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52 条记录 (耗时 0.022 秒)

    Supporting plate peeling apparatus
    31.
    发明申请
    Supporting plate peeling apparatus 审中-公开
    支撑板剥皮装置

    公开(公告)号：US20090314438A1

    公开(公告)日：2009-12-24

    申请号：US12457139

    申请日：2009-06-02

    申请人： Yasumasa Iwata ,  Akihiko Nakamura ,  Yoshihiro Inao

    发明人： Yasumasa Iwata ,  Akihiko Nakamura ,  Yoshihiro Inao

    IPC分类号： B32B38/10

    CPC分类号： H01L21/67028 ,  H01L21/02057 ,  H01L21/6835 ,  H01L2221/68318 ,  Y10T156/1111 ,  Y10T156/1158 ,  Y10T156/1917

    摘要： A supporting plate peeling apparatus in accordance with the present invention has removal means for removing an adhesive agent remaining on a side of a wafer from which a supporting plate has been peeled off, which adhesive agent is removed after (i) a supporting plate which supports a wafer reduced in thickness has been peeled off from the wafer and (ii) the side from which the supporting plate has been peeled off is washed with a washing liquid. The supporting plate peeling apparatus in accordance with the present invention is a supporting plate peeling apparatus which can remove the adhesive agent that remains on the side of the wafer from which the supporting plate has been peeled off that could not be completely removed just by the washing liquid, and which allows satisfactory completion of a peeling step. Hence, a supporting plate peeling apparatus is provided, which peels off a supporting plate for supporting a wafer, while not causing the side of the wafer from which the support plate has been peeled off to deteriorate.

    摘要翻译： 根据本发明的支撑板剥离装置具有去除残留在已经剥离了支撑板的晶片侧的粘合剂的去除装置，在（i）支撑板 已经从晶片剥离了厚度减小的晶片，（ii）用洗涤液清洗支撑板被剥离的一面。 根据本发明的支撑板剥离装置是一种支撑板剥离装置，其可以去除残留在已经剥离的支撑板的晶片侧面上的粘合剂，该粘合剂仅通过洗涤才能完全去除 液体，并且其允许令人满意地完成剥离步骤。 因此，提供了一种支撑板剥离装置，其剥离用于支撑晶片的支撑板，同时不使得支撑板已经剥离的晶片的侧面劣化。

    Substrate attaching method
    32.
    发明申请
    Substrate attaching method 有权
    基板贴附法

    公开(公告)号：US20050170612A1

    公开(公告)日：2005-08-04

    申请号：US11001575

    申请日：2004-12-01

    申请人： Atsushi Miyanari ,  Kosuke Doi ,  Ken Miyagi ,  Yoshihiro Inao ,  Koichi Misumi

    发明人： Atsushi Miyanari ,  Kosuke Doi ,  Ken Miyagi ,  Yoshihiro Inao ,  Koichi Misumi

    IPC分类号： C09J5/00 ,  C09J133/00 ,  C09J161/06 ,  H01L21/02 ,  H01L21/30 ,  H01L21/301 ,  H01L21/304 ,  H01L21/68 ,  H01L21/683 ,  H01L21/78

    CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/28

    摘要： A method for attaching a substrate such as a semiconductor wafer in which cracking or chipping can be prevented when the substrate is thinned involves applying adhesive liquid onto a circuit (element)-formed surface of a semiconductor wafer. The adhesive liquid undergoes preliminary drying, so that its flowability is reduced and it can keep its shape as an adhesive layer. For the preliminary drying, heating is conducted for 5 minutes at a temperature of 80° C. by using an oven. The thickness of the adhesive layer is determined based on the irregularities of the circuit which has been formed on the surface of the semiconductor wafer. Next, a supporting plate is attached to the semiconductor wafer on which the adhesive layer of a desired thickness has been formed.

    摘要翻译： 一种用于安装诸如半导体晶片的衬底的方法，其中当衬底变薄时可以防止裂纹或碎裂，包括将粘合剂液体施加到半导体晶片的电路（元件）形成表面上。 粘合剂液体进行预干燥，其流动性降低，并且可以保持其作为粘合剂层的形状。 对于预干燥，通过使用烘箱在80℃的温度下加热5分钟。 基于在半导体晶片的表面上形成的电路的凹凸来确定粘合剂层的厚度。 接下来，将支撑板安装到其上形成有所需厚度的粘合剂层的半导体晶片上。

    Substrate attaching method
    35.
    发明授权
    Substrate attaching method 有权
    基板贴附法

    公开(公告)号：US07268061B2

    公开(公告)日：2007-09-11

    申请号：US11001575

    申请日：2004-12-01

    申请人： Atsushi Miyanari ,  Kosuke Doi ,  Ken Miyagi ,  Yoshihiro Inao ,  Koichi Misumi

    发明人： Atsushi Miyanari ,  Kosuke Doi ,  Ken Miyagi ,  Yoshihiro Inao ,  Koichi Misumi

    IPC分类号： H01L21/20

    CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/28

    摘要： A method for attaching a substrate such as a semiconductor wafer in which cracking or chipping can be prevented when the substrate is thinned involves applying adhesive liquid onto a circuit (element)-formed surface of a semiconductor wafer. The adhesive liquid undergoes preliminary drying, so that its flowability is reduced and it can keep its shape as an adhesive layer. For the preliminary drying, heating is conducted for 5 minutes at a temperature of 80° C. by using an oven. The thickness of the adhesive layer is determined based on the irregularities of the circuit which has been formed on the surface of the semiconductor wafer. Next, a supporting plate is attached to the semiconductor wafer on which the adhesive layer of a desired thickness has been formed.

    摘要翻译： 一种用于安装诸如半导体晶片的衬底的方法，其中当衬底变薄时可以防止裂纹或碎裂，包括将粘合剂液体施加到半导体晶片的电路（元件）形成表面上。 粘合剂液体进行预干燥，其流动性降低，并且可以保持其作为粘合剂层的形状。 对于预干燥，通过使用烘箱在80℃的温度下加热5分钟。 基于在半导体晶片的表面上形成的电路的凹凸来确定粘合剂层的厚度。 接下来，将支撑板安装到其上形成有所需厚度的粘合剂层的半导体晶片上。

    Method of cleaning support plate
    36.
    发明授权
    Method of cleaning support plate 有权
    清洁支撑板的方法

    公开(公告)号：US08097087B2

    公开(公告)日：2012-01-17

    申请号：US12837790

    申请日：2010-07-16

    申请人： Tatsuhiro Mitake ,  Atsushi Miyanari ,  Yoshihiro Inao

    发明人： Tatsuhiro Mitake ,  Atsushi Miyanari ,  Yoshihiro Inao

    IPC分类号： B08B5/00

    CPC分类号： B08B7/0035

    摘要： A method of cleaning a support plate according to which, while no waste solution is produced after cleaning the support plate, the support plate can be treated at low cost. The method of cleaning the support plate includes the step of removing an organic substance adhered to the support plate by putting the support plate in contact with oxygen plasma.

    摘要翻译： 一种清洁支撑板的方法，其中，在清洁支撑板之后不会产生废溶液的情况下，可以以低成本处理支撑板。 清洁支撑板的方法包括通过将支撑板与氧等离子体接触来去除附着到支撑板上的有机物质的步骤。

    Developing apparatus and method
    38.
    发明申请
    Developing apparatus and method 失效
    开发设备和方法

    公开(公告)号：US20050180744A1

    公开(公告)日：2005-08-18

    申请号：US10997816

    申请日：2004-11-24

    申请人： Akihiko Nakamura ,  Yoshihiro Inao

    发明人： Akihiko Nakamura ,  Yoshihiro Inao

    IPC分类号： G03F7/30 ,  B05C11/08 ,  B05C11/10 ,  G03D3/08 ,  H01L21/027

    CPC分类号： G03D3/08

    摘要： A developing apparatus and method is provided in which the use amount of a developing solution can be reduced without deteriorating the accuracy of development. The developing apparatus comprises a new solution tank for storing an unused developing solution and a used solution tank for storing a used developing solution which is withdrawn from a material to be treated. A new solution feeding nozzle extends from the new solution tank, and the tip end of the nozzle faces toward the upper portion of the cup of each developing unit. A used solution feeding nozzle extends from the used solution tank, and the tip end of the nozzle faces toward the upper portion of the cup of each developing unit.

    摘要翻译： 提供一种显影装置和方法，其中可以降低显影液的使用量，而不会降低显影精度。 显影装置包括用于储存未使用的显影液的新溶液罐和用于储存从待处理材料中取出的用过的显影液的用过的溶液罐。 新的溶液供给喷嘴从新的溶液罐延伸，并且喷嘴的尖端面向每个显影单元的杯的上部。 使用的溶液供给喷嘴从使用的溶液罐延伸，并且喷嘴的前端朝向每个显影单元的杯的上部。

    Developing apparatus and method
    39.
    发明授权
    Developing apparatus and method 失效
    开发设备和方法

    公开(公告)号：US07237967B2

    公开(公告)日：2007-07-03

    申请号：US10997816

    申请日：2004-11-24

    申请人： Akihiko Nakamura ,  Yoshihiro Inao

    发明人： Akihiko Nakamura ,  Yoshihiro Inao

    IPC分类号： G03D5/00

    CPC分类号： G03D3/08

    摘要： A developing apparatus and method is provided in which the use amount of a developing solution can be reduced without deteriorating the accuracy of development. The developing apparatus comprises a new solution tank for storing an unused developing solution and a used solution tank for storing a used developing solution which is withdrawn from a material to be treated. A new solution feeding nozzle extends from the new solution tank, and the tip end of the nozzle faces toward the upper portion of the cup of each developing unit. A used solution feeding nozzle extends from the used solution tank, and the tip end of the nozzle faces toward the upper portion of the cup of each developing unit.

    摘要翻译： 提供一种显影装置和方法，其中可以降低显影液的使用量，而不会降低显影精度。 显影装置包括用于储存未使用的显影液的新溶液罐和用于储存从待处理材料中取出的使用的显影液的用过的溶液罐。 新的溶液供给喷嘴从新的溶液罐延伸，并且喷嘴的尖端面向每个显影单元的杯的上部。 使用的溶液供给喷嘴从使用的溶液罐延伸，并且喷嘴的前端朝向每个显影单元的杯的上部。

    Developing apparatus and developing method
    40.
    发明授权
    Developing apparatus and developing method 失效
    开发设备和开发方法

    公开(公告)号：US06893172B2

    公开(公告)日：2005-05-17

    申请号：US10780010

    申请日：2004-02-17

    申请人： Akihiko Nakamura ,  Yoshihiro Inao

    发明人： Akihiko Nakamura ,  Yoshihiro Inao

    IPC分类号： G03F7/30 ,  G03D5/00 ,  H01L21/027 ,  B05C11/02 ,  B05D3/12

    CPC分类号： G03D5/00

    摘要： A developing apparatus which enables the time necessary for a development reaction to be shortened and permits uniform development includes a chuck device with a support portion whose top surface is a horizontal surface and a spinner disposed in the middle of this support portion. The support portion and the spinner are provided within an antiscattering cup. A groove which vacuum adsorbs a substrate W to be treated is formed on the top surface of the spinner, a pipe which forms a circulation path is disposed within the groove formed on the top surface of the support portion, and a cleaning nozzle which cleans a developing solution which has flown behind the rear surface of the substrate W is disposed in a position which is nearest to the inside diameter of the top surface of the support portion. On the other hand, in a nozzle device, a spray nozzle is attached to a horizontally reciprocating arm via a columnar support. A developing solution pipe and an air supply pipe are inserted into this spray nozzle and a temperature-regulated developing solution from the developing solution supply pipe is spouted in mist form from the bottom end of the spray nozzle.

    摘要翻译： 能够缩短展开反应所需的时间并且允许均匀显影的显影装置包括具有顶表面是水平表面的支撑部分和设置在该支撑部分中间的旋转器的卡盘装置。 支撑部分和旋转器设置在防雾杯内。 真空吸附待处理基板W的槽形成在旋转器的上表面上，形成循环路径的管布置在形成在支撑部分的顶表面上的槽内，并且清洁喷嘴 已经流过基板W的后表面后方的显影液被配置在最靠近支撑部的上表面的内径的位置。 另一方面，在喷嘴装置中，喷嘴通过柱状支撑件附接到水平往复臂。 将显影溶液管和供气管插入该喷嘴中，并且来自显影液供给管的温度调节显影液从雾喷嘴的底端喷出。