公开(公告)号：US20210230354A1

公开(公告)日：2021-07-29

申请号：US17050929

申请日：2019-04-01

申请人： Hexion Inc.

发明人： Jimmy VAN RIJN ,  Nicole MEGGER ,  lris JOHANNSEN ,  Sven ElCHHOLZ

IPC分类号： C08G59/02 ,  B01D61/02 ,  C08G59/32 ,  B01D71/06 ,  B01D71/02 ,  B01D69/04

摘要： The invention describes a low temperature process for high performance epoxy resins purification via membrane separation technology. Continuous or semi-continuous low temperature processing grants a minimized material aging during product purification as for example glycidyl amine based resins.

公开(公告)号：US11066564B2

公开(公告)日：2021-07-20

申请号：US16341817

申请日：2017-10-13

申请人： KAO CORPORATION

发明人： Yusuke Shimizu ,  Koji Azuma ,  Hirokazu Hyakuda ,  Tetsuya Eguchi ,  Hiroki Kawaguchi

IPC分类号： C09D11/322 ,  C08F212/08 ,  C08F218/04 ,  C08F220/18 ,  C08G59/32 ,  C08J3/24 ,  C09D11/326 ,  C09D17/00 ,  C08F220/06

摘要： The present invention relates to a water-based pigment dispersion containing a polymer dispersant and a pigment, the polymer dispersant being prepared by crosslinking a carboxy group-containing water-insoluble polymer (A) with a water-insoluble polyfunctional epoxy compound, in which carboxy groups of the water-insoluble polymer (A) are at least partially neutralized by an alkali metal compound, and the water-based pigment dispersion satisfies the following conditions 1 to 3. The water-based pigment dispersion of the present invention can exhibit excellent redispersibility capable of suppressing solidification of the pigment or the polymer in ink ejection nozzles and can ensure good storage stability under high-temperature conditions. The conditions 1 to 3 are as follows: Condition 1: a value calculated according to the formula: {[100−(neutralization degree)−(crosslinking degree)]/100}×[acid value of water-insoluble polymer (A)] is from −30 to 30 mgKOH/g: Condition 2: a value calculated according to the formula: [(neutralization degree)/100]×[acid value of water-insoluble polymer (A)] is from 80 to 180 mgKOH/g; and Condition 3: a value calculated according to the formula: [(crosslinking degree)/100]×[acid value of water-insoluble polymer (A)] is from 80 to 180 mgKOH/g.

公开(公告)号：US11029497B2

公开(公告)日：2021-06-08

申请号：US16001223

申请日：2018-06-06

申请人： DAICEL CORPORATION

发明人： Takashi Kubo ,  Hiroki Takenaka

IPC分类号： G02B13/00 ,  C08G59/24 ,  C08G59/32 ,  C08G59/22 ,  C08G59/02 ,  C08G59/30 ,  G02B1/04 ,  B29D11/00 ,  B29C39/02 ,  B29K63/00 ,  B29K83/00

摘要： An object of the present invention is to provide a curable composition that can be cured satisfactorily and can form a cured product having a high glass transition temperature as maintained and having high mechanical strength. A curable composition includes a siloxane (A), a cycloaliphatic epoxide (B), and a curing agent (C). The siloxane (A) contains at least two epoxy groups per molecule. The cycloaliphatic epoxide (B) in the curable composition is preferably a compound represented by Formula (I): wherein X is selected from a single bond and a linkage group.

公开(公告)号：US11028269B2

公开(公告)日：2021-06-08

申请号：US15971019

申请日：2018-05-04

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： Norifumi Kawamura ,  Shoichi Osada ,  Kohei Otake

IPC分类号： C08L83/06 ,  H01L33/56 ,  H01L23/29 ,  C08L83/10 ,  C08K5/00 ,  C08G59/14 ,  C08G59/40 ,  C08G59/32 ,  C08G59/62 ,  C08G59/30 ,  C08G77/42 ,  C08G77/00 ,  C08G77/14 ,  C08G77/38 ,  C08G77/388

摘要： The invention provides a resin composition comprising a specific silicone-modified epoxy resin, a specific silicone-modified phenolic resin, black pigment, and an inorganic filler. The invention also provides a resin composition comprising a specific cyanate ester compound, a specific silicone-modified epoxy resin, and a specific phenol compound and/or silicone-modified phenolic resin.

公开(公告)号：US20210130535A1

公开(公告)日：2021-05-06

申请号：US16492298

申请日：2018-06-26

申请人： 3M INNOVATIVE PROPERTIES COMPANY

发明人： Lianzhou Chen ,  Michael S. Newman

IPC分类号： C08G59/32 ,  C08G59/50

摘要： Provided are curable compositions including a base part comprising an amine-reactive curable resin and a curative part comprising a polymeric toughener dissolved in an amine. The polymeric toughener, optionally a rubbery polymer or thermoplastic polymer, is solid at ambient conditions with a weight average molecular weight of at least 5,000 g/mol while the amine is a liquid at ambient conditions. The curable composition is cured by mixing the base and curative parts with each other. Hardened compositions obtained thereof can achieve increased toughener loading, resulting in high peel and shear strength performance over a wide range of temperatures, including at temperatures exceeding 180° F. (82° C.).

公开(公告)号：US10968308B2

公开(公告)日：2021-04-06

申请号：US16181351

申请日：2018-11-06

申请人： KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY

发明人： Hyun Aee Chun ,  Yun Ju Kim ,  Sook Yeon Park ,  Su Jin Park

IPC分类号： C07C29/10 ,  C07C269/02 ,  C07D303/48 ,  C07D407/14 ,  C08G18/58 ,  C07F7/18 ,  C08G18/18 ,  C08G59/14 ,  C09J163/00 ,  C08G59/32 ,  C08G18/20 ,  C08G18/71

摘要： Provided are a preparation method of an epoxy compound having an alkoxysilyl group in which an increase in the epoxy equivalent weight (EEW) of the epoxy compound is minimized because alkoxysilylation occurs through a simple one-step reaction using a hydroxyl group formed during the synthesis of the epoxy compound, an epoxy compound having an alkoxysilyl group prepared by the method, a composition comprising the same, and a use thereof. The method includes the reaction of an epoxy compound having a hydroxyl group with an isocyanate alkoxysilane in the presence of amine-based base catalyst, wherein the epoxy compound having an alkoxysilyl group has a mole ratio of [epoxide group]:[alkoxysilyl group] of n:1 ranging from 2:1 to 10:1, and an EEW increase of the epoxy compound having an alkoxysilyl group is less than 260/n. The epoxy compound has good physical properties when being cured.

公开(公告)号：US20210087329A1

公开(公告)日：2021-03-25

申请号：US17052264

申请日：2019-10-07

申请人： TOYOBO CO., LTD.

发明人： Gota TAKIMOTO ,  Michihiko IRIE

IPC分类号： C08G59/24 ,  C08G59/32 ,  C08G59/40 ,  C08K3/22 ,  C08K3/38 ,  C08K7/18 ,  C08K5/353 ,  C09J163/00

摘要： The present invention aims to provide a resin composition which can form a cured product having a high adhesive property and a high thermal conductivity. A resin composition containing an epoxy compound (A), an amine curing agent (B) and a thermally conductive filler (C), wherein the epoxy compound (A) is in a liquid form and wherein the amine curing agent (B) contains a benzoxazole skeleton.

公开(公告)号：US20210047461A1

公开(公告)日：2021-02-18

申请号：US17041500

申请日：2019-03-29

申请人： Evonik Operations GmbH

发明人： Gauri Sankar Lal ,  Michael Cook ,  Gamini Ananda Vedage ,  Emmanouil Roumpelakis

IPC分类号： C08G59/50 ,  C08G59/32 ,  C09D163/00 ,  C09J163/00 ,  C07C215/50 ,  C07C213/00

摘要： The present invention relates to a new structural class of phenalkamines, curing agent compositions comprising the phenalkamines, their use, as well as and methods of producing such phenalkamines and compositions. The phenalkamines of the present invention can be prepared by reacting cardanol with an aldehyde compound and triaminononane. These curing-agent compositions may be used to cure, harden, and/or crosslink an epoxy resin. The curing-agent compositions of this invention are of low viscosity and can be used neat or dissolved in a minimum amount of an organic solvent or diluent to effect cure of epoxy resins.

公开(公告)号：US10815373B2

公开(公告)日：2020-10-27

申请号：US16256005

申请日：2019-01-24

申请人： CYTEC INDUSTRIES INC.

发明人： Vincent Aerts ,  Mark Bonneau ,  Judith Elder ,  Emiliano Frulloni ,  James Martin Griffin

IPC分类号： C08L63/00 ,  C08L77/02 ,  C08L77/06 ,  C08G59/32 ,  C08G59/40 ,  C08K5/00 ,  C08K5/41

摘要： A resin system containing: (i) a thermosetting resin precursor component comprising one or more multi-functional epoxy resin precursor(s) having a functionality of at least three, preferably wherein said precursor(s) are selected from a tri-functional epoxy resin precursor and/or a tetra-functional epoxy resin precursor; (ii) a thermoplastic polyamide particle component wherein the polyamide particles have a melting temperature TPA; and (iii) one or more curing agent(s), wherein the resin precursor component, the thermoplastic particle and the curing agent(s) are selected such that gelation of the epoxy matrix during the cure cycle of the resin system occurs at a gelation temperature TGEL which is at or below TPA.

公开(公告)号：US10793747B2

公开(公告)日：2020-10-06

申请号：US15647729

申请日：2017-07-12

申请人： SAMSUNG DISPLAY CO., LTD.

发明人： Young-Sang Park ,  Ah-Ram Lee ,  So-Yeon Han ,  In-Seo Kee ,  Chul-Ho Jeong ,  Tae-Hyeog Jung

IPC分类号： C09D183/06 ,  C08G59/32 ,  C08G59/20 ,  C08G59/22 ,  C08G65/22 ,  C08K5/00 ,  C08G77/14

摘要： A coating composition includes a siloxane oligomer including an epoxy group and acryl group, a cross-linker, a polymerization initiator and a solvent.