Abstract:
A slide type electronic device includes a first device body, a second device body stacked on the first device body, and a slide mechanism provided between the first and second device bodies. The first device body has first and second input interfaces located at different positions. The slide mechanism enables the second device body to slide relative to the first device body in different directions to permit access to one of the first and second input interfaces.
Abstract:
A polymorph, a polymorph screening system, and a polymorph preparing and screening method are disclosed. The polymorph preparing and screening method includes the following steps: providing a plurality of substrates of different materials; causing an organic material to grow crystals on the plurality of substrates through solution-cooling crystallization process, so that a plurality of polymorphs with different characteristics are prepared; and screening the plurality of polymorphs prepared in the previous step to obtain polymorphs with desired characteristics.
Abstract:
In one embodiment, there is disclosed a waveguide medium using total internal reflection to create a relatively sharp (approximately 90°) bend for optical signals traversing the waveguide. A discontinuity of the medium (such as air) is used to create a turning mirror within the waveguide path. By curving the discontinuity, the entire input optical signal is focused into the output portion of the waveguide, thereby compensating for the diffraction loss of the optical signal at the bend. In one embodiment in order to facilitate proper alignment of the masks certain portions of the waveguide on a first mask are extended (widened) beyond their optimum physical size. This extended portion is then used to position an edge of a second mask, such that optical signal scatter caused by the extended portions of the waveguide are compensated for by adjusting the curvature.
Abstract:
A peripheral circuit disposed on a substrate having an active device array is provided. The peripheral circuit includes first test pads, second test pads, first lines, and second lines. The first and the second lines are electrically connected to the active device array. Each first test pad includes a first conductive layer and a second conductive layer electrically connected to the first conductive layer. The first conductive layer electrically connects at least two of the adjacent first lines. The second test pads are interposed between the first test pads and the active device array. Each second test pad includes third conductive layers and a fourth conductive layer electrically connected to the third conductive layers. The first lines pass through the third conductive layers and are insulated from the fourth conductive layer. Each third conductive layer is electrically connected to one of the adjacent second lines respectively.
Abstract:
Transforming growth factor-beta1 (TGF-β1) mediates expression of collagen 1A2 (Col 1A2) gene via a synergistic cooperation between Smad2/Smad3 and Sp1, both act on the Col 1A2 gene promoter. The present invention discloses a method for inhibiting liver fibrosis via a retinoic acid derivative primarily extracted from the mycelia of Phlellinus linteus. The retinoic acid derivative can antagonize TGF-β-induced liver fibrosis through regulation of ROS and calcium influx, decreasing the promoter activity of Col 1A2, hindering the translocalization of phosphorylated Smad2/3-Smad4 complex from cytosol into nucleus and inhibiting Sp1 binding activity.
Abstract:
A light emitting diode including an epitaxial layer structure, a first electrode formed on the epitaxial layer structure, and a second electrode formed on the epitaxial layer structure. The first electrode has a pattern and the second electrode has a portion aligned with the pattern of the first electrode. The portion of the second electrode forms a non-ohmic contact with the epitaxial layer structure.
Abstract:
A thermochromic material mainly includes a fabric base, a thermosensitive coating layer formed by printing thermochromic paint on at least one portion of a surface of the fabric base, and a film layer adhered to a surface of the thermosensitive coating layer. The film layer is formed by fusing and mixing a thermoplastic polyurethane (TPU) material and an UV-cut material to obtain a fused material and then printing the fused material in a sheet-like manner. The film layer has a thickness ranging from 0.08 mm to 3 mm.
Abstract:
This invention provides a light-emitting diode chip with high light extraction, which includes a substrate, an epitaxial-layer structure for generating light by electric-optical effect, a transparent reflective layer sandwiched between the substrate and the epitaxial-layer structure, and a pair of electrodes for providing power supply to the epitaxial-layer structure. A bottom surface and top surface of the epitaxial-layer structure are roughened to have a roughness not less than 100 nm root mean square (rms). The light generated by the epitaxial-layer structure is hence effectively extracted out. A transparent reflective layer not more than 5 μm rms is formed as an interface between the substrate and the epitaxial-layer structure. The light toward the substrate is more effectively reflected upward. The light extraction and brightness are thus enhanced. Methods for manufacturing the light-emitting diode chip of the present invention are also provided.
Abstract:
An antenna structure includes an expansion card connector, an antenna, and a plurality of metal pins. The antenna is disposed on the expansion card connector. The plurality of metal pins is disposed on the expansion card connector, whereof the plurality of metal pins includes a first designated pin to be a feeding point of the antenna. The plurality of metal pins further includes a plurality of second designated pins, whereof the plurality of second designated pins is electrically connected to each other to be a radiator of the antenna.
Abstract:
The invention is directed to a method for controlling a polishing process. The method comprises steps of providing a first wafer, wherein a thin film is located over the first wafer. A film average thickness distribution is obtained by measuring a plurality of thickness values of the thin film on a plurality regions over the wafer respectively. A removal rate recipe is determined according to the film average thickness distribution. A polishing process is performed according to the removal rate recipe.