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公开(公告)号：US20140251952A1
公开(公告)日：2014-09-11
申请号：US13791148
申请日：2013-03-08
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Terrance Y. LEE , Fred C. REDEKER
IPC: B24D11/00
CPC classification number: B24B37/245
Abstract: In one embodiment, a polishing pad includes a hydrophilic polymer base having a polishing surface, and a metal oxide coating. The metal oxide coating has nanoparticles of metal oxide disposed on the polishing surface. In another embodiment, a processing station includes a rotatable platen, a polishing head, and a precursor delivery system. The polishing head is configured to retain a substrate against the polishing pad. The precursor delivery system is configured to form an oxide coating on a surface of a polishing pad disposed on the platen. In yet another embodiment, a method for modifying a surface of a polishing pad includes wetting the surface of the polishing pad and delivering a precursor to the wetted surface of the polishing pad surface. The method also includes forming a metal oxide coating having nanoparticles of metal oxide on the surface from the precursor.
Abstract translation: 在一个实施例中，抛光垫包括具有抛光表面的亲水聚合物基底和金属氧化物涂层。 金属氧化物涂层具有设置在抛光表面上的金属氧化物纳米颗粒。 在另一个实施例中，处理站包括可转动的压板，抛光头和前体输送系统。 抛光头被配置为将衬底保持在抛光垫上。 前体递送系统被配置为在设置在压板上的抛光垫的表面上形成氧化物涂层。 在另一个实施例中，用于修改抛光垫表面的方法包括润湿抛光垫的表面并将前体输送到抛光垫表面的润湿表面。 该方法还包括在前体表面上形成具有金属氧化物纳米颗粒的金属氧化物涂层。
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公开(公告)号：US20230330805A1
公开(公告)日：2023-10-19
申请号：US18138555
申请日：2023-04-24
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Nag B. PATIBANDLA , Rajeev BAJAJ , Daniel REDFIELD , Fred C. REDEKER , Mahendra C. ORILALL , Boyi FU , Mayu YAMAMURA , Ashwin CHOCKALINGAM
CPC classification number: B24B37/22 , B24D3/22 , B24D3/18 , B33Y10/00 , B24B37/24 , B24B37/26 , B33Y80/00
Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.
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33.发明申请公开(公告)号：US20220402091A1
公开(公告)日：2022-12-22
申请号：US17834675
申请日：2022-06-07
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Boyi FU , Ashwin CHOCKALINGAM , Daniel REDFIELD , Rajeev BAJAJ , Mahendra C. ORILALL , Hou T. NG , Jason G. FUNG , Mayu YAMAMURA
IPC: B24B37/24
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material, and structural properties, and new methods of manufacturing the same. In one or more embodiments, polishing pads with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Some embodiments may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, advanced polishing pads may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, where each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments can also provide polishing pads with polymeric layers that may be interpenetrating polymer networks.
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公开(公告)号：US20210205951A1
公开(公告)日：2021-07-08
申请号：US17209137
申请日：2021-03-22
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Boyi FU , Ashwin CHOCKALINGAM , Daniel REDFIELD , Rajeev BAJAJ , Mahendra C. ORILALL , Hou T. NG , Jason G. FUNG , Mayu YAMAMURA
IPC: B24B37/24 , B24B37/22 , B24B37/26 , B29C64/112 , B24D3/28 , B24D11/00 , B24D11/04 , B33Y10/00 , B33Y80/00 , B29C35/08 , C09D4/00 , C09G1/16
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.
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公开(公告)号：US20200325353A1
公开(公告)日：2020-10-15
申请号：US16668961
申请日：2019-10-30
Applicant: Applied Materials, Inc.
Inventor： Uma SRIDHAR , Sivapackia GANAPATHIAPPAN , Ashwin CHOCKALINGAM , Yingdong LUO , Daniel REDFIELD , Rajeev BAJAJ , Nag B. PATIBANDLA , Hou T. NG , Sudhakar MADHUSOODHANAN
IPC: C09D11/38 , B24B37/24 , C09D11/107 , C09D11/101 , B33Y70/00 , B33Y80/00
Abstract: Polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes are provided. More particularly, implementations disclosed herein relate to composite polishing articles having tunable properties such as hydrophilicity and zeta potential. 3D printed chemical-mechanical planarization (CMP) pads composed of UV curable acrylic chemistry are generally hydrophobic in nature. Such hydrophobic behavior affects the wetting properties with abrasive-based polishing slurries such as ceria-base slurries. However, in order to increase the planarization and removal rate while decreasing defects, hydrophilic pads are preferred. In addition, it is desirable that the zeta potential (Zp) of the pads be tunable over a wide range of conditions at different pH values. Implementations of the present disclosure include methods for increasing the hydrophilicity and tuning the Zp of the pads with anionic additives and pads produced using these methods.
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Patent Agency Ranking
公开(公告)号：US20200070302A1
公开(公告)日：2020-03-05
申请号：US16529884
申请日：2019-08-02
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Ankit VORA , Boyi FU , Venkat HARIHARAN , Mayu YAMAMURA , Mario CORNEJO , Igor ABRAMSON , Mo YANG , Daniel REDFIELD , Rajeev BAJAJ , Nag B. PATIBANDLA
IPC: B24B37/24 , C08F283/00 , B33Y10/00 , B33Y70/00 , B29C64/112
Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer. The resin precursor formulation further comprises a photoinitiator, wherein the precursor formulation has a viscosity that enables the precursor formulation to be dispensed to form a portion of a polishing article by an additive manufacturing process.
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公开(公告)号：US20190337117A1
公开(公告)日：2019-11-07
申请号：US16375506
申请日：2019-04-04
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Boyi FU , Ashwin CHOCKALINGAM , Ankit VORA , Daniel REDFIELD , Rajeev BAJAJ , Nag B. PATIBANDLA , Hou T. NG , Sudhakar MADHUSOODHANAN
Abstract: In one implementation, a method of forming a porous polishing pad is provided. The method comprises depositing a plurality of composite layers with a 3D printer to reach a target thickness. Depositing the plurality of composite layers comprises dispensing one or more droplets of a curable resin precursor composition onto a support. Depositing the plurality of composite layers further comprises dispensing one or more droplets of a porosity-forming composition onto the support, wherein at least one component of the porosity-forming composition is removable to form the pores in the porous polishing pad.
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公开(公告)号：US20190299357A1
公开(公告)日：2019-10-03
申请号：US16442687
申请日：2019-06-17
Applicant: Applied Materials, Inc.
Inventor： Mahendra Christopher ORILALL , Timothy MICHAELSON , Kasiraman KRISHNAN , Rajeev BAJAJ , Nag B. PATIBANDLA , Daniel REDFIELD , Fred C. REDEKER , Gregory E. MENK
Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material.
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公开(公告)号：US20190030678A1
公开(公告)日：2019-01-31
申请号：US16042016
申请日：2018-07-23
Applicant: Applied Materials, Inc.
Inventor： Ashavani KUMAR , Ashwin CHOCKALINGAM , Sivapackia GANAPATHIAPPAN , Rajeev BAJAJ , Boyi FU , Daniel REDFIELD , Nag B. PATIBANDLA , Mario Dagio CORNEJO , Amritanshu SINHA , Yan ZHAO , Ranga Rao ARNEPALLI , Fred C. REDEKER
IPC: B24B37/24 , B29C64/112
Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.
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40.发明申请公开(公告)号：US20180161954A1
公开(公告)日：2018-06-14
申请号：US15876436
申请日：2018-01-22
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Kasiraman KRISHNAN , Mahendra C. ORILALL , Daniel REDFIELD , Fred C. REDEKER , Nag B. PATIBANDLA , Gregory E. MENK , Jason G. FUNG , Russell Edward PERRY , Robert E. DAVENPORT
Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.
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