摘要:
A method for measuring temperature on a silicon device includes activating a heat source on the silicon device. A value of a parameter of an electronic component on the silicon device is measured. A temperature associated with the electronic component is determined from the value of the parameter.
摘要:
A multi-segment parallel wire capacitor includes substantially identical multiple capacitor segments fabricated on a semiconductor substrate. Each segment comprises at least first and second interleaved metal finger formed in a first metal layer above the substrate and third and fourth interleaved metal fingers formed in a second metal layer. The first and fourth sets are connected together to form one plate of the capacitor and the second and third sets are connected to form a second plate. The multiple capacitor segments are arranged in a matrix having M rows and N columns. The multiple capacitor segments are inter-connected in such a manner that the capacitor segments in each column of the matrix are connected in parallel. First and second metal lines selectively connect the plates of the different capacitor segments in the first and last rows and serve as the two opposite terminals of the multi-segment parallel wire capacitor.
摘要:
The present invention is an ESD protection circuit that discharges both positive and negative electrostatic events. A preferred embodiment of the circuit comprises a first NMOS transistor having a source and drain connected between ground and an I/O pad and second and third NMOS transistors and a resistor connected in series between ground and the I/O pad. The gate and body of the first transistor and the bodies of the second and third transistors are connected to a node between the second and third transistors; the gate of the second transistor is connected to the I/O pad through a second resistor; and the gate of the third transistor is connected to ground. The second and third transistors maintain the gate and body voltage of the first transistor at the pad voltage when the pad experiences negative voltages and at ground voltage when the pad experiences positive voltages. As a result, the first transistor can discharge both negative and positive ESC events through parasitic bipolar conduction, without any additional circuits such as diodes used either to stop leakage currents or to conduct ESD current.
摘要:
Apparatus and methods are disclosed for improving the performance of a programmable logic device (PLD). A PLD includes a memory cell configured to provide a pair of voltages to a gate of a pass transistor and a body of the pass transistor, respectively.
摘要:
A device and a method are provided for isolating a circuit well from a substrate of the same conductivity type. In particular, an integrated circuit is provided which includes a circuit well arranged over a semiconductor substrate with no layer of opposite conductivity type arranged between the well and the substrate. The integrated circuit may further include a pair of isolation wells extending along opposite lateral boundaries of the circuit well. The isolation wells and circuit well may be adapted such that a single continuous depletion region underlying the circuit well may be formed upon application of an isolation voltage between the substrate and the pair of isolation wells. The formation of such a depletion region may beneficially isolate the circuit well from the underlying substrate.
摘要:
An electrostatic discharge (ESD) protection circuit includes a first array of transistors, having source and drain doped with a first type of material, arranged in parallel in a first block, and a second array of transistors, having source and drain doped with the first type of material, arranged in parallel in a second block. The ESD protection circuit also includes an active region between the first and second array of transistors doped with a second type of material that is complementary to the first type of material.
摘要:
Memory elements are provided that exhibit immunity to soft error upsets. The memory elements may have cross-coupled inverters. The inverters may be implemented using programmable Schmitt triggers. The memory elements may be locked and unlocked by providing appropriate power supply voltages to the Schmitt trigger. The memory elements may each have four inverter-like transistor pairs that form a bistable element, at least one address transistor, and at least one write enable transistor. The write enable transistor may bridge two of the four nodes. The memory elements may be locked and unlocked by turning the write enable transistor on and off. When a memory element is unlocked, the memory element is less resistant to changes in state, thereby facilitating write operations. When the memory element is locked, the memory element may exhibit enhanced immunity to soft error upsets.
摘要:
An integrated circuit (IC) includes a multiple-finger transistor structure. The multiple-finger transistor structure includes one transistor configured as a ballasted device. The multiple-finger transistor structure further includes a second transistor configured as a trigger device for the ballasted device.
摘要:
An integrated circuit inductor may have upper and lower loop-shaped line portions that are connected in series. The upper and lower portions may have 45° bends that form hexagonal or octagonal loops. Each loop portion may have one or more turns. Intervening metal-free regions of metal routing layers may be formed between the two layers to reduce capacitive coupling. Each loop portion may have sets of two or more metal lines shorted in parallel by vias. The upper and lower loops may be laterally offset or nested to reduce capacitive coupling.
摘要:
An ESD protection circuit is integrated into the core of an FPGA in a distributed fashion coupling the bodies of one or more transistors to the power supply pin and/or the ground pin of the FPGA. The ESD protection circuit includes one or more positive discharge paths and one or more negative discharge paths. In the case of a positive ESD event, the positive discharge paths are on and the negative discharge paths are off. In the case of a negative ESD event, the positive discharge paths are off and the negative discharge paths are on. In either event, the bodies of the transistors track the voltages at the power supply pin and/or the ground pin to protect the core from being by damaged by electrostatic discharge.