Abstract:
An exemplary display device includes a rear housing, a front frame, a display module, a connecting assembly pivotally connecting the front frame to the rear housing, a latching member, and a clamping member. The clamping member can be triggered to latch or release with the latching member for securing or releasing the front frame relative to the rear housing. The display module can be detached from or secured into the front frame when the display device is at an open position.
Abstract:
An analog-to-digital converter (ADC) and a battery operated electronic device comprising the ADC. The ADC comprising an input switch; an array of binary-weighted capacitors, the array of capacitors receiving the input voltage signal via the input switch in an on state of the input switch; a plurality of switches, each switch connected in series with a respective one of the capacitors at an opposite side compared to the input switch, wherein a VDD signal is applied to each switch in one switching state and ground in another switching state; a comparator having as one input a voltage from the input switch side of the array of capacitors and as another input a voltage of VDD/2; and a switch control unit coupled to an output of the comparator for controlling the switches based on the output from the comparator.
Abstract:
A frame includes a frame body and a plurality of fixing units. The frame body includes a base and a plurality of sidewalls extending from the peripheral of the base, the base and the sidewalls cooperatively forming a receiving cavity to receive the liquid crystal module. The fixing units are configured for enclosing the sidewalls and confining the liquid crystal module into the receiving cavity of the frame body. Each fixing unit is securely bounded with the liquid crystal module and the sidewall of the frame body respectively. A display device using the frame is also provided, which can be assembled efficiently and decreases the cost of materials.
Abstract:
A method is provided for processing a substrate surface by delivering a first gas mixture comprising a first organosilicon compound, a first oxidizing gas, and one or more hydrocarbon compounds into a chamber at deposition conditions sufficient to deposit a first low dielectric constant film on the substrate surface. A second gas mixture having a second organosilicon compound and a second oxidizing gas is delivered into the chamber at deposition conditions sufficient to deposit a second low dielectric constant film on the first low dielectric constant film. The flow rate of the second oxidizing gas into the chamber is increased, and the flow rate of the second organosilicon compound into the chamber is decreased to deposit an oxide rich cap on the second low dielectric constant film.
Abstract:
A frame includes a frame body and a plurality of fixing units. The frame body includes a base and a plurality of sidewalls extending from the peripheral of the base, the base and the sidewalls cooperatively forming a receiving cavity to receive the liquid crystal module. The fixing units are configured for enclosing the sidewalls and confining the liquid crystal module into the receiving cavity of the frame body. Each fixing unit is securely bounded with the liquid crystal module and the sidewall of the frame body respectively. A display device using the frame is also provided, which can be assembled efficiently and decreases the cost of materials.
Abstract:
A method is provided for processing a substrate including providing a processing gas comprising an organosilicon compound comprising a phenyl group to the processing chamber, and reacting the processing gas to deposit a low k silicon carbide barrier layer useful as a barrier layer in damascene or dual damascene applications with low k dielectric materials.
Abstract:
A method is provided for processing a substrate including providing a processing gas comprising an organosilicon compound comprising a phenyl group to the processing chamber, and reacting the processing gas to deposit a low k silicon carbide barrier layer useful as a barrier layer in damascene or dual damascene applications with low k dielectric materials.