Abstract:
The present invention provides a controlling apparatus for a skin resurfacing device performing a surgical procedure on a human skin with a surgical needle, including: a controller 20; a voltage regulator 50 configured to regulate a voltage supplied to the skin resurfacing device from a power supply 10 according to a control of the controller; and a starting switch 80 configured to turn on/off a supply of power between the voltage regulator and the skin resurfacing device, in which the controller controls the voltage regulator so as to output a preset jump start voltage to the skin resurfacing device every time the starting switch is turned on, if a jump start function that is a function of starting the skin resurfacing device is set by a starting voltage when an operating voltage of the skin resurfacing device is lower than the starting voltage of the skin resurfacing device at the time of the surgical procedure.
Abstract:
The present invention provides a controlling apparatus for a skin resurfacing device performing a surgical procedure on a human skin with a surgical needle, including: a controller 20; a voltage regulator 50 configured to regulate a voltage supplied to the skin resurfacing device from a power supply 10 according to a control of the controller; and a starting switch 80 configured to turn on/off a supply of power between the voltage regulator and the skin resurfacing device, in which the controller controls the voltage regulator so as to output a preset jump start voltage to the skin resurfacing device every time the starting switch is turned on, if a jump start function that is a function of starting the skin resurfacing device is set by a starting voltage when an operating voltage of the skin resurfacing device is lower than the starting voltage of the skin resurfacing device at the time of the surgical procedure.
Abstract:
A method of forming a wiring may include forming a first wire on a substrate; forming a material layer on the substrate, except on the first wire; forming a surface treatment film on the material layer; and forming a second wire on the first wire. The surface treatment film has physical properties opposite to the first wire. A method of forming a wiring may include forming a first wire on a substrate; forming a material layer on the substrate and the first wire; removing a portion of the material layer from the first wire; forming a surface treatment film on the material layer and the first wire; removing a portion of the surface treatment film from the first wire; and forming a second wire on the first wire. A thickness of the material layer on the substrate is greater than a thickness of the first wire on the substrate.
Abstract:
A method of forming patterns on a substrate, the method including: placing a mask having an opening defining a portion of one surface of a substrate on which patterns are to be formed on the substrate; forming a first modification layer in the opening by ejecting a surface modification ink onto a surface of the substrate through the opening; ejecting a target ink having droplets of sizes larger than those of a surface modification ink such that the target ink is distributed on the first modification layer in the opening; and removing the mask.
Abstract:
A printing apparatus includes a first nozzle substrate having a first tapered nozzle unit aligned with a pressure chamber and a second nozzle substrate having a second tapered nozzle unit aligned with the first tapered nozzle unit and attached to the bottom of the first nozzle substrate.
Abstract:
A method of forming patterns on a substrate, the method including: placing a mask having an opening defining a portion of one surface of a substrate on which patterns are to be formed on the substrate; forming a first modification layer in the opening by ejecting a surface modification ink onto a surface of the substrate through the opening; ejecting a target ink having droplets of sizes larger than those of a surface modification ink such that the target ink is distributed on the first modification layer in the opening; and removing the mask.
Abstract:
A substrate processing apparatus for deposition on a water seated therein is disclosed. The substrate processing apparatus includes a chamber having a reaction space, a lid provided on the chamber to selectively open or close the reaction space, a main disc accommodated in the chamber, on which at least one wafer is placed, and a drive device including a drive shaft to selectively rotate the main disc and a drive unit to drive the drive shaft. The drive shaft is separably coupled to the main disc to transmit drive force. When the lid is opened to expose the reaction space, the main disc is separated from the drive shaft and is discharged to the outside of the chamber in a state in which the wafer is placed thereon.
Abstract:
Thin film transistors (TFT) and methods of manufacturing the same. A TFT includes a line-shaped gate of uniform thickness. A cross-section of the gate is curved where a side surface and a top surface meet. The gate includes one, or two or more gate lines.
Abstract:
A mobile terminal includes a display and a controller. The display outputs a first input window configured to receive a first message. When input data is received into at least one message field of the first input window, the controller determines whether or not the input data conforms to a format of the first input window corresponding to the first message. The controller also outputs a notification after the input is determined not to conform to the format corresponding to the first input window corresponding to the first message. The display outputs a second input window to receive a second message. The second input window has at least one message field different from the message fields in the first input window.
Abstract:
Provided are a substrate supporting unit and a substrate treating apparatus using the substrate supporting unit. The substrate supporting unit comprises a base plate and a supporting portion formed on the base plate. The supporting portion comprises two supporting rods and a plurality of supporting members. The two supporting rods extend in a predetermined direction to be separated from each other. The plurality of supporting members is disposed to be separated from each other in the predetermined direction. Each of the supporting members connects the supporting rods.