公开(公告)号：US07166184B2

公开(公告)日：2007-01-23

申请号：US10778947

申请日：2004-02-16

申请人： Akihiko Nakamura ,  Taiichiro Aoki ,  Seiji Ohishi ,  Tamotsu Sasaki

发明人： Akihiko Nakamura ,  Taiichiro Aoki ,  Seiji Ohishi ,  Tamotsu Sasaki

IPC分类号： G03B27/32 ,  H01L21/68

CPC分类号： G03F7/3021 ,  Y10S134/902

摘要： A multi-stage type processing apparatus which can be positioned in a limited space without having a complicated driving mechanism, includes processing units which are stacked in a multi-stage state in the vertical direction. Each processing unit has a cup surrounding a substrate and a chuck for retaining and rotating a substrate, and the cup can be elevated and lowered with respect to the chuck. A cylinder unit is contracted and thereby all the cups are unitarily lowered, so that the top surface of the chuck is located in a slightly upper position with respect to the top surface of the cup. In this state, a substrate is mounted on the chuck and attracted. Next, the cylinder unit is extended and thereby all the cups are unitarily elevated so as to accommodate the substrate therein. In this state, developing liquid is dropped from a nozzle for developing liquid onto the center of the substrate, and a motor is driven to rotate the chuck (the substrate) via a drive shaft and a timing belt to allow the developing liquid to cover the entire surface of the substrate.

摘要翻译： 可以定位在有限空间中而不具有复杂驱动机构的多级型处理装置包括在垂直方向上以多级状态堆叠的处理单元。 每个处理单元具有围绕基板的杯和用于保持和旋转基底的卡盘，并且杯可以相对于卡盘升高和降低。 气缸单元收缩，从而所有的杯子一体地降低，使得卡盘的顶表面相对于杯的顶表面位于较高的位置。 在这种状态下，将基板安装在卡盘上并被吸引。 接下来，气缸单元延伸，从而所有的杯子一体地升高，以便容纳衬底。 在这种状态下，显影液从用于显影液的喷嘴滴落到基板的中心，驱动马达驱动以通过驱动轴和同步皮带旋转卡盘（基板），以使显影液覆盖 基片的整个表面。

公开(公告)号：US07005009B2

公开(公告)日：2006-02-28

申请号：US10308964

申请日：2002-12-03

申请人： Taiichiro Aoki ,  Seiji Ohishi ,  Hiroshi Yamabe ,  Hitoshi Obata

发明人： Taiichiro Aoki ,  Seiji Ohishi ,  Hiroshi Yamabe ,  Hitoshi Obata

IPC分类号： B05C13/00

CPC分类号： H01L21/67346 ,  B05C5/0279 ,  H01L21/67046 ,  H01L21/67051

摘要： The object of the present invention is to provide an apparatus suitable for forming a thick film having a thickness on a surface of a substrate such as a glass substrate, a semiconductor wafer or the like. In the apparatus according to the present invention, a stock station for a substrate and a treatment station for a substrate are adjacent to each other, portions for coating, film-forming, cleaning and drying are provided in the treatment station, a tray having a concave portion for accommodating a substrate defined on the surface thereof is provided, and a transfer device circulates the tray around the portions for coating, film-forming, cleaning and drying.

公开(公告)号：US08449945B2

公开(公告)日：2013-05-28

申请号：US13364739

申请日：2012-02-02

申请人： Seiji Ohishi ,  Akihiko Nakamura

发明人： Seiji Ohishi ,  Akihiko Nakamura

IPC分类号： B05D3/12

CPC分类号： H01L21/6715 ,  B05D1/002 ,  B05D1/42 ,  Y10S134/902

摘要： A coating method, which uses a coating apparatus including a rotatable tray having a recessed portion for accommodating a substrate and rotatable together with the substrate, a nozzle for supplying a coating liquid, and an applicator for spreading the coating liquid, includes the steps of placing a substrate into the recessed portion of the tray, positioning the nozzle over a non-recessed portion of the upper surface of the tray, supplying a coating liquid from the nozzle, and forming a coating liquid pool only on the non-recessed portion of the upper surface of the tray, moving the applicator in a horizontal direction while maintaining a certain distance with respect to the upper surface of the substrate for spreading the coating liquid of the coating liquid pool over the entire upper surface of the substrate, and releasing the substrate from the recessed portion of the tray.

摘要翻译： 一种涂布方法，其使用包括可旋转托盘的涂布装置，该托盘具有用于容纳基材的凹部并与基底一起旋转的涂布装置，用于供给涂布液的喷嘴和用于涂布涂布液的涂布器的步骤包括以下步骤： 基板进入托盘的凹部，将喷嘴定位在托盘的上表面的非凹部上，从喷嘴供给涂布液，并且仅在所述托盘的非凹部上形成涂布液池 托盘的上表面，沿着水平方向移动施加器，同时相对于基板的上表面保持一定距离，以将涂液池的涂布液涂覆在基板的整个上表面上，并释放基板 从托盘的凹陷部分。

公开(公告)号：US20060115992A1

公开(公告)日：2006-06-01

申请号：US11288991

申请日：2005-11-29

申请人： Seiji Ohishi ,  Akihiko Nakamura

发明人： Seiji Ohishi ,  Akihiko Nakamura

IPC分类号： H01L21/31 ,  B05D3/12 ,  H01L21/469

CPC分类号： H01L21/6715 ,  B05D1/002 ,  B05D1/42 ,  Y10S134/902

摘要： A coating apparatus is provided in which a coating liquid supplied onto a surface of a substrate such as a semiconductor wafer and a glass substrate can be easily leveled so as to have a uniform thickness without any edge bead. The coating apparatus comprises a tray, a nozzle for supplying a coating liquid, and a squeegee which serves as an applicator for spreading a coating liquid. The tray has a recessed portion into which a substrate is placed, and a spinner chuck is provided in the recessed portion. In the spinner chuck, a chuck for attracting the substrate is attached to the upper end of a spinner shaft which can be lifted and lowered, and the upper surface of the chuck and the bottom surface of the recessed portion are arranged to be in the same plane in a state where the spinner shaft is lowered to the lowest position.

公开(公告)号：US08132526B2

公开(公告)日：2012-03-13

申请号：US12584103

申请日：2009-08-31

申请人： Seiji Ohishi ,  Akihiko Nakamura

发明人： Seiji Ohishi ,  Akihiko Nakamura

IPC分类号： B05C5/02

CPC分类号： H01L21/6715 ,  B05D1/002 ,  B05D1/42 ,  Y10S134/902

摘要： A coating apparatus comprises a tray, a nozzle for supplying a coating liquid, and a squeegee which serves as an applicator for spreading a coating liquid. The tray has a recessed portion into which a substrate is placed, and a spinner chuck is provided in the recessed portion. In the spinner chuck, a chuck for attracting the substrate is attached to the upper end of a spinner shaft which can be lifted and lowered, and the upper surface of the chuck and the bottom surface of the recessed portion are arranged to be in the same plane in a state where the spinner shaft is lowered to the lowest position. The nozzle is positioned above a non-recessed portion of the tray and supplies a coating liquid only onto a non-recessed portion of the upper surface of the tray to form a coating liquid pool, and the applicator is relatively movable in a horizontal direction in a state of maintaining a certain distance with respect to the upper surface of the substrate accommodated into the recessed portion and spreads the coating liquid of the coating liquid pool from the non-recessed portion of the upper surface of the tray over the entire upper surface of the substrate.

摘要翻译： 涂布装置包括托盘，用于供给涂布液的喷嘴和用作涂布液的涂布器的刮板。 托盘具有凹部，基底被放置在该凹部中，并且在凹部中设置旋转卡盘。 在旋转卡盘中，用于吸引基板的卡盘安装在可以升降的旋转轴的上端，并且卡盘的上表面和凹部的底面布置成相同 在旋转轴下降到最低位置的状态下。 喷嘴位于托盘的非凹陷部分的上方，并将涂布液仅提供到托盘上表面的非凹槽部分上以形成涂液池，并且涂布器可在水平方向上相对移动 相对于容纳在凹部中的基板的上表面保持一定距离的状态，并且将涂布液的涂布液从托盘的上表面的非凹部扩展到整个上表面的整个上表面 底物。

公开(公告)号：US20100009084A1

公开(公告)日：2010-01-14

申请号：US12584103

申请日：2009-08-31

申请人： Seiji Ohishi ,  Akihiko Nakamura

发明人： Seiji Ohishi ,  Akihiko Nakamura

IPC分类号： B05D1/40 ,  B05C11/02

CPC分类号： H01L21/6715 ,  B05D1/002 ,  B05D1/42 ,  Y10S134/902

摘要： A coating apparatus comprises a tray, a nozzle for supplying a coating liquid, and a squeegee which serves as an applicator for spreading a coating liquid. The tray has a recessed portion into which a substrate is placed, and a spinner chuck is provided in the recessed portion. In the spinner chuck, a chuck for attracting the substrate is attached to the upper end of a spinner shaft which can be lifted and lowered, and the upper surface of the chuck and the bottom surface of the recessed portion are arranged to be in the same plane in a state where the spinner shaft is lowered to the lowest position. The nozzle is positioned above a non-recessed portion of the tray and supplies a coating liquid only onto a non-recessed portion of the upper surface of the tray to form a coating liquid pool, and the applicator is relatively movable in a horizontal direction in a state of maintaining a certain distance with respect to the upper surface of the substrate accommodated into the recessed portion and spreads the coating liquid of the coating liquid pool from the non-recessed portion of the upper surface of the tray over the entire upper surface of the substrate.

摘要翻译： 涂布装置包括托盘，用于供给涂布液的喷嘴和用作涂布液的涂布器的刮板。 托盘具有凹部，基底被放置在该凹部中，并且在凹部中设置旋转卡盘。 在旋转卡盘中，用于吸引基板的卡盘安装在可以升降的旋转轴的上端，并且卡盘的上表面和凹部的底面布置成相同 在旋转轴下降到最低位置的状态下。 喷嘴位于托盘的非凹陷部分的上方，并将涂布液仅提供到托盘上表面的非凹槽部分上以形成涂液池，并且涂布器可在水平方向上相对移动 相对于容纳在凹部中的基板的上表面保持一定距离的状态，并且将涂布液的涂布液从托盘的上表面的非凹部扩展到整个上表面的整个上表面 底物。

公开(公告)号：US07611581B2

公开(公告)日：2009-11-03

申请号：US11288991

申请日：2005-11-29

申请人： Seiji Ohishi ,  Akihiko Nakamura

发明人： Seiji Ohishi ,  Akihiko Nakamura

IPC分类号： B05C5/02

CPC分类号： H01L21/6715 ,  B05D1/002 ,  B05D1/42 ,  Y10S134/902

摘要： A coating apparatus is provided in which a coating liquid supplied onto a surface of a substrate such as a semiconductor wafer and a glass substrate can be easily leveled so as to have a uniform thickness without any edge bead. The coating apparatus comprises a tray, a nozzle for supplying a coating liquid, and a squeegee which serves as an applicator for spreading a coating liquid. The tray has a recessed portion into which a substrate is placed, and a spinner chuck is provided in the recessed portion. In the spinner chuck, a chuck for attracting the substrate is attached to the upper end of a spinner shaft which can be lifted and lowered, and the upper surface of the chuck and the bottom surface of the recessed portion are arranged to be in the same plane in a state where the spinner shaft is lowered to the lowest position.

摘要翻译： 提供一种涂布装置，其中供应到诸如半导体晶片和玻璃基板的基板的表面上的涂布液可以容易地平整，以便具有均匀的厚度而没有任何边缘珠。 涂布装置包括托盘，用于供给涂布液的喷嘴和用作涂布液的涂布器的刮板。 托盘具有凹部，基底被放置在该凹部中，并且在凹部中设置旋转卡盘。 在旋转卡盘中，用于吸引基板的卡盘安装在可以升降的旋转轴的上端，并且卡盘的上表面和凹部的底面布置成相同 在旋转轴下降到最低位置的状态下。