Abstract:
A vehicle carries a variable inertia flywheel which is mechanically connected to the road wheels of the vehicle. Change of inertia of the flywheel influences the motion of the vehicle in acceleration, deceleration, swerving.
Abstract:
A method of converting a traditional staircase into a dual-use staircase, for reducing the stepping height and knee stress in stairs climbing and descending, comprises: providing a plurality of lifting modules and a plurality of extending modules; connecting the plurality of lifting and extending modules in pairs to the original steps respectively; and optionally connecting a plurality of dividers in between said lifting and extending modules respectively.The dual-use staircase structure reduces the step rise by half, while keeping the total run about the same. It allows healthy people to walk in a full-step domain, while allowing people with knee concerns to walk on a half-step domain. The dual-use staircase may include dividers with lateral openings to facilitate reverse turning halfway during ascending or descending of the staircase.
Abstract:
An electrostatic discharge (ESD) protection device includes a semiconductor layer, a source region formed in the layer, a drain region formed in the layer, a channel region in the layer between the source and drain regions, and a gate over the channel region. One or more islands are distributed either symmetrically or non-symmetrically in and along the drain region. The islands can be formed of polysilicon or a field oxide.
Abstract:
An electrostatic discharge (ESD) protection device includes a semiconductor layer, a source region formed in the layer, a drain region formed in the layer, a channel region in the layer between the source and drain regions, and a gate over the channel region. A plurality of current divider segments are distributed on the drain region and extend between the gate and drain contacts. The segments can be formed of polysilicon or a field oxide.
Abstract:
The present invention is directed to a semiconductor integrated circuit device having reduced leakage and the method of operating a semiconductor integrated circuit device with reduced leakage. The invention comprises an integrated circuit, including a passing transistor and a bias-application device coupled to the substrate of the passing transistor. The present invention has the passing transistor coupled to a storage cell. The bias-application device applies a first bias voltage of a positive value when the passing transistor is inactivated and applies a second bias voltage when the passing transistor is activated, wherein the second bias voltage is equal to or smaller than the first bias voltage. Further in accordance with the invention, there is provided a method of reducing the leakage of a passing transistor of N-type. The passing transistor is coupled with a storage cell. The method includes applying a first bias voltage of a positive value when the passing transistor is inactivated, and applying a second bias voltage when the passing transistor is activated, wherein the second bias voltage is equal to or smaller than the first bias voltage.
Abstract:
A multi-gate-finger MOSFET structure positions the gate element over a channel between drain and source diffusion regions, such that the entire structure is within the active region in a substrate. The gate/channel-to-drain and gate/channel-to-source diffusion edges are effectively continuous along the gate/channel layout, so as to cascade the snap-back action to enhance uniform turn on of the entire gate element during an ESD event. In addition, multiple poly-gate extensions are incorporated to reduce the gate resistance, thereby minimizing the propagation delay of the gate signal.
Abstract:
A semiconductor device has a first diffusion region having a silicided portion and a non-silicided portion. The device also has a second diffusion region, and a channel region between the first and second diffusion regions. The non-silicided portion of the first diffusion region has a plurality of non-silicided regions.
Abstract:
A method of operating a flash memory structure including a programming step. The method includes providing a flash memory device, the flash memory device comprising a substrate of first conductivity type, a source region of second conductivity type being defined in the substrate and a drain region of second conductivity type defined in the substrate. The flash memory device can be a split gate, a stacked gate, or other type of physical structure. The method includes applying a drain voltage of first polarity type on the drain region and applying a control gate voltage of a first conductivity type on the control gate. The method also includes applying a source voltage of second polarity type ranging from about 0.1 volt to about 0.5 volt on the source region, while maintaining a ground potential on the substrate to inject electrons onto a floating gate to program the floating gate.
Abstract:
An IC package architecture with electrostatic discharge (ESD) protection is provided for use on an IC package for the purpose of allowing the ESD robustness of the IC package to be further enhanced and the structural complexity of the same to be further simplified as compared to the prior art. The IC package includes a lead frame having a die pad for mounting an IC chip thereon, a plurality of package pins with some no-connect pins which are grouped into at least one no-connect pin unit, each unit consisting of one single no-connect pin or a number of consecutively arranged no-connect pins. ESD protection can be provided to any no-connect pin unit on the IC package either by arranging a pair of power pins proximate to the respective sides of the no-connect pin unit; by arranging a power pin proximate to one side of the no-connect pin unit and an elongated conductive tongue proximate to the other side; or by arranging a pair of elongated conductive tongues proximate to the respective sides of the no-connect pin unit. This provides ESD protection to all the no-connect pins in the no-connect pin unit without having to connect them to ESD protection circuits.
Abstract:
In a multiple-supply CMOS IC, if VDDH is applied slower than VDDL during powering up, some diffusion junctions normally reversed-biased may momentarily become forward-biased and produce latch-up to produce permanent damage to circuits. Therefore a protection circuit against latch-up in a multiple-supply IC is provided. The protection circuit comprises an N-channel MOSFET, which has its gate connected to the high-voltage bus, its drain connected to the low-voltage supply, and its source connected to the low-voltage bus to control the power-up sequence of high voltage and low voltage for the multiple-supply IC and to prevent latch-up. The N-channel MOSFET can be of different modes, such as enhancement mode, depletion mode or enhancement mode having a low threshold voltage.