Nonvolatile memory devices and method of manufacturing the same
    31.
    发明申请
    Nonvolatile memory devices and method of manufacturing the same 有权
    非易失性存储器件及其制造方法

    公开(公告)号:US20080185568A1

    公开(公告)日:2008-08-07

    申请号:US12010921

    申请日:2008-01-31

    CPC classification number: H01L27/24 G11C13/0004 G11C2213/79

    Abstract: Example embodiments provide a nonvolatile memory device using resistive elements. The nonvolatile memory device may include a semiconductor substrate, a plurality of variable resistance patterns on the semiconductor substrate, and a plurality of heat sink patterns that are level with the variable resistance patterns and coupled to a ground voltage.

    Abstract translation: 示例性实施例提供了使用电阻元件的非易失性存储器件。 非易失性存储器件可以包括半导体衬底,半导体衬底上的多个可变电阻图案以及与可变电阻图案相平行并耦合到接地电压的多个散热器图案。

    Method of fabricating nonvolatile memory device
    32.
    发明申请
    Method of fabricating nonvolatile memory device 失效
    制造非易失性存储器件的方法

    公开(公告)号:US20070048924A1

    公开(公告)日:2007-03-01

    申请号:US11505355

    申请日:2006-08-17

    CPC classification number: H01L27/115 H01L27/11521

    Abstract: A method of fabricating nonvolatile memory devices may involve forming separate floating gates on a semiconductor substrate, forming control gates on the semiconductor substrate, conformally forming a buffer film on a surface of the semiconductor substrate, injecting ions into the semiconductor substrate between the pairs of the floating gates to form a common source region partially overlapping each floating gate of the respective pair of the floating gates, depositing an insulating film on the buffer film, etching the buffer film and the insulating film at side walls of the floating gates and the control gates to form spacers at the side walls of the floating gates and the control gates, and forming a drain region in the semiconductor substrate at a side of the control gate other than a side of the control gate where the common source region is formed.

    Abstract translation: 制造非易失性存储器件的方法可以包括在半导体衬底上形成分离的浮置栅极,在半导体衬底上形成控制栅极,在半导体衬底的表面上保形地形成缓冲膜,将离子注入半导体衬底 浮置栅极,形成与各对浮置栅极的每个浮置栅极部分重叠的共同源极区域,在缓冲膜上沉积绝缘膜,在浮置栅极和控制栅极的侧壁处蚀刻缓冲膜和绝缘膜 在浮置栅极和控制栅极的侧壁处形成间隔物,并且在除了形成公共源极区域的控制栅极的一侧之外的控制栅极的一侧的半导体衬底中形成漏极区域。

    Flash memory device having a split gate and method of manufacturing the same
    33.
    发明授权
    Flash memory device having a split gate and method of manufacturing the same 有权
    具有分裂栅的闪存器件及其制造方法

    公开(公告)号:US07094646B2

    公开(公告)日:2006-08-22

    申请号:US11119801

    申请日:2005-05-03

    CPC classification number: H01L29/7881 H01L27/115 H01L27/11521 H01L29/42324

    Abstract: A flash memory device having a split gate that can prevent an active region and a floating gate electrode from being misaligned, and a method of manufacturing the same, includes sequentially stacking a gate oxide layer and a floating gate conductive layer on a semiconductor substrate, forming an isolation layer in a predetermined region of the semiconductor substrate where the floating gate conductive layer is formed, and defining an active region. Then, a local oxide layer is formed by oxidizing a predetermined part of the floating gate conductive layer on the active region. A floating gate electrode structure is formed by patterning the floating gate conductive layer using the local oxide layer.

    Abstract translation: 具有能够防止有源区域和浮栅电极不对准的分离栅极的闪存器件及其制造方法包括在半导体衬底上依次层叠栅极氧化物层和浮置栅极导电层,形成 在形成有浮栅导电层的半导体衬底的预定区域中形成隔离层,并限定有源区。 然后,通过在活性区域上氧化浮栅导电层的预定部分来形成局部氧化层。 通过使用局部氧化物层图案化浮栅导电层来形成浮栅电极结构。

Patent Agency Ranking