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    Thermal module for a circuit board
    1.
    发明授权
    Thermal module for a circuit board 有权

    公开(公告)号：US11963288B2

    公开(公告)日：2024-04-16

    申请号：US17843884

    申请日：2022-06-17

    Applicant: Apple Inc.

    Inventor： Trevor J. Edmonds ,  Jay S. Nigen ,  Richard D. Kosoglow ,  Ron A. Hopkinson

    IPC: H05K1/02 ,  G06F1/20 ,  H05K7/20

    CPC classification number: H05K1/0203 ,  G06F1/203 ,  H05K7/2039 ,  H05K2201/10128

    Abstract: An assembly for heat-generating components includes a metal and a non-metal layer. To secure to a circuit board that carries a heat-generating component, a metal standoff is secured on a perimeter of the circuit board. Multiple protruding elements of the metal layer of the assembly secure within a respective opening of the standoff. The assembly secures, through metal-to-metal contact, to the standoff by multiple mechanical couplings. The assembly not only covers the circuit board, but also extends laterally beyond the circuit board (and the circuit board components). As a result, the assembly receives thermal energy from a heat-generating component(s) on the circuit board and allows the thermal energy to flow through assembly from one portion of the assembly covering the heat-generating component(s) to the lateral portion of the assembly that does not cover the heat-generating component(s).

    Battery structure and integration
    5.
    发明授权
    Battery structure and integration 审中-公开

    公开(公告)号：US10673035B2

    公开(公告)日：2020-06-02

    申请号：US15618957

    申请日：2017-06-09

    Applicant: Apple Inc.

    Inventor： Ron A. Hopkinson ,  Brett W. Degner ,  Robert S. Murphy ,  Christiaan A. Ligtenberg ,  Matthew P. Casebolt ,  Peter M. Arnold ,  Eric A. Knopf

    IPC: H01M2/10 ,  H01M10/44 ,  H01M10/48 ,  H01M10/0525

    Abstract: A portable electronic device is described. This portable electronic device includes an external housing with a cavity defined by an edge. A keyboard, having a front surface and a back surface, is disposed in the cavity with the front surface facing the external housing. Moreover, a tray is disposed over the back surface of the keyboard, and is mechanically coupled to the external housing adjacent to the edge. Furthermore, battery cells are mechanically coupled to an opposite side of the tray from the back surface of the keyboard. The tray may allow the battery cells to be removed from the portable electronic device without damaging the keyboard. In addition, the tray may increase the compression strength and/or the bending strength of the portable electronic device.

    MAIN LOGIC BOARD WITH MOUNTED SPEAKER AND INTEGRATED ACOUSTIC CAVITY
    8.
    发明申请
    MAIN LOGIC BOARD WITH MOUNTED SPEAKER AND INTEGRATED ACOUSTIC CAVITY 有权
    主要逻辑板与安装的扬声器和集成的声学空间

    公开(公告)号：US20160165327A1

    公开(公告)日：2016-06-09

    申请号：US14563990

    申请日：2014-12-08

    Applicant: Apple Inc.

    Inventor： Justin D. Crosby ,  Matthew A. Donarski ,  Andrew P. Bright ,  Joss N. Giddings ,  Ron A. Hopkinson ,  Nathan A. Johanningsmeier ,  William F. Leggett ,  Mikael M. Silvanto

    IPC: H04R1/02

    CPC classification number: H04R1/2811 ,  H04R1/288 ,  H04R2499/15

    Abstract: A computer system having a loudspeaker mounted on a main logic board by a hermetic seal, is disclosed. More particularly, embodiments of the computer system include an acoustic cavity defined between the loudspeaker, the main logic board, and the hermetic seal. Embodiments of the computer system may include a compressible seal separated from the hermetic seal by the loudspeaker and/or the main logic board. The compressible seal may define an acoustic channel and the loudspeaker may emit sound in a high frequency range through the acoustic channel toward a system exit. Other embodiments are also described and claimed.

    Abstract translation: 公开了一种具有通过气密密封安装在主逻辑板上的扬声器的计算机系统。 更具体地，计算机系统的实施例包括在扬声器，主逻辑板和气密密封之间限定的声腔。 计算机系统的实施例可以包括通过扬声器和/或主逻辑板与密封件分离的可压缩密封件。 可压缩密封件可以限定声学通道，并且扬声器可以通过声学通道朝向系统出口发出高频范围内的声音。 还描述和要求保护其他实施例。

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