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    Battery structure and integration
    1.
    发明授权
    Battery structure and integration 审中-公开

    公开(公告)号：US10673035B2

    公开(公告)日：2020-06-02

    申请号：US15618957

    申请日：2017-06-09

    Applicant: Apple Inc.

    Inventor： Ron A. Hopkinson ,  Brett W. Degner ,  Robert S. Murphy ,  Christiaan A. Ligtenberg ,  Matthew P. Casebolt ,  Peter M. Arnold ,  Eric A. Knopf

    IPC: H01M2/10 ,  H01M10/44 ,  H01M10/48 ,  H01M10/0525

    Abstract: A portable electronic device is described. This portable electronic device includes an external housing with a cavity defined by an edge. A keyboard, having a front surface and a back surface, is disposed in the cavity with the front surface facing the external housing. Moreover, a tray is disposed over the back surface of the keyboard, and is mechanically coupled to the external housing adjacent to the edge. Furthermore, battery cells are mechanically coupled to an opposite side of the tray from the back surface of the keyboard. The tray may allow the battery cells to be removed from the portable electronic device without damaging the keyboard. In addition, the tray may increase the compression strength and/or the bending strength of the portable electronic device.

    Cableless battery integration
    2.
    发明授权
    Cableless battery integration 有权

    公开(公告)号：US09735528B2

    公开(公告)日：2017-08-15

    申请号：US13854820

    申请日：2013-04-01

    Applicant: Apple Inc.

    Inventor： Ron A. Hopkinson ,  Eric A. Knopf ,  Eugene Kim ,  Peter M. Arnold ,  Jim Hwang ,  Matthew P. Casebolt

    IPC: H02J7/00 ,  H01R31/06 ,  G06F1/26 ,  H01M2/10 ,  H01M10/42

    CPC classification number: H01R31/06 ,  G06F1/26 ,  H01M2/1022 ,  H01M2010/4278

    Abstract: An interposer for electrically coupling a battery-management circuit board in a power supply and a motherboard is described. The interposer includes: a substrate having a top surface and a bottom surface; first spring connectors, disposed on the top surface, which electrically couple to the battery-management circuit board; and second spring connectors, disposed on the bottom surface and electrically coupled to the first spring connectors, which electrically couple to the motherboard. Spring connectors in a first subset of the first and second spring connectors that convey power signals have a first vertical height, and spring connectors in a second subset of the first and second spring connectors that convey monitoring signals for the power supply have a second, smaller vertical height. In this way, the first subset is activated before the second subset is activated, thereby ensuring that an electrical path for the power signals is established first.

    Small form factor desktop computer
    3.
    发明授权
    Small form factor desktop computer 有权
    小型台式电脑

    公开(公告)号：US09132562B2

    公开(公告)日：2015-09-15

    申请号：US13887172

    申请日：2013-05-03

    Applicant: Apple Inc.

    Inventor： Chiew-Siang Goh ,  Houtan R. Farahani ,  Eric A. Knopf ,  Ricardo A. Mariano ,  Joseph B. Moak ,  Matthew S. Theobald

    IPC: G06F1/16 ,  B26D3/14 ,  G06F1/18 ,  G06F1/20 ,  H05K13/00

    CPC classification number: H05K7/20336 ,  B23C3/30 ,  B23C5/08 ,  B23C2220/36 ,  B26D3/14 ,  G06F1/16 ,  G06F1/181 ,  G06F1/182 ,  G06F1/185 ,  G06F1/187 ,  G06F1/20 ,  G06F1/203 ,  H05K13/00 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49169 ,  Y10T29/49826 ,  Y10T83/04 ,  Y10T83/869 ,  Y10T83/9391

    Abstract: An aesthetically pleasing small form factor desktop computer is described. The small form factor desktop computer can be formed of a single piece seamless housing that in the described embodiment is machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic (EM) shielding. This simplicity of design can accrue many advantages to the small form factor desktop computer besides those related to aesthetic look and feel. Fewer components and less time and effort can be required for assembly of the small form factor desktop computer and the absence of seams in the single piece housing can provide good protection against environmental contamination of internal components as well as EM shielding.

    Abstract translation: 描述了美观的小型台式计算机。 小型台式计算机可以由单件无缝外壳形成，在所述实施例中，由单个铝合金坯加工。 单件无缝外壳包括美观的脚部支撑件，其具有由RF透明材料形成的至少一部分，其提供用户对所选择的内部部件的访问以及提供电磁（EM）屏蔽。 除了与美学外观相关的设计外，这种简单的设计可以为小型台式电脑带来许多优点。 组装小型台式计算机可能需要更少的组件和更少的时间和精力，并且在单件外壳中不存在接缝可以提供良好的防止内部组件的环境污染以及EM屏蔽的保护。

    SOLID-STATE DRIVE WITH PASSIVE HEAT TRANSFER
    4.
    发明申请
    SOLID-STATE DRIVE WITH PASSIVE HEAT TRANSFER 有权
    固态传动与无源传热

    公开(公告)号：US20130329352A1

    公开(公告)日：2013-12-12

    申请号：US13683955

    申请日：2012-11-21

    Applicant: APPLE INC.

    Inventor： Jay S. Nigen ,  Ron A. Hopkinson ,  Derek J. Yap ,  Eric A. Knopf ,  William F. Leggett ,  Richard H. Tan

    IPC: H05K7/20 ,  F28F21/00 ,  G06F1/20

    CPC classification number: H01L23/3735 ,  F28F21/00 ,  G06F1/20 ,  H01L21/4882 ,  H01L23/3737 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K1/141 ,  H05K3/0061 ,  H05K7/20436 ,  H05K7/205 ,  H05K2201/042 ,  H05K2201/10159 ,  H01L2924/00

    Abstract: The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.

    Abstract translation: 所公开的实施例涉及一种促进系统中的热传导的系统，该系统包括具有诸如固态驱动器的集成电路的电路板的模块。 使用电路板一侧和相邻基板之间的热耦合材料来增加电路板和基板之间的热传导。 此外，模块可以包括在基板和壳体之间的另外的热耦合材料，其至少部分地围绕电路板，从而增加基板和壳体之间的热传导。 以这些方式，底板和/或壳体可以用作传热表面或散热器，其减少与集成电路的操作相关联的热点。

    BATTERY STRUCTURE AND INTEGRATION
    5.
    发明申请
    BATTERY STRUCTURE AND INTEGRATION 有权

    公开(公告)号：US20210119296A1

    公开(公告)日：2021-04-22

    申请号：US16890201

    申请日：2020-06-02

    Applicant: Apple Inc.

    Inventor： Ron Alan Hopkinson ,  Brett William Degner ,  Robert Sean Murphy ,  Christiaan A. Ligtenberg ,  Matthew P. Casebolt ,  Peter M. Arnold ,  Eric A. Knopf

    IPC: H01M50/209 ,  H01M10/44 ,  H01M10/48

    Abstract: A portable electronic device is described. This portable electronic device includes an external housing with a cavity defined by an edge. A keyboard, having a front surface and a back surface, is disposed in the cavity with the front surface facing the external housing. Moreover, a tray is disposed over the back surface of the keyboard, and is mechanically coupled to the external housing adjacent to the edge. Furthermore, battery cells are mechanically coupled to an opposite side of the tray from the back surface of the keyboard. The tray may allow the battery cells to be removed from the portable electronic device without damaging the keyboard. In addition, the tray may increase the compression strength and/or the bending strength of the portable electronic device.

    Solid-state drive with passive heat transfer
    9.
    发明授权
    Solid-state drive with passive heat transfer 有权
    具有被动热传递的固态驱动器

    公开(公告)号：US09408328B2

    公开(公告)日：2016-08-02

    申请号：US13683955

    申请日：2012-11-21

    Applicant: Apple Inc.

    Inventor： Jay S. Nigen ,  Ron A. Hopkinson ,  Derek J. Yap ,  Eric A. Knopf ,  William F. Leggett ,  Richard H. Tan

    IPC: H05K7/20 ,  F28F21/00 ,  G06F1/20 ,  H05K1/02 ,  H01L23/373 ,  H05K1/14 ,  H05K3/00

    CPC classification number: H01L23/3735 ,  F28F21/00 ,  G06F1/20 ,  H01L21/4882 ,  H01L23/3737 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K1/141 ,  H05K3/0061 ,  H05K7/20436 ,  H05K7/205 ,  H05K2201/042 ,  H05K2201/10159 ,  H01L2924/00

    Abstract: The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.

    Abstract translation: 所公开的实施例涉及一种促进系统中的热传导的系统，该系统包括具有诸如固态驱动器的集成电路的电路板的模块。 使用电路板一侧和相邻基板之间的热耦合材料来增加电路板和基板之间的热传导。 此外，模块可以包括在基板和壳体之间的另外的热耦合材料，其至少部分地围绕电路板，从而增加基板和壳体之间的热传导。 以这些方式，底板和/或壳体可以用作传热表面或散热器，其减少与集成电路的操作相关联的热点。

    SSD (SOLID STATE DRIVE) RELATED FEATURES OF A PORTABLE COMPUTER
    10.
    发明申请
    SSD (SOLID STATE DRIVE) RELATED FEATURES OF A PORTABLE COMPUTER 有权
    SSD（固态驱动）便携式计算机的相关功能

    公开(公告)号：US20140111933A1

    公开(公告)日：2014-04-24

    申请号：US13866922

    申请日：2013-04-19

    Applicant: APPLE INC.

    Inventor： Eric A. Knopf ,  Bartley K. Andre ,  Matthew P. Casebolt ,  Houtan R. Farahani ,  William F. Leggett ,  Gavin J. Reid ,  Mikael M. Silvanto ,  Derek J. Yap

    IPC: G06F1/18 ,  G06F1/20 ,  G06F1/16

    CPC classification number: G06F1/203 ,  G06F1/1658 ,  G06F1/187 ,  G06F1/20 ,  G11B33/08 ,  G11B33/124

    Abstract: A removable assembly for quickly inserting and removing a mass storage device from a compartment situated on the case of a portable computing device is described. The removable assembly is made of a mass storage device, a bracket which serves as a carrier for the mass storage device, and a metal plate. The mass storage device can be a solid state drive (SSD) card. The bracket is a single-piece plastic structure that can be deflected for snap insertion into the compartment and snap removal from the compartment. The metal plate conducts heat from the solid state drive (SSD) card to prevent it from overheating.

    Abstract translation: 描述了一种用于从位于便携式计算设备的壳体上的隔室快速插入和移除大容量存储设备的可拆卸组件。 可移动组件由大容量存储装置，用作大容量存储装置的载体的支架和金属板制成。 大容量存储设备可以是固态驱动器（SSD）卡。 支架是一个单件塑料结构，可以偏转，以便卡扣插入隔间并从隔间中快速移除。 金属板从固态驱动器（SSD）卡传导热量，以防止其过热。

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