The first set of openings and the second set of openings are located on opposite sides of the slot.

公开(公告)号：US11282791B2

公开(公告)日：2022-03-22

申请号：US16454086

申请日：2019-06-27

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Po-Yuan Teng ,  Hung-Yi Kuo ,  Hao-Yi Tsai ,  Tin-Hao Kuo ,  Yu-Chia Lai ,  Shih-Wei Chen

IPC分类号： H01L23/538 ,  H01L23/31 ,  H01L23/473 ,  H01L23/36 ,  H01L25/11 ,  H01L25/07 ,  H01L25/065 ,  H01L21/56 ,  H01L21/48 ,  H01L25/075 ,  H01L23/367

摘要： A semiconductor device includes a first chip package, a heat dissipation structure and an adapter. The first chip package includes a semiconductor die laterally encapsulated by an insulating encapsulant, the semiconductor die has an active surface and a back surface opposite to the active surface. The heat dissipation structure is connected to the chip package. The adapter is disposed over the first chip package and electrically connected to the semiconductor die.

公开(公告)号：US11244982B2

公开(公告)日：2022-02-08

申请号：US16899522

申请日：2020-06-11

申请人： SEOUL VIOSYS CO., LTD.

发明人： Jong Hyeon Chae ,  Seong Gyu Jang ,  Ho Joon Lee ,  Chang Yeon Kim ,  Chung Hoon Lee

IPC分类号： H01L27/15 ,  H01L27/32 ,  H01L25/07 ,  H01L25/13 ,  H01L33/00 ,  H01L33/10 ,  H01L33/40 ,  H01L33/42 ,  H01L33/50 ,  H01L33/62 ,  H01L33/38 ,  H01L25/075 ,  H01L25/065 ,  H01L25/11

摘要： A display apparatus including a thin film transistor (TFT) substrate, a first LED sub-unit disposed on the TFT substrate, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, electrode pads disposed between the TFT substrate and the first LED sub-unit, and connectors connecting the first, second, and third LED sub-units to a respective one of the electrode pads, in which the first LED sub-unit, the second LED sub-unit, and the third LED sub-unit are configured to be independently driven, light generated from the first LED sub-unit is configured to be emitted to the outside of the display apparatus by passing through the second LED sub-unit and the third LED sub-unit, and light generated from the second LED sub-unit is configured to be emitted to the outside of the display apparatus by passing through the third LED sub-unit.

公开(公告)号：US11239170B2

公开(公告)日：2022-02-01

申请号：US16305008

申请日：2016-12-02

申请人： SNAPTRACK, INC.

发明人： Andreas Franz ,  Jürgen Portmann ,  Claus Reitlinger ,  Stefan Kiefl ,  Oliver Freudenberg ,  Karl Weidner

IPC分类号： H01L23/538 ,  H01L23/31 ,  H01L23/373 ,  H01L23/49 ,  H01L23/66 ,  H01L25/10 ,  H01L25/16 ,  H01L25/11 ,  H01L25/065 ,  H01L25/07 ,  H01L23/00 ,  H01L25/00 ,  H01L23/552 ,  H01L23/498 ,  H01L21/56 ,  H01L23/367

摘要： The present invention relates to a module that has a lower component of a module (1) having a material (3) in which at least one first structural element (4) is embedded, and an upper component of a module (2) having a material (3) in which at least a second component (16) is embedded. The upper component of the module (2) and the lower component of the module (1) are stacked, with the lower and the upper component of the module (2) being electrically connected and mechanically linked to each other. In addition, the present invention relates to a simple and cost-effective process for the production of a variety of modules. The invention makes it possible for the modules to be miniaturized with respect to surface and height and/or makes it possible to achieve greater integration by 3D packaging.

公开(公告)号：US11222878B2

公开(公告)日：2022-01-11

申请号：US16851450

申请日：2020-04-17

申请人： AB Mikroelektronik Gesellschaft mit beschraenkter Haftung

发明人： Louis Costa

IPC分类号： H01L25/11 ,  H01L23/495 ,  H01L23/00 ,  H01L21/48 ,  H01L23/367 ,  H01L21/56

摘要： Electronic power modules are disclosed. In one example, an electronic power module includes a first aluminum substrate, a second aluminum substrate, and a third aluminum substrate arranged in a common plane. The electronic power module includes first gap separating the first aluminum substrate from the second aluminum substrate. The electronic power module includes a second gap separating the second aluminum substrate from the third aluminum substrate. The electronic power module includes a first semiconductor switching component electrically coupled to the first aluminum substrate and the second aluminum substrate. The electronic power module includes a second semiconductor switching component electrically coupled to the second aluminum substrate and the third aluminum substrate.