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公开(公告)号：US20200103772A1
公开(公告)日：2020-04-02
申请号：US16611500
申请日：2018-03-06
Applicant: ASML Netherlands B.V.
Inventor： Sebastianus Adrianus GOORDEN , Simon Reinald HUISMAN , Duygu AKBULUT , Alessandro POLO , Simon Gijsbert Josephus MATHIJSSEN
Abstract: Disclosed is a metrology sensor apparatus and associated method. The metrology sensor apparatus comprises an illumination system operable to illuminate a metrology mark on a substrate with illumination radiation having a first polarization state and an optical collection system configured to collect scattered radiation, following scattering of the illumination radiation by the metrology mark. The metrology mark comprises a main structure and changes, relative to the first polarization state, at least one of a polarization state of a first portion of the scattered radiation predominately resultant from scattering by the main structure and a polarization state of a second portion of radiation predominately resultant from scattering by one or more features other than the main structure, such that the polarization state of the first portion of the scattered radiation is different to the polarization state of the second portion of the scattered radiation. The metrology sensor apparatus further comprises an optical filtering system which filters out the second portion of the scattered radiation based on its polarization state.
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公开(公告)号：US20190212658A1
公开(公告)日：2019-07-11
申请号：US16325471
申请日：2017-06-30
Applicant: ASML NETHERLANDS B.V.
Inventor： Simon Reinald HUISMAN , Simon Gijsbert Josephus MATHIJSSEN , Sebastianus Adrianus GOORDEN , Duygu AKBULUT , Alessandro POLO
Abstract: An alignment sensor for a lithographic apparatus has an optical system configured to deliver, collect and process radiation selectively in a first waveband (e.g. 500-900 nm) and/or in a second waveband (e.g. 1500-2500 nm). The radiation of the first and second wavebands share a common optical path in at least some portion of the optical system, while the radiation of the first waveband is processed by a first processing sub-system and the radiation of the second waveband is processed by a second processing sub-system. The processing subsystems in one example include self-referencing interferometers. The radiation of the second waveband allows marks to be measured through an opaque layer. Optical coatings and other components of each processing sub-system can be tailored to the respective waveband, without completely duplicating the optical system.
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公开(公告)号：US20250147429A1
公开(公告)日：2025-05-08
申请号：US18693337
申请日：2022-09-23
Applicant: ASML NETHERLANDS B.V.
Abstract: A method for determining a measurement setting for measuring a parameter of interest from a target structure on a substrate. The method includes: obtaining first position difference data describing a difference between a position of a first representative target structure position and a position of one or more first features relating to product structure; obtaining optical metrology data relating to optical measurements of the target structure and further relating to a plurality of different measurement settings; and determining the measurement setting from the first position difference data and the optical metrology data such that a measured feature position value obtained from an optical measurement of the target structure using the determined measurement setting is better correlated to a position of the one or more first features.
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公开(公告)号：US20220283428A1
公开(公告)日：2022-09-08
申请号：US17635907
申请日：2020-08-05
Applicant: ASML Netherlands B.V. , IMEC v.z.w.
Inventor： Luc Roger Simonne HASPESLAGH , Veronique ROCHUS , Guilherme BRONODANI TORRI , Nitesh PANDEY , Sebastianus Adrianus GOORDEN
Abstract: A micromirror array comprises a substrate, a plurality of minors for reflecting incident light and, for each mirror (20) of the plurality of minors, at least one piezoelectric actuator (21) for displacing the minor, wherein the at least one piezoelectric actuator is connected to the substrate. The micromirror array further comprises one or more pillars (24) connecting the minor to the at least one piezoelectric actuator. Also disclosed is a method of forming such a micromirror array. The micromirror array may be used in a programmable illuminator. The programmable illuminator may be used in a lithographic apparatus and/or in an inspection apparatus.
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公开(公告)号：US20210382403A1
公开(公告)日：2021-12-09
申请号：US17280711
申请日：2019-09-05
Applicant: ASML Netherlands B.V.
Inventor： Sebastianus Adrianus GOORDEN
IPC: G03F9/00
Abstract: An apparatus for measuring a position of a mark on a substrate, the apparatus comprising: an illumination system configured to condition at least one radiation beam to form a plurality of illumination spots spatially distributed in series such that during scanning of the substrate the plurality of illumination spots are incident on the mark sequentially, and a projection system configured to project radiation diffracted by the mark from the substrate, the diffracted radiation being produced by diffraction of the plurality of illumination spots by the mark; wherein the projection system is further configured to modulate the diffracted radiation and project the modulated radiation onto a detecting system configured to produce signals corresponding to each of the plurality of illumination spots, the signals being combined to determine the position of the mark.
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Patent Agency Ranking
公开(公告)号：US20210364936A1
公开(公告)日：2021-11-25
申请号：US16963273
申请日：2018-12-20
Applicant: ASML Netherlands B.V.
Inventor： Nitesh PANDEY , Duygu AKBULUT , Alessandro POLO , Sebastianus Adrianus GOORDEN
Abstract: A sensor is disclosed, wherein a transducer generates acoustic waves, which are received by a lens assembly. The lens assembly transmits and directs at least a part of the acoustic waves to a target. The lens assembly then receives at least a part of acoustic waves, after interaction with the target. The sensor further comprises an optical detector that comprises at least one optically reflective member located at a surface of the lens assembly, which surface is arranged opposite to a surface of the lens assembly which faces a focal plane of the lens assembly, wherein the at least one optically reflective member is mechanically displaced in response to the acoustic waves, which are received and transmitted by the lens assembly.
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公开(公告)号：US20210240091A1
公开(公告)日：2021-08-05
申请号：US17049597
申请日：2019-04-02
Applicant: ASML Netherlands B.V.
Inventor： Sebastianus Adrianus GOORDEN , Simon Reinald HUISMAN
IPC: G03F9/00
Abstract: A method of determining a position of a feature (for example an alignment mark) on an object (for example a silicon wafer) is disclosed. The method comprises determining an offset parameter, determining the second position; and determining a first position from the second position and the offset parameter, the position of the mark being the first position. The offset parameter is a measure of a difference in: a first position that is indicative of the position of the feature; and a second position that is indicative of the position of the feature. The offset parameter may be determined using a first measurement apparatus and the second position may be determined using a second, different measurement apparatus.
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公开(公告)号：US20190354026A1
公开(公告)日：2019-11-21
申请号：US16478068
申请日：2018-01-10
Applicant: ASML NETHERLANDS B.V.
Inventor： Stefan Michiel WITTE , Alessandro ANTONCECCHI , Stephen EDWARD , Hao ZHANG , Paulus Clemens Maria PLANKEN , Kjeld Sijbrand Eduard EIKEMA , Sebastianus Adrianus GOORDEN , Simon Reinald HUISMAN , Irwan Dani SETIJA
Abstract: As increasing numbers of layers, using increasing numbers of specific materials, are deposited on substrates, it becomes increasingly difficult to detect alignment marks accurately for, for example, applying a desired pattern onto a substrate using a lithographic apparatus, in part due to one or more of the materials used in one or more of the layers being wholly or partially opaque to the radiation used to detect alignment marks. In a first step, the substrate is illuminated with excitation radiation. In a second step, at least one effect associated with a reflected material effect scattered by a buried structure is measured. The effect may, for example, include a physical displacement of the surface of the substrate. In a third step, at least one characteristic of the structure based on the measured effect is derived.
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公开(公告)号：US20180031977A1
公开(公告)日：2018-02-01
申请号：US15660498
申请日：2017-07-26
Applicant: ASML Netherlands B.V.
Inventor： Sebastianus Adrianus GOORDEN , Nitesh PANDEY , Duygu AKBULUT , Teunis Willem TUKKER , Johannes Matheus Marie DE WIT
CPC classification number: G03F7/7015 , G01N21/8806 , G01N21/9501 , G01N2021/8822 , G01N2201/0631 , G02B6/262 , G02B6/4204 , G02B6/4296 , G03F7/70075 , G03F7/70583 , G03F7/70616 , G03F7/70625 , G03F7/70633
Abstract: Devices and methods for processing a radiation beam with coherence are disclosed. In one arrangement, an optical system receives a radiation beam with coherence. The radiation beam comprises components distributed over one or more radiation beam spatial modes. A waveguide supports a plurality of waveguide spatial modes. The optical system directs a plurality of the components of the radiation beam belonging to a common radiation beam spatial mode and having different frequencies onto the waveguide in such a way that each of the plurality of components couples to a different set of the waveguide spatial modes, each set comprising one or more of the waveguide spatial modes.
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公开(公告)号：US20240036485A1
公开(公告)日：2024-02-01
申请号：US18269191
申请日：2021-12-02
Applicant: ASML Netheriands B. V. , ASML Holding N.V.
Inventor： Arjan Johannes Anton BEUKMAN , Sebastianus Adrianus GOORDEN , Stephen ROUX , Sergel SOKOLOV , Filippo ALPEGGIANI
CPC classification number: G03F9/7065 , G03F7/70625 , G03F9/7046
Abstract: A method includes irradiating a target structure with sequential illumination shots, directing scattered beams from the target structure towards an imaging detector, generating a detection signal using the imaging detector, and determining a property of the target structure based on at least the detection signal. An integration time for each illumination shot of the sequential illumination shots is selected so to reduce a low frequency error.
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