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公开(公告)号：US08167687B2
公开(公告)日：2012-05-01
申请号：US12309285
申请日：2007-05-24
CPC分类号： B24B41/068 , B24B7/228 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L2221/68318 , H01L2221/68327
摘要： A wafer can be thinned without occurrences of dimples. A support plate 1 has a number of through holes 10. A circuit forming surface of a wafer 2 is adhered to one surface of the support plate by an adhesive member 4, and a dimple prevention member 3 having a thickness of 100 μm or more and having an adhesive layer 30 on one face is adhered to the other surface, thus the openings at both ends of the through holes 10 are blocked. The support plate is vacuum adsorbed to a support table through the dimple prevention member, and a non circuit-forming face of the wafer is ground/polished to thin the wafer. The dimple prevention member is stripped off, and a solvent is penetrated into the adhesive member through the through holes to detach the wafer from the support plate.
摘要翻译： 晶片可以变薄而不发生凹坑。 支撑板1具有多个通孔10.晶片2的电路形成表面通过粘合构件4和厚度为100μm以上的凹坑防止构件3粘附到支撑板的一个表面，以及 在一个面上具有粘合剂层30粘附到另一个表面，因此通孔10的两端的开口被阻挡。 支撑板通过凹坑防止构件被真空吸附到支撑台上，并且将晶片的非电路形成面研磨/抛光以使晶片变薄。 剥去防止凹坑的构件，并且通过通孔将溶剂渗透到粘合构件中，以将晶片从支撑板上分离。
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公开(公告)号：US07972654B2
公开(公告)日：2011-07-05
申请号：US11937266
申请日：2007-11-08
申请人： Akihiko Nakamura
发明人： Akihiko Nakamura
CPC分类号： H01L21/31051 , H01L21/76819 , H01L21/76837
摘要： A planarizing coating method for filling a step between patterns formed on a board surface, includes the steps of: preparing at least two types of coating liquids different in non-volatile matter densities, first coating one of the coating liquids higher in density on the board surface, rotating the board so as to leave the one coating liquid inside the step and such that, at the same time, substantially none of the one coating liquid is left on a pattern crest of the patterns, subsequently coating another of the coating liquids lower in non-volatile matter density on the board surface, and rotating the board so that the coating liquid lower in density is left on a coating film comprising the one coating liquid higher in density and such that, at the same time, substantially none of the other coating liquid lower in density left on the pattern crest.
摘要翻译： 用于在板表面上形成的图案之间填充台阶的平面化涂布方法包括以下步骤：制备不同于不挥发物质密度的至少两种类型的涂布液，首先在板上涂覆更高密度的涂布液之一 表面，旋转板，以使步骤中的一个涂布液体留下，并且同时基本上没有一个涂布液体留在图案的图案峰上，随后再涂覆另一个涂布液体 在板表面上的非挥发性物质密度，并且旋转板，使得密度较低的涂布液留在包含一个密度较高的一个涂布液的涂膜上，并且同时基本上没有一个 其他涂层液体密度较低，留在图案峰上。
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33.发明授权公开(公告)号：US07919394B2
公开(公告)日：2011-04-05
申请号：US11517157
申请日：2006-09-07
CPC分类号： H01L21/78 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68363
摘要： A method for thinning a substrate and a method for manufacturing a circuit device which make it possible to prevent the pattern of penetrating holes of a supporting plate from being transferred to the surface of the substrate and prevent non-uniform grinding of the surface of the substrate from occurring. The supporting plate and the substrate are joined by using an adhesive layer, and a sheet is attached to the supporting plate. The surface of the supporting plate to which the sheet has been attached is mounted and fixed by attraction onto an attracting head. The surface of the semiconductor wafer on which no circuit device is formed is ground by a grinder in this state.
摘要翻译： 一种用于使基板变薄的方法和用于制造电路器件的方法，其可以防止支撑板的穿透图案被转移到基板的表面并防止基板表面的不均匀研磨 从发生。 支撑板和基板通过使用粘合剂层接合，并且片材附接到支撑板。 已经安装了片材的支撑板的表面通过吸引安装和固定到吸引头上。 在该状态下，通过研磨机研磨不形成电路器件的半导体晶片的表面。
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34.发明申请ADHESIVE COMPOSITION, FILM ADHESIVE, AND PROCESS FOR PRODUCTION OF THE COMPOSITION 审中-公开胶粘组合物，胶粘剂和组合物的生产方法公开(公告)号：US20100178497A1
公开(公告)日：2010-07-15
申请号：US12377155
申请日：2007-08-03
申请人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura , Koji Saito
发明人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura , Koji Saito
IPC分类号： C08F120/18 , B32B27/36 , B32B27/32
CPC分类号： C09J133/10 , C09J7/381 , C09J125/14 , C09J2425/00 , C09J2433/00 , Y10T428/2891
摘要： Disclosed is an adhesive composition which is mainly composed of a polymer obtained by copolymerizing a monomer composition containing styrene, (meth)acrylic acid ester having a cyclic structure and alkyl (meth)acrylate having a chain structure. The monomer composition may additionally contain a bifunctional monomer, thereby improving heat resistance, adhesive strength under high temperature conditions, and alkali resistance, and easiness in stripping of an adhesive composition that has been processed at a high temperature. Consequently, there can be obtained an adhesive composition which has high heat resistance, adhesion strength under high temperature conditions, and alkali resistance, and which can be easily stripped off after the adhesive composition is processed at a high temperature.
摘要翻译： 公开了主要由通过共聚包含苯乙烯的单体组合物，具有环状结构的（甲基）丙烯酸酯和具有链结构的（甲基）丙烯酸烷基酯）而得到的聚合物的粘合剂组合物。 单体组合物可以另外含有双官能单体，从而提高耐热性，高温条件下的粘合强度和耐碱性，以及在高温下处理的粘合剂组合物的剥离容易性。 因此，可以获得在高温条件下具有高耐热性，粘合强度和耐碱性的粘合剂组合物，并且在粘合剂组合物在高温下加工后可以容易地剥离。
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公开(公告)号：US20100069593A1
公开(公告)日：2010-03-18
申请号：US12516363
申请日：2007-09-27
IPC分类号： C08F18/02
CPC分类号： C09J133/04 , C09J7/381 , C09J125/14 , C09J135/06 , C09J2203/326 , C09J2205/114 , C09J2425/00 , C09J2433/00 , H01L21/6835 , H01L2221/6834 , H01L2924/30105 , Y10T428/2852 , Y10T428/2891
摘要： An adhesive composition of the present invention includes, as a main component, a polymer produced by copolymerization of a monomer composition including: styrene; a (meth)acrylic acid alkyl ester having a chain structure; a (meth)acrylic acid ester having an aliphatic ring; and a (meth)acrylic acid ester having an aromatic ring, wherein: the styrene is contained in a range of 40 to 69 parts by mass; the (meth)acrylic acid alkyl ester having the chain structure is contained in a range of 20 to 30 parts by mass; the (meth)acrylic acid ester having the aliphatic ring is contained in a range of 10 to 25 parts by mass; and the (meth)acrylic acid ester having the aromatic ring is contained in a range of 1 to 5 parts by mass, where the total amount of the above components is 100 parts by mass. This allows for provision of an adhesive composition having high adhesive strength under high-temperature environment, as well as high heat resistance, high alkali resistance, and easiness in stripping from semiconductor wafers and the like even after high-temperature processing.
摘要翻译： 作为主要成分，本发明的粘合剂组合物包含通过使包含苯乙烯的单体组合物共聚而制造的聚合物， 具有链结构的（甲基）丙烯酸烷基酯; 具有脂肪族环的（甲基）丙烯酸酯; 和具有芳香环的（甲基）丙烯酸酯，其中：所述苯乙烯的含量为40〜69质量份; 具有链结构的（甲基）丙烯酸烷基酯的含量为20〜30质量份; 具有脂肪族环的（甲基）丙烯酸酯的含量为10〜25质量份; 具有芳环的（甲基）丙烯酸酯的含量为1〜5质量份，上述成分的总量为100质量份。 这允许在高温环境下提供具有高粘合强度的粘合剂组合物，以及即使在高温处理之后也具有高耐热性，高耐碱性和从半导体晶片等剥离的容易性。
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公开(公告)号：USD552565S1
公开(公告)日：2007-10-09
申请号：US29255502
申请日：2006-03-08
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公开(公告)号：US07166184B2
公开(公告)日：2007-01-23
申请号：US10778947
申请日：2004-02-16
申请人： Akihiko Nakamura , Taiichiro Aoki , Seiji Ohishi , Tamotsu Sasaki
发明人： Akihiko Nakamura , Taiichiro Aoki , Seiji Ohishi , Tamotsu Sasaki
CPC分类号： G03F7/3021 , Y10S134/902
摘要： A multi-stage type processing apparatus which can be positioned in a limited space without having a complicated driving mechanism, includes processing units which are stacked in a multi-stage state in the vertical direction. Each processing unit has a cup surrounding a substrate and a chuck for retaining and rotating a substrate, and the cup can be elevated and lowered with respect to the chuck. A cylinder unit is contracted and thereby all the cups are unitarily lowered, so that the top surface of the chuck is located in a slightly upper position with respect to the top surface of the cup. In this state, a substrate is mounted on the chuck and attracted. Next, the cylinder unit is extended and thereby all the cups are unitarily elevated so as to accommodate the substrate therein. In this state, developing liquid is dropped from a nozzle for developing liquid onto the center of the substrate, and a motor is driven to rotate the chuck (the substrate) via a drive shaft and a timing belt to allow the developing liquid to cover the entire surface of the substrate.
摘要翻译： 可以定位在有限空间中而不具有复杂驱动机构的多级型处理装置包括在垂直方向上以多级状态堆叠的处理单元。 每个处理单元具有围绕基板的杯和用于保持和旋转基底的卡盘，并且杯可以相对于卡盘升高和降低。 气缸单元收缩，从而所有的杯子一体地降低，使得卡盘的顶表面相对于杯的顶表面位于较高的位置。 在这种状态下，将基板安装在卡盘上并被吸引。 接下来，气缸单元延伸，从而所有的杯子一体地升高，以便容纳衬底。 在这种状态下，显影液从用于显影液的喷嘴滴落到基板的中心，驱动马达驱动以通过驱动轴和同步皮带旋转卡盘（基板），以使显影液覆盖 基片的整个表面。
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公开(公告)号：US06903638B2
公开(公告)日：2005-06-07
申请号：US10936581
申请日：2004-09-09
申请人： Akihiko Nakamura , Shigemitsu Aoki , Hirofumi Saso
发明人： Akihiko Nakamura , Shigemitsu Aoki , Hirofumi Saso
IPC分类号： H01H50/02 , H01H45/00 , H01H45/02 , H01H50/04 , H01H51/20 , H01H67/00 , H01H13/02 , H01H51/22
CPC分类号： H01H50/042 , H01H50/023 , H01H50/026 , H01H2050/044 , H01H2050/049
摘要： A complex electromagnetic relay including a plurality of relay structures configured respectively as relays independent of each other, each relay structure including an electromagnet assembly and a contact section acting to open or close in accordance with an operation of the electromagnet assembly; and a housing accommodating the relay structures in a mutually inverted orientation with contact sections of the relay structures being located alternately at opposing sides. The electromagnet assemblies in the relay structures are provided individually with bobbins supporting coils. The housing includes an enclosing wall enclosing the relay structures in an envelope-like manner and a partition wall arranged between the relay structures disposed side-by-side to separate the relay structures from each other. The bobbins of the electromagnet assemblies are fixedly attached to the enclosing wall as well as to the partition wall.
摘要翻译： 一种复杂的电磁继电器，包括分别独立地构成的继电器的多个继电器结构，每个继电器结构包括电磁体组件和根据电磁体组件的操作而打开或闭合的接触部分; 以及壳体，其以相反方向容纳所述继电器结构，其中所述继电器结构的接触部分交替地位于相对侧。 继电器结构中的电磁体组件单独设置有支撑线圈的线轴。 壳体包括围绕中继结构以封闭状包围的封闭壁和布置在并排设置的中继结构之间以将中继结构彼此分离的分隔壁。 电磁铁组件的线轴固定地附接到封闭壁以及分隔壁。
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公开(公告)号：US20050083174A1
公开(公告)日：2005-04-21
申请号：US10498381
申请日：2002-12-06
CPC分类号： G07C9/00007 , B60R25/246 , E05B81/77 , E05B81/78 , G01S13/56 , G07C9/00309 , G07C2009/00396 , G07C2209/64 , G07C2209/65
摘要： A sensor for detecting a specific object (such as a hand) excellent in operation reliability and response, further excellent in mountability (dominance such as in size. and design) on a vehicle, and much less in power consumption than conventional impulse radars. The object sensor comprises detecting wave transmitting means and reflected wave receiving means of an impulse radar and a judging circuit part (40) for turning on the detection output when the amplitude level of a signal component, in a frequency range corresponding to the moving speed range of a specific object, of a signal received by the reflected wave receiving means lies in a predetermined range corresponding to the reflection characteristics of the specific object.
摘要翻译： 用于检测操作可靠性和响应性优异的特定物体（例如手）的传感器，在车辆上的安装性（诸如尺寸和设计的优势）以及比传统脉冲雷达更少的功率消耗更加优异。 物体传感器包括检测波长发射装置和脉冲雷达的反射波接收装置和判断电路部分（40），用于当在与移动速度范围相对应的频率范围内的信号分量的幅度电平时接通检测输出 由反射波接收装置接收的信号的特定物体位于与特定物体的反射特性对应的预定范围内。
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公开(公告)号：USD494080S1
公开(公告)日：2004-08-10
申请号：US29181211
申请日：2003-05-08
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