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公开(公告)号：US20140362523A1
公开(公告)日：2014-12-11
申请号：US14297582
申请日：2014-06-05
Applicant: Apple Inc.
Inventor： Brett W. Degner , Eric R. Prather , David H. Narajowski , Frank F. Liang , Jay S. Nigen , Jesse T. Dybenko , Connor R. Duke , Eugene A. Whang , Christopher J. Stringer , Joshua D. Banko , Caitlin Elizabeth Kalinowski , Jonathan L. Berk , Matthew P. Casebolt , Kevin S. Fetterman , Eric J. Weirshauser
IPC: G06F1/20
CPC classification number: G06F1/181 , G02B6/0001 , G02B6/0008 , G02B6/001 , G06F1/182 , G06F1/183 , G06F1/185 , G06F1/188 , G06F1/20 , G06F1/206 , G06F3/00 , G08B5/36 , G08B21/18 , H01L23/4093 , H05K1/0203 , H05K5/03 , H05K7/20009 , H05K7/20145 , H05K7/20154 , H05K7/20163 , H05K7/20172 , H05K7/20209 , H05K7/2039 , H05K7/2049
Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.
Abstract translation: 本申请描述了关于用于为具有小外形尺寸的轻便且耐用的小型计算系统提供有效散热的系统和方法的各种实施例。 紧凑型计算系统可以采用台式计算机的形式。 台式计算机可以包括具有形成在其中的集成支撑系统的整体式顶壳，该集成支撑系统提供结构支撑，其通过顶壳分布施加的载荷，从而防止翘曲和弯曲。 利用混流风扇有效地将冷却空气拉过小型计算系统。
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公开(公告)号：US20130329352A1
公开(公告)日：2013-12-12
申请号：US13683955
申请日：2012-11-21
Applicant: APPLE INC.
Inventor： Jay S. Nigen , Ron A. Hopkinson , Derek J. Yap , Eric A. Knopf , William F. Leggett , Richard H. Tan
CPC classification number: H01L23/3735 , F28F21/00 , G06F1/20 , H01L21/4882 , H01L23/3737 , H01L23/552 , H01L2924/0002 , H05K1/0201 , H05K1/141 , H05K3/0061 , H05K7/20436 , H05K7/205 , H05K2201/042 , H05K2201/10159 , H01L2924/00
Abstract: The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.
Abstract translation: 所公开的实施例涉及一种促进系统中的热传导的系统，该系统包括具有诸如固态驱动器的集成电路的电路板的模块。 使用电路板一侧和相邻基板之间的热耦合材料来增加电路板和基板之间的热传导。 此外，模块可以包括在基板和壳体之间的另外的热耦合材料，其至少部分地围绕电路板，从而增加基板和壳体之间的热传导。 以这些方式，底板和/或壳体可以用作传热表面或散热器，其减少与集成电路的操作相关联的热点。
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公开(公告)号：US20130327507A1
公开(公告)日：2013-12-12
申请号：US13627231
申请日：2012-09-26
Applicant: APPLE INC.
Inventor： Brett W. Degner , Bartley K. Andre , Jeremy D. Bataillou , Jay S. Nigen , Christiaan A. Ligtenberg , Ron A. Hopkinson , Charles A. Schwalbach , Matthew P. Casebolt , Nicholas A. Rundle , Frank F. Liang
CPC classification number: H05K7/20145 , G06F1/203 , H05K7/2039 , Y10T29/49002
Abstract: The disclosed embodiments related to a component for use in a portable electronic device. The component includes a wall of the portable electronic device, containing an intake zone that includes a set of intake vents directed at a first angle toward one or more heat-generating components of the portable electronic device. The wall also includes an exhaust zone containing a set of exhaust vents directed at a second angle out of the portable electronic device.
Abstract translation: 所公开的实施例涉及用于便携式电子设备的部件。 该部件包括便携式电子设备的壁，其包含进气区，该进气区包括朝向便携式电子设备的一个或多个发热部件以第一角度定向的一组进气口。 该壁还包括排气区，该排气区包含一组从便携式电子设备引出的第二角度的排气口。
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