APPARATUS AND METHOD FOR MANUFACTURING ASSEMBLY HAVING MULTIPLE SEPARATED CONDUCTORS EMBEDDED WITHIN A SUBSTRATE

    公开(公告)号:US20190355495A1

    公开(公告)日:2019-11-21

    申请号:US16203695

    申请日:2018-11-29

    Abstract: An apparatus includes an electronic controller having a memory device and an extruding device connected to the electronic controller. The extruding device has a dispensing head configured to dispense a dielectric material though an orifice in the dispensing head as commanded by the electronic controller. A wire feed device is connected to the electronic controller and the extruding device and is configured to feed a conductive wire through the orifice as commanded by the electronic controller. A cutting device is connected to the electronic controller and the extruding device. The cutting device severs the wire after it is fed through the orifice as commanded by the electronic controller. An electromechanical device is connected to the electronic controller and to the extruding device. The electromechanical device is configured to move the extruding device, the wire feed device, and the cutting device within a 3D space as commanded by the electronic controller.

    Vehicle electrical interconnection system

    公开(公告)号:US11639143B2

    公开(公告)日:2023-05-02

    申请号:US17072658

    申请日:2020-10-16

    Abstract: Electrified vehicle electrical systems and formatting methods include arranging a first layer including one or more first electrical transmission lines each configured to carry electrical power at a first voltage to one or more electrical powertrain components of the electrified vehicle, arranging a second layer above at least a portion of the first electrical connection layer, wherein the second layer includes one or more second electrical transmission lines each configured to carry electrical power at a second voltage to one or more electrical power distribution components of the electrified vehicle, and arranging a third layer above at least a portion of the first and second layers, wherein the third layer includes one or more third electrical transmission lines each configured to carry electrical power at a third voltage to one or more input/output device components of the electrified vehicle.

    INTEGRAL FEATURES PROVIDING IMPROVED FLEXIBLE PRINTED CIRCUIT FOLDING AND CONNECTION CAPABILITY

    公开(公告)号:US20230125061A1

    公开(公告)日:2023-04-20

    申请号:US18084906

    申请日:2022-12-20

    Abstract: A flexible circuit (FC) and a method of forming the FC each include providing a first dielectric layer, applying a plurality of conductive circuit traces that are substantially parallel to each other to the first dielectric layer, providing a second dielectric layer atop the first dielectric layer and the plurality of conductive circuit traces to form a third dielectric layer having the plurality of conductive traces disposed therein and being configured to support and insulate the plurality of conductive traces, and forming a plurality of channels extending at least partially through a thickness of the third dielectric layer, wherein the plurality of channels are arranged between the plurality of conductive circuit traces and substantially parallel thereto and are configured to provide increased flexibility of the FC.

    Integral features providing improved flexible printed circuit folding and connection capability

    公开(公告)号:US11533807B2

    公开(公告)日:2022-12-20

    申请号:US17120416

    申请日:2020-12-14

    Abstract: A flexible circuit (FC) and a method of forming the FC each include providing a first dielectric layer, applying a plurality of conductive circuit traces that are substantially parallel to each other to the first dielectric layer, providing a second dielectric layer atop the first dielectric layer and the plurality of conductive circuit traces to form a third dielectric layer having the plurality of conductive traces disposed therein and being configured to support and insulate the plurality of conductive traces, and forming a plurality of channels extending at least partially through a thickness of the third dielectric layer, wherein the plurality of channels are arranged between the plurality of conductive circuit traces and substantially parallel thereto and are configured to provide increased flexibility of the FC.

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