公开(公告)号：US08302651B2

公开(公告)日：2012-11-06

申请号：US13093412

申请日：2011-04-25

Applicant: Kimihiro Nakada ,  Yasumasa Iwata ,  Akihiko Nakamura ,  Yoshihiro Inao ,  Satoshi Kobari

Inventor： Kimihiro Nakada ,  Yasumasa Iwata ,  Akihiko Nakamura ,  Yoshihiro Inao ,  Satoshi Kobari

IPC: B29C63/00

CPC classification number: B32B43/006 ,  B32B2457/14 ,  H01L21/67132 ,  H01L21/6715 ,  Y10T156/1111 ,  Y10T156/1121 ,  Y10T156/19 ,  Y10T156/1922

Abstract: A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes the step of supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.

Abstract translation: 一种用于从包括基底和支撑板的层压板剥离支撑板的剥离方法，所述支撑板通过粘合剂层粘合到晶片上，其中粘合剂层由可溶于非极性溶剂或高极性溶剂的粘合剂形成 ; 并且剥离方法包括供给非极性溶剂或高极性溶剂的步骤，使得非极性溶剂或高极性溶剂至少保留在层压体的面向支持体的表面的边缘部分上 板，并且在层压板的侧表面上。

公开(公告)号：US08186410B2

公开(公告)日：2012-05-29

申请号：US12326340

申请日：2008-12-02

Applicant: Akihiko Nakamura ,  Junichi Katsuragawa ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Yasumasa Iwata

Inventor： Akihiko Nakamura ,  Junichi Katsuragawa ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Yasumasa Iwata

IPC: B32B38/00

CPC classification number: B32B43/006 ,  B32B37/12 ,  B32B2038/1891 ,  B32B2457/14 ,  H01L21/67173 ,  H01L21/67346 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/11 ,  Y10T156/1111 ,  Y10T156/19 ,  Y10T156/195 ,  Y10T156/1978 ,  Y10T279/11

Abstract: A separating device according to the present invention separates a support plate (14) from a substrate (12) of a laminate (10) including the substrate (12) and the support plate (14) bonded to each other. The separating device includes: a first storing section (20) for storing the laminate (10); a plurality of first processing sections (30) for reducing adhesive force of an adhesive (13) applied between the substrate (12) and the support plate (14); and a first carrying section (50) which is capable of moving in the first direction and carries the laminate (10) from the first storing section (20) to the first processing section (30) while holding the laminate (10). With the first carrying section (50), it is possible to provide a separating device (100) which moves straightly so as to carry the laminate (10). This provides a separating device for (i) processing a laminate including a substrate and a support plate and (ii) separating the support plate from the substrate, which separating device performs the separating process efficiently.

Abstract translation: 根据本发明的分离装置将支撑板（14）与包括彼此结合的基板（12）和支撑板（14）的层叠体（10）的基板（12）分离。 分离装置包括：用于储存层压板（10）的第一储存部分（20）。 多个第一处理部（30），用于降低施加在所述基板（12）和所述支撑板（14）之间的粘合剂（13）的粘合力; 以及第一承载部（50），其能够在保持层叠体（10）的同时沿第一方向移动并将层压体（10）从第一收纳部（20）运送到第一处理部（30）。 利用第一承载部分（50），可以提供一个分离装置（100），该分离装置（100）直线移动以便承载层压板（10）。 这提供了一种分离装置，用于（i）处理包括基板和支撑板的层压板，以及（ii）将支撑板与基板分离，该分离装置有效地执行分离过程。

公开(公告)号：US08080123B2

公开(公告)日：2011-12-20

申请号：US13036761

申请日：2011-02-28

Applicant: Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao

Inventor： Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao

IPC: B29C65/48 ,  B32B37/00 ,  B32B38/10 ,  B32B39/00 ,  B32B43/00

CPC classification number: B29C63/0013 ,  B29L2031/3425 ,  Y10T156/1111 ,  Y10T156/1132 ,  Y10T156/1928

Abstract: A method for stripping a supporting plate from a circuit-formed surface of a substrate to which it is bonded with an adhesive by using a plate which has a first penetrating hole formed in a substantially central portion thereof in the thickness direction, a second penetrating hole formed in a peripheral portion thereof in the thickness direction, and a hole for attracting the supporting plate formed between the first penetrating hole and the second penetrating hole in the radial direction of the plate. The method involves supplying a solvent from outside to the first penetrating hole of the plate and to an associated first penetrating hole formed in a substantially central portion of the supporting plate; distributing the solvent from the first penetrating hole of the supporting plate through grooves formed on a surface of the supporting plate in contact with the adhesive and connecting with the first penetrating hole of the supporting plate; dissolving the adhesive with the solvent; and draining the solvent from a second penetrating hole connecting with the grooves and formed in a peripheral portion of the supporting plate and the second penetrating hole formed in the plate.

Abstract translation: 一种从其厚度方向的大致中央部形成有第一贯通孔的板剥离由基板的电路形成面与粘接剂抵接的支撑板的方法，第二贯通孔 在其厚度方向的周边部分形成有用于吸引形成在板的径向方向上的第一贯通孔和第二贯通孔之间的支撑板的孔。 该方法包括从外部向板的第一穿透孔和形成在支撑板的大致中心部分中的相关联的第一穿透孔提供溶剂; 从支撑板的第一贯通孔通过形成在支撑板的表面上的与粘合剂接触并与支撑板的第一穿透孔连接的槽分配溶剂; 用溶剂溶解粘合剂; 并且从与所述槽连接的第二贯通孔排出溶剂，并形成在所述支撑板的周边部分和形成在所述板中的所述第二贯通孔。

公开(公告)号：US20090139662A1

公开(公告)日：2009-06-04

申请号：US12326340

申请日：2008-12-02

Applicant: Akihiko Nakamura ,  Junichi Katsuragawa ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Yasumasa Iwata

Inventor： Akihiko Nakamura ,  Junichi Katsuragawa ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Yasumasa Iwata

IPC: B29C63/00

CPC classification number: B32B43/006 ,  B32B37/12 ,  B32B2038/1891 ,  B32B2457/14 ,  H01L21/67173 ,  H01L21/67346 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/11 ,  Y10T156/1111 ,  Y10T156/19 ,  Y10T156/195 ,  Y10T156/1978 ,  Y10T279/11

Abstract: A separating device according to the present invention separates a support plate (14) from a substrate (12) of a laminate (10) including the substrate (12) and the support plate (14) bonded to each other. The separating device includes: a first storing section (20) for storing the laminate (10); a plurality of first processing sections (30) for reducing adhesive force of an adhesive (13) applied between the substrate (12) and the support plate (14); and a first carrying section (50) which is capable of moving in the first direction and carries the laminate (10) from the first storing section (20) to the first processing section (30) while holding the laminate (10). With the first carrying section (50), it is possible to provide a separating device (100) which moves straightly so as to carry the laminate (10). This provides a separating device for (i) processing a laminate including a substrate and a support plate and (ii) separating the support plate from the substrate, which separating device performs the separating process efficiently.

Abstract translation: 根据本发明的分离装置将支撑板（14）与包括彼此结合的基板（12）和支撑板（14）的层叠体（10）的基板（12）分离。 分离装置包括：用于储存层压板（10）的第一储存部分（20）。 多个第一处理部（30），用于降低施加在所述基板（12）和所述支撑板（14）之间的粘合剂（13）的粘合力; 以及第一承载部（50），其能够在保持层叠体（10）的同时沿第一方向移动并将层压体（10）从第一收纳部（20）运送到第一处理部（30）。 利用第一承载部分（50），可以提供一个分离装置（100），该分离装置（100）直线移动以便承载层压板（10）。 这提供了一种分离装置，用于（i）处理包括基板和支撑板的层压板，以及（ii）将支撑板与基板分离，该分离装置有效地执行分离过程。

公开(公告)号：US08377256B2

公开(公告)日：2013-02-19

申请号：US13613384

申请日：2012-09-13

Applicant: Kimihiro Nakada ,  Yasumasa Iwata ,  Akihiko Nakamura ,  Yoshihiro Inao ,  Satoshi Kobari

Inventor： Kimihiro Nakada ,  Yasumasa Iwata ,  Akihiko Nakamura ,  Yoshihiro Inao ,  Satoshi Kobari

IPC: B32B38/10

CPC classification number: B32B43/006 ,  B32B2457/14 ,  H01L21/67132 ,  H01L21/6715 ,  Y10T156/1111 ,  Y10T156/1121 ,  Y10T156/19 ,  Y10T156/1922

Abstract: A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.

Abstract translation: 一种用于从包括基底和支撑板的层压板剥离支撑板的剥离方法，所述支撑板通过粘合剂层粘合到晶片上，其中粘合剂层由可溶于非极性溶剂或高极性溶剂的粘合剂形成 ; 并且剥离方法包括供给非极性溶剂或高极性溶剂，使得非极性溶剂或高极性溶剂至少保留在面向支撑板的层压体的该表面的边缘部分上，以及 在层压板的侧表面上。

公开(公告)号：US08297331B2

公开(公告)日：2012-10-30

申请号：US12492620

申请日：2009-06-26

Applicant: Yoshihiro Inao ,  Akihiko Nakamura ,  Yasumasa Iwata

Inventor： Yoshihiro Inao ,  Akihiko Nakamura ,  Yasumasa Iwata

IPC: B32B38/10

CPC classification number: H01L21/67092 ,  H01L21/67011 ,  H01L21/6838 ,  Y10T156/1111 ,  Y10T156/1116 ,  Y10T156/1132 ,  Y10T156/1137 ,  Y10T156/1939 ,  Y10T156/1944

Abstract: A separating apparatus includes a sucking plate for sticking to a support plate by suction. The sucking plate has sucking holes for expelling gas from a space between the sucking plate and the support plate. Each of the sucking holes has a diameter of not less than 0.3 mm and not more than an outer diameter of the support plate. This makes it possible to separate a supporting plate from a wafer without breaking the wafer.

Abstract translation: 分离装置包括用于通过抽吸粘附到支撑板的吸板。 吸盘具有用于从吸板和支撑板之间的空间排出气体的吸孔。 每个吸孔的直径不小于0.3mm且不大于支撑板的外径。 这使得可以在不破坏晶片的情况下将支撑板与晶片分离。

公开(公告)号：US08148457B2

公开(公告)日：2012-04-03

申请号：US12514633

申请日：2007-09-26

Applicant: Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura

Inventor： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura

IPC: C08L31/00

CPC classification number: C09J153/00 ,  C08F212/08 ,  C08F220/06 ,  C08F220/18 ,  C08F290/046 ,  C08F2220/301 ,  C09J7/381 ,  C09J133/10 ,  C09J133/12 ,  C09J135/06 ,  C09J2205/114 ,  C09J2433/00 ,  C09J2453/00 ,  Y10T428/2852 ,  Y10T428/2891

Abstract: Disclosed is an adhesive composition whose component is a polymer obtained by copolymerizing a monomer composition containing styrene, a (meth)acrylic acid ester having a cyclic structure, and an alkyl(meth)acrylate having a chain structure. The monomer composition further contains a carboxylic acid having an ethylene double bond, a bifunctional monomer, and a styrene macromonomer. The polymer has a styrene block segment. This can improve heat resistance, adhesive strength in a high temperature environment, alkaline resistance, and easiness in stripping of an adhesive composition that has been subjected to a high temperature process. As a result, there can be obtained an adhesive composition which has high heat resistance, adhesive strength in a high temperature environment, and alkali resistance, and which can be easily stripped off after the adhesive composition is processed at a high temperature.

Abstract translation: 公开了一种粘合剂组合物，其组分是通过共聚包含苯乙烯的单体组合物，具有环状结构的（甲基）丙烯酸酯）和具有链结构的（甲基）丙烯酸烷基酯获得的聚合物。 单体组合物还含有具有乙烯双键的羧酸，双官能单体和苯乙烯大分子单体。 聚合物具有苯乙烯嵌段。 这可以提高耐热性，在高温环境下的粘合强度，耐碱性，以及剥离已经进行高温处理的粘合剂组合物的容易性。 结果，可以获得耐热性高，在高温环境下的粘合强度和耐碱性的粘合剂组合物，并且在粘合剂组合物在高温下加工后可以容易地剥离。

公开(公告)号：US08136564B2

公开(公告)日：2012-03-20

申请号：US11633604

申请日：2006-12-04

Applicant: Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao

Inventor： Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao

IPC: B32B37/10

CPC classification number: B32B38/1841 ,  B32B37/0046 ,  B32B2038/1891 ,  B32B2309/68 ,  B32B2457/14 ,  H01L21/68 ,  H01L21/68742 ,  Y10T156/17

Abstract: An attaching device which makes it possible to accurately perform alignment when the diameters of a substrate and a supporting plate are substantially the same includes a mounting plate for mounting a semiconductor wafer thereon, a pressing plate for pressing a supporting plate onto the semiconductor wafer, and a pair of alignment members. The pair of alignment members are arranged to freely move back and forth in a horizontal direction, and blades for supporting a lower surface of the periphery of the supporting plate and pushing members for performing positioning in a state where the supporting plate is superposed on the semiconductor wafer are provided at tip ends of the alignment members.

Abstract translation: 一种连接装置，其能够在基板和支撑板的直径基本相同的情况下准确地进行对准，包括用于在其上安装半导体晶片的安装板，用于将支撑板按压到半导体晶片上的按压板，以及 一对对准构件。 一对对准构件被布置成在水平方向上自由地前后移动，并且用于支撑支撑板的周边的下表面的叶片和用于在支撑板叠置在半导体上的状态下执行定位的推动构件 晶片设置在对准构件的顶端。

公开(公告)号：US20110259527A1

公开(公告)日：2011-10-27

申请号：US13093412

申请日：2011-04-25

Applicant: Kimihiro Nakada ,  Yasumasa Iwata ,  Akihiko Nakamura ,  Yoshihiro Inao ,  Satoshi Kobari

Inventor： Kimihiro Nakada ,  Yasumasa Iwata ,  Akihiko Nakamura ,  Yoshihiro Inao ,  Satoshi Kobari

IPC: B32B38/10

CPC classification number: B32B43/006 ,  B32B2457/14 ,  H01L21/67132 ,  H01L21/6715 ,  Y10T156/1111 ,  Y10T156/1121 ,  Y10T156/19 ,  Y10T156/1922

Abstract: A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes the step of supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.

Abstract translation: 一种用于从包括基底和支撑板的层压板剥离支撑板的剥离方法，所述支撑板通过粘合剂层粘合到晶片上，其中粘合剂层由可溶于非极性溶剂或高极性溶剂的粘合剂形成 ; 并且剥离方法包括供给非极性溶剂或高极性溶剂的步骤，使得非极性溶剂或高极性溶剂至少保留在层压体的面向支持体的表面的边缘部分上 板，并且在层压板的侧表面上。

公开(公告)号：US20090288780A1

公开(公告)日：2009-11-26

申请号：US12448499

申请日：2007-11-26

Applicant: Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Yasumasa Iwata

Inventor： Akihiko Nakamura ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Yasumasa Iwata

IPC: B32B37/12

CPC classification number: H01L21/02002 ,  H01L21/67132 ,  H01L21/68757 ,  Y10T29/49998 ,  Y10T156/1062 ,  Y10T156/1798

Abstract: To provide a perforated support plate with high rigidity, the perforated support plate for supporting a surface of a wafer by interposing an adhesive layer comprises a reinforcing part for deflection prevention.

Abstract translation: 为了提供具有高刚性的穿孔支撑板，用于通过插入粘合剂层来支撑晶片表面的穿孔支撑板包括用于偏转预防的加强部件。