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公开(公告)号：US20210339495A1
公开(公告)日：2021-11-04
申请号：US17375452
申请日：2021-07-14
申请人： SWISS KRONO TEC AG
发明人： Peter DRÖGE
摘要： The disclosure relates to a wood material panel hot press for producing a wood material panel, wherein the wood material panel hot press has an inlet side and an outlet side, and is designed to press a blank supplied on the inlet side in order to form a wood material panel. According to the invention, a temperature measurement device is provided which is designed to automatically measure the temperature (T) of the wood material panel on the outlet side in a spatially resolved manner.
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公开(公告)号：US20210302341A1
公开(公告)日：2021-09-30
申请号：US16472147
申请日：2017-12-21
发明人： Yannick DE WILDE , Elodie PERROS , Valentina KRACHMALNICOFF , Rémi CARMINATI , Albert-Claude BOCCARA
摘要： An infrared-detecting device, includes an infrared detector configured to emit a signal representative of the thermal radiation of a hotspot, and a light source configured to emit an incident beam, preferably in a window of UV or visible wavelength. The infrared-detecting device furthermore comprises a synchronizing device connected to the light source and to the infrared detector or to the processing module, and configured to emit a synchronization signal, the infrared detector being configured to be activated in a preset time window depending on said synchronization signal.
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公开(公告)号：US11127612B2
公开(公告)日：2021-09-21
申请号：US15962648
申请日：2018-04-25
发明人： James D. Huffaker , Kim M. Hartnett , Ajay Raghunathan , Libo Wang , Linmiao Zhang , Di Wu
摘要： Several embodiments of the present technology are directed to semiconductor devices, and systems and associated methods for treating semiconductor devices based on warpage data. In some embodiments, a method can include heating a plurality of semiconductor devices from a first temperature to a second temperature, and determining warpage data at a plurality of points on the surfaces of the semiconductor devices as they are being heated. The method can further comprise applying a multivariate analysis to the surface warpage data to generate a multivariate statistic for each of the semiconductor devices at various sample temperatures. The multivariate statistics can be used to determine whether the semiconductor devices exceed or fall below a threshold limit.
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公开(公告)号：US11076113B2
公开(公告)日：2021-07-27
申请号：US14037989
申请日：2013-09-26
申请人： Rosemount Inc.
发明人： Jason Harold Rud
摘要： A diagnostic field device for identifying a diagnostic condition in an industrial process includes an infrared sensor array having a plurality of infrared sensors arranged to sense infrared emissions from a location in the industrial process. Processing circuitry processes outputs from the plurality of infrared sensors of the sensor array and generates an infrared image. Diagnostic circuitry compares processed outputs from at least two subsections of the infrared image and provides a diagnostic output based upon the comparison.
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公开(公告)号：US11072123B2
公开(公告)日：2021-07-27
申请号：US16077320
申请日：2017-01-18
发明人： Aja Hartman , Lihua Zhao
IPC分类号： B29C64/393 , B29C64/165 , B33Y30/00 , B33Y10/00 , G01N25/72 , B33Y50/02 , G01N21/00
摘要： In one example, an additive manufacturing process includes: making an object slice by slice, including dispensing a first quantity of each of multiple liquid functional agents on to a layer of fusable build material and then irradiating the layer of build material; while making the object, identifying a deviant region in a slice; and dispensing a second quantity different from the first quantity of at least one of the functional agents into a location corresponding to the deviant region.
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公开(公告)号：US11067522B2
公开(公告)日：2021-07-20
申请号：US16160376
申请日：2018-10-15
发明人： Jörg Vonderheiden
摘要： The present invention relates to a measurement system for use in a corrugating machine and a corrugating machine and a method of checking the process for producing paper adhesions with such a measurement system. The measurement system according to the invention for use in a corrugating machine comprises a measurement device. The measurement device can detect electromagnetic waves in the infrared range here and is aimed at a region of a transportation device of the corrugating machine in the direction of transportation downstream of an adhesion station of the corrugating machine.
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公开(公告)号：US20210190710A1
公开(公告)日：2021-06-24
申请号：US17267773
申请日：2019-09-10
申请人： FACC AG
发明人： Helmuth HOELLER
摘要： The invention relates to a method for producing a fiber-plastic composite reference body for simulating delamination for the nondestructive testing of FPC components, in particular aircraft components, comprising the following steps: i. producing a first insert by a. arranging a first FPC layer; b. forming a recess in the first FPC layer; c. procuring the first FPC layer, in order to obtain the first insert; ii. producing a second insert by a. arranging a second FPC layer; b. pre-curing the second FPC layer, in order to obtain the second insert; iii. providing at least one first FPC layer and at least one second FPC layer with a first clearance and a second clearance; iv. inserting the first insert and the second insert into the respective clearance of the corresponding FPC layer; v. curing the arrangement, a delamination being simulated at the recess of the first insert.
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公开(公告)号：US20210162508A1
公开(公告)日：2021-06-03
申请号：US16613543
申请日：2017-08-08
发明人： Ryuichi NARITA , Toshiya WATANABE , Akio KONDOU , Masashi KITAMURA , Hidetaka HARAGUCHI , Shuji TANIGAWA , Claus THOMY , Henry KOEHLER
IPC分类号： B22F12/90 , G01N25/18 , G01N25/72 , B22F10/28 , B22F10/36 , B33Y10/00 , B33Y30/00 , B33Y50/02
摘要： A forming defect detection system for a three-dimensional additive manufacturing device which performs additive molding by emitting a laser beam to a powder bed is provided. This system specifies a candidate position of a forming defect on the basis of a change amount of a local temperature measured in an irradiated part of a powder bed irradiated by a laser beam. The system calculates a cooling speed at the candidate position on the basis of a temperature distribution and determines whether a forming defect exists on the basis of the cooling speed.
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公开(公告)号：US10954002B2
公开(公告)日：2021-03-23
申请号：US15944353
申请日：2018-04-03
申请人： The Boeing Company
摘要： Methods for thermographic inspection of structures are disclosed. An example method includes positioning at least one of a heat source or a camera in a cavity defined by a first side of a structure of an aircraft and positioning the other one of the heat source or the camera at a second side of the structure opposite the first side; applying heat to the least one of the first side or the second side of the structure; measuring thermal energy emitted from the other one of the first side or the second side opposite the heat source; and identifying a defect or inclusion of the structure based on the measured thermal energy.
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公开(公告)号：US20210036384A1
公开(公告)日：2021-02-04
申请号：US16643298
申请日：2018-09-10
申请人： KONICA MINOLTA, INC.
IPC分类号： H01M10/42 , G01N3/40 , G01N23/041 , G01N25/72 , G01N27/83 , H01M10/0525
摘要： A non-destructive inspection method of inspecting an inspection target using multiple different types of non-destructive inspection means that include one non-destructive inspection means and at least one other non-destructive inspection means. The method includes determining a marking position on the inspection target in a detection result by the one non-destructive inspection means, causing a device to store the marking position, and fixedly forming a mark on the inspection target corresponding to the marking position. The mark is detectable by the other non-destructive inspection means. The method further includes causing the other non-destructive inspection means to inspect an inspection target including the mark. The method further includes contrasting detection results by the multiple different types of non-destructive inspection means in reference to the mark which is the marking position.
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