摘要:
A negative capacitance circuit is connected between a drain and a source of the mixer transistor. With this configuration, the negative capacitance circuit is connected in parallel to a parasitic capacitance generated between the drain and the source of the mixer transistor, and the parasitic capacitance can be canceled out in a wide band by the negative capacitance circuit connected in parallel.
摘要:
Certain aspects of the present disclosure provide an N-path filter implemented using a generalized impedance converter (GIC) circuit. The GIC circuit is configured such that the N-path filter has a desired frequency response, which may include a wide passband with steeper rejection than a conventional N-path filter with only a single pole in each filter path. Certain aspects of the present disclosure provide an N-path filter having a frequency response with multiple concurrent passbands. In certain aspects, the N-path filter with multiple passbands is implemented using the GIC circuit. In other aspects, the N-path filter may include a bandpass response circuit where an inductance of the bandpass response circuit may be implemented using gyrators.
摘要:
Nanoscale efuses, antifuses, and planar coil inductors are disclosed. A copper damascene process can be used to make all of these circuit elements. A low-temperature copper etch process can be used to make the efuses and efuse-like inductors. The circuit elements can be designed and constructed in a modular fashion by linking a matrix of metal columns in different configurations and sizes. The number of metal columns, or the size of a dielectric mesh included in the circuit element, determines its electrical characteristics. Alternatively, the efuses and inductors can be formed from interstitial metal that is either deposited into a matrix of dielectric columns, or left behind after etching columnar openings in a block of metal. Arrays of metal columns also serve a second function as features that can improve polish uniformity in place of conventional dummy structures. Use of such modular arrays provides flexibility to integrated circuit designers.
摘要:
According to an aspect of the present invention, in a semiconductor device, a plurality of commands for specifying a circuit configuration of an analog front-end unit are transmitted from a processing unit to the analog front-end unit, an analysis is performed on the plurality of commands received by the analog front-end unit, and when a circuit configuration of the analog front-end unit which is to be updated and is determined according to the plurality of commands includes a forbidden condition that has been previously set, updating processing of the circuit configuration according to the plurality of commands is stopped.
摘要:
An apparatus comprises a first connector, a second connector, a detection circuit and a logic circuit. The first connector and the second connector are configured for electrical communication with first and second conducting terminals, respectively, of an audio jack plug. The detection circuit is configured to apply a first value of current to the first connector, and apply a second value of current to the second connector. The logic circuit is configured to generate an indication that the audio jack plug is fully inserted according to a logic level detected at the second connector when electrical ground is detected at the first connector.
摘要:
an electrical device that includes a first electrode and a second electrode that are separated from one another so as to form a gap structure. A layer of protective material spans the gap structure to contact the first electrode and the second electrode. A dimension of the gap structure, corresponding to a separation distance between the first electrode and the second electrode, is varied and includes a minimum separation distance that coincides with a critical path of the layer of protective material between the first electrode and the second electrode.
摘要:
A signal analysis control system is provided with a signal analyzing section for analyzing signals inputted to a transmission section and generating analysis information, and a signal control section for controlling signals inputted to a receiving section by using the analysis information.
摘要:
A process and apparatus for configuring one or more integrated circuits within a device in a manufacturing process is described. In an exemplary process, a device is manufactured by assembling a chip onto a board such as a printed circuit substrate and the chip is fused from power routed across the board to the chip. The power source for the fusing can be generated from the internal power supply on the board or received on a test point on the board itself or a connection interface (e.g. a USB interface) coupled to the board. In an exemplary apparatus, a device comprises a chip with a plurality of fuses that are used to configure the device and a board coupled to the chip, with the board capable of routing power from the board to the chip and the power is used to blow one or more of the plurality of fuses.
摘要:
A semiconductor integrated circuit comprises a logic circuit unit, a signal control unit, a first signal selecting unit to a third signal selecting unit, and a first element electrode to a fourth element electrode. A part of signal lines of the logic circuit unit is connectable to different element electrodes, in accordance with the operating state of the logic circuit unit. The signal control unit generates connection information related to the connection of the signal lines to the element electrodes, thereafter sending the connection information to an external LSI. The connection is made after a retaining period, during which the element electrode concerned is maintained at high impedance, thereby avoiding unexpected failure. According to the present structure, the number of element electrodes required by the semiconductor integrated circuit can be reduced.
摘要:
A circuit configuration for smoothing an input voltage includes two input terminals for receiving the input voltage. A negative-feedback amplifier has two inputs and an output. A capacitor is connected to one of the inputs of the amplifier. An output terminal is connected to the output of the amplifier. A converter element has a first terminal connected to one of the input terminals, a second terminal connected to the one input of the amplifier and to the capacitor, and a third terminal connected to the output of the amplifier.