公开(公告)号：US11979703B2

公开(公告)日：2024-05-07

申请号：US17992332

申请日：2022-11-22

Applicant: APPLE INC.

Inventor： Sean T. McIntosh ,  Jason C. Della Rosa ,  Samuel G. Parker ,  Benjamin A. Cousins ,  Ethan L. Huwe

IPC: H04R1/10 ,  A45C11/00 ,  A45C13/00 ,  E05F1/12 ,  E05F3/20 ,  G01V3/08 ,  H01F7/02 ,  H04B1/38 ,  H04B1/3827 ,  H04R1/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03

CPC classification number: H04R1/1016 ,  A45C11/00 ,  A45C13/005 ,  E05F1/1261 ,  E05F3/20 ,  G01V3/081 ,  H01F7/02 ,  H04R1/023 ,  H04R1/1041 ,  H04R1/1058 ,  H04R1/1091 ,  H05K5/0086 ,  H05K5/0217 ,  H05K5/0226 ,  H05K5/03 ,  A45C2011/001 ,  E05Y2201/224 ,  E05Y2900/602 ,  H04B1/38 ,  H04B2001/3866 ,  H04R1/1025 ,  H04R2400/11 ,  H04R2420/07 ,  H04R2460/11

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.

公开(公告)号：US11785372B2

公开(公告)日：2023-10-10

申请号：US17496746

申请日：2021-10-07

Applicant: APPLE INC.

Inventor： Lee M. Panecki ,  Michael B. Minerbi ,  Sean T. McIntosh

IPC: H04R1/10 ,  H04R1/02 ,  G06F3/16 ,  H02J50/10 ,  H04W4/80

CPC classification number: H04R1/1025 ,  G06F3/165 ,  G06F3/167 ,  H02J50/10 ,  H04R1/023 ,  H04R1/1016 ,  H04R1/1041 ,  H04R2420/07 ,  H04R2460/11 ,  H04W4/80

Abstract: An earphone comprising: a device housing that defines an internal cavity within the device housing; an acoustic port formed through a wall of the device housing and having an opening at an exterior surface of the device housing; an audio driver disposed within the device housing and aligned to emit sound through the acoustic port; and a mesh disposed within the acoustic port and having an outer periphery spaced apart from the device housing wall, wherein the mesh forms a portion of an exterior surface of the earphone that is recessed from the opening at the exterior surface of the device housing.

公开(公告)号：US20230088030A1

公开(公告)日：2023-03-23

申请号：US17992332

申请日：2022-11-22

Applicant: APPLE INC.

Inventor： Sean T. McIntosh ,  Jason C. Della Rosa ,  Samuel G. Parker ,  Benjamin A. Cousins ,  Ethan L. Huwe

IPC: H04R1/10 ,  G01V3/08 ,  A45C11/00 ,  A45C13/00 ,  E05F1/12 ,  E05F3/20 ,  H01F7/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03 ,  H04R1/02

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.

公开(公告)号：US11450999B2

公开(公告)日：2022-09-20

申请号：US17023013

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Eric T. SooHoo ,  Mahmoud R. Amini ,  Daniel R. Bloom ,  Sean T. McIntosh ,  Tian Shi Li ,  Jared M. Kole ,  Jason Joseph LeBlanc ,  Colin M. Ely ,  Peter J. Cameron ,  Michael A. Kinney ,  Eric S. Jol ,  Edward Siahaan ,  Robert D. Zupke ,  Rohan Gupta ,  Jordan J. Francis

IPC: H01R39/12 ,  H01R12/61 ,  H01R12/77 ,  H01R13/422

Abstract: Connector inserts and connector receptacles that have a small form factor and where when a connector insert and connector receptacle are mated, the connector insert can rotate and articulate relative to an electronic device housing the connector receptacle. The connector receptacle can be connected to components in the electronic device through a flexible circuit board having an amount of slack or excess length to allow the connector receptacle and the connector insert to rotate relative to the connected components. A bearing supporting the connector receptacle can articulate about an axis to allow the connector receptacle and connector insert to articulate relative to the connected components. The bearing can further support a locking mechanism to lock the connector insert in place in the connector receptacle.

公开(公告)号：US20220103930A1

公开(公告)日：2022-03-31

申请号：US17242182

申请日：2021-04-27

Applicant: Apple Inc.

Inventor： Mei Zhang ,  Benjamin A. Cousins ,  Mohammad Soroush Ghahri Sarabi ,  Phillip Qian ,  Sean T. McIntosh ,  Michael B. Minerbi ,  Lee M. Panecki

IPC: H04R1/10

Abstract: A wireless earphone comprising a housing that defines an interior cavity having an inner surface and an outer surface; an opening extending through the housing from the inner surface to the outer surface; and a mesh assembly disposed over the opening and comprising a permanent assembly coupled to the housing and a replaceable assembly removably coupled to the permanent assembly and comprising a mesh.

公开(公告)号：US20220085560A1

公开(公告)日：2022-03-17

申请号：US17023013

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Eric T. SooHoo ,  Mahmoud R. Amini ,  Daniel R. Bloom ,  Sean T. McIntosh ,  Tian Shi Li ,  Jared M. Kole ,  Jason Joseph LeBlanc ,  Colin M. Ely ,  Peter J. Cameron ,  Michael A. Kinney ,  Eric S. Jol ,  Edward Siahaan ,  Robert D. Zupke ,  Rohan Gupta ,  Jordan J. Francis

IPC: H01R39/12 ,  H01R12/77 ,  H01R12/61 ,  H01R13/422

Abstract: Connector inserts and connector receptacles that have a small form factor and where when a connector insert and connector receptacle are mated, the connector insert can rotate and articulate relative to an electronic device housing the connector receptacle. The connector receptacle can be connected to components in the electronic device through a flexible circuit board having an amount of slack or excess length to allow the connector receptacle and the connector insert to rotate relative to the connected components. A bearing supporting the connector receptacle can articulate about an axis to allow the connector receptacle and connector insert to articulate relative to the connected components. The bearing can further support a locking mechanism to lock the connector insert in place in the connector receptacle.

公开(公告)号：US20210211796A1

公开(公告)日：2021-07-08

申请号：US17207497

申请日：2021-03-19

Applicant: Apple Inc.

Inventor： Sean T. McIntosh ,  Jason C. Della Rosa ,  Samuel G. Parker ,  Benjamin A. Cousins ,  Ethan L. Huwe

IPC: H04R1/10 ,  G01V3/08 ,  A45C11/00 ,  A45C13/00 ,  E05F1/12 ,  E05F3/20 ,  H01F7/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03 ,  H04R1/02

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end. The eartip body can include an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end. The eartip can also include an attachment structure coupled to the inner eartip body at the attachment end, the attachment structure having an inner surface and an outer surface. The attachment structure can include an upper region interfacing with the sidewall and defining discrete through-holes, a lower region below the upper region where the inner surface defines a plurality of recesses positioned around the lower region, and a mesh extending across the channel and into the upper region.

公开(公告)号：US20200314519A1

公开(公告)日：2020-10-01

申请号：US16584940

申请日：2019-09-26

Applicant: Apple Inc.

Inventor： Dustin A. Hatfield ,  Shota Aoyagi ,  Timothy E. Emmott ,  Ethan L. Huwe ,  Mitchell R. Lerner ,  Sean T. McIntosh ,  Yi-Fang D. Tsai ,  Jason C. Della Rosa ,  Patrick W. Sheppard ,  Samuel G. Parker ,  David J. Feathers ,  Brian R. Twehues ,  Daniel Strongwater

IPC: H04R1/10

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and including an inner eartip body and an outer eartip body. The inner eartip body has a sidewall that extends between the interfacing end and the attachment end, and includes a groove formed in an outer surface of the sidewall. The outer eartip body is sized and shaped to be inserted into an ear canal and extends from the interfacing end toward the attachment end of the eartip.

公开(公告)号：US10728652B2

公开(公告)日：2020-07-28

申请号：US16375735

申请日：2019-04-04

Applicant: Apple Inc.

Inventor： Craig M. Stanley ,  Simon K. Porter ,  John H. Sheerin ,  Glenn K. Trainer ,  Jason C. Della Rosa ,  Ethan L. Huwe ,  Sean T. McIntosh ,  Erik L. Wang ,  Christopher J. Stringer ,  Molly J. Anderson

IPC: H04R1/28 ,  G06F3/01 ,  H04R1/02 ,  H04R1/26 ,  H04R1/30 ,  H04R5/02 ,  H04R31/00 ,  H03K17/96 ,  H05K1/02 ,  G06F3/02 ,  G06F3/041 ,  G06F3/0354 ,  H04R3/00 ,  H04R7/12 ,  H04R7/18 ,  H04R9/02 ,  H04R9/06 ,  H04R1/40 ,  H04R3/12 ,  G06F3/16 ,  F21V3/00 ,  F21V5/00 ,  F21V23/04 ,  F21V33/00 ,  G06F3/044 ,  H01H13/02 ,  H05K1/14

Abstract: This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured to reduce the strength of forces generated by a subwoofer of the array speaker.

公开(公告)号：US20200083501A1

公开(公告)日：2020-03-12

申请号：US16126830

申请日：2018-09-10

Applicant: Apple Inc.

Inventor： Hani Esmaeili ,  Eric S. Jol ,  Sean T. McIntosh

IPC: H01M2/10 ,  G06F1/16

Abstract: A low profile plug connector assembly is adapted for use in an accessory for an electronic device and includes a plug connector coupled to a thin and resilient flange. The flange is formed to match a curvature of a portion of the accessory and provides a resilient yet flexible structure for the plug connector that allows the plug connector to move during mating and demating. The low profile structure consumes minimal space and enables the accessory to have an aesthetically appealing appearance.