-
31.发明授权公开(公告)号：US09102117B2
公开(公告)日：2015-08-11
申请号：US14070932
申请日：2013-11-04
申请人： Yuuji Suzuki , Tomohiro Furuhashi , Shuuya Nagasako , Akira Kunieda , Michitaka Suzuki , Kyosuke Nakada , Kazuya Yamamoto , Takahiro Watanabe , Kiichiro Goto
发明人： Yuuji Suzuki , Tomohiro Furuhashi , Shuuya Nagasako , Akira Kunieda , Michitaka Suzuki , Kyosuke Nakada , Kazuya Yamamoto , Takahiro Watanabe , Kiichiro Goto
CPC分类号： B31F1/10 , B31F1/0025 , B65H45/14 , B65H45/147 , B65H45/20
摘要： A sheet processing apparatus includes: a first pair of conveying members that convey a sheet; a second pair of conveying members that receive the sheet conveyed by the first pair of the conveying members and further conveys the sheet to a subsequent stage; and a third pair of conveying members that fold the sheet by rotating the second pair of the conveying members in a reverse direction while the sheet is held by the first pair of the conveying members and the second pair of the conveying members. One of the conveying members of the second pair serves as one of the conveying members of the third pair.
摘要翻译： 片材处理设备包括：第一对输送片材的输送构件; 第二对输送构件，其接收由第一对输送构件输送的纸张，并进一步将纸张输送到后续阶段; 以及第三对输送构件，其通过在第一对输送构件和第二对输送构件保持片材的同时沿相反方向旋转第二对输送构件而折叠片材。 第二对的输送构件之一用作第三对的输送构件之一。
-
32.发明申请公开(公告)号：US20100270063A1
公开(公告)日：2010-10-28
申请号：US12827018
申请日：2010-06-30
CPC分类号： H05K3/025 , C25D1/04 , C25D1/20 , Y10T428/12438 , Y10T428/12458 , Y10T428/12514 , Y10T428/12771 , Y10T428/12812 , Y10T428/1284 , Y10T428/12854 , Y10T428/12861 , Y10T428/1291 , Y10T428/12931
摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content “a” of the metal A and a content “b” of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70 and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.
摘要翻译： 一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷 电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基底的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，扩散防止层，释放 层和超薄铜箔，其中剥离层由用于保持剥离性质的金属A形成，金属B由金属A的含量“a”和含量“b 形成释放层的金属B满足等式：10＆nlE; a /（a + b）* 100＆nlE; 70以及通过使用这种超薄铜箔与载体制备的印刷电路板。
-
33.发明授权公开(公告)号：US07771841B2
公开(公告)日：2010-08-10
申请号：US11639439
申请日：2006-12-15
IPC分类号： B32B15/00
CPC分类号： H05K3/025 , C25D1/04 , C25D1/20 , Y10T428/12438 , Y10T428/12458 , Y10T428/12514 , Y10T428/12771 , Y10T428/12812 , Y10T428/1284 , Y10T428/12854 , Y10T428/12861 , Y10T428/1291 , Y10T428/12931
摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70 and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.
摘要翻译： 一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷 电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基底的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，扩散防止层，释放 层和超薄铜箔，其中剥离层由用于保持剥离性的金属A形成，并且金属B用于促进超薄铜箔的镀覆，金属A的含量a和金属的含量b B形成满足以下等式的剥离层：10＆lt; nlE; a /（a + b）* 100＆nlE; 70以及通过使用这种超薄铜箔与载体制备的印刷电路板。
-
公开(公告)号：US07381475B2
公开(公告)日：2008-06-03
申请号：US11052998
申请日：2005-02-07
申请人： Yuuji Suzuki
发明人： Yuuji Suzuki
IPC分类号： B32B15/20
CPC分类号： C25D1/04 , C25D5/16 , C25D7/0614 , H05K3/384 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10T428/12063 , Y10T428/12438 , Y10T428/12903 , Y10T428/1291 , Y10T428/12993 , Y10T428/24917 , Y10T428/25
摘要： An object of the present invention is to provide a treated copper foil laminated with a mesomorphic polymer film having low hygroscopicity and superior high thermal resistance to make a circuit board composite materials having large peel strength and compatibility with fine pattern processes, which a copper foil being deposited with roughening particles to make the treated copper foil having a roughening treated side with surface roughness of 1.5 to 4.0 μm and luminosity of not more than 30, having projections formed from the roughening particles with a height of 1 to 5 μm, preferably 6 to 35 thereof are uniformly distributed in a 25 μm of surface length of copper foil cross-section observed, and its maximum width being at least 0.01 μm and not more than twice of 25 μm divided by the number of projections in the 25 μm surface length.
摘要翻译： 本发明的目的是提供一种具有低吸湿性和优异的高耐热性的介晶聚合物膜的处理铜箔，以制造具有大的剥离强度和与精细图案工艺相容的电路板复合材料，铜箔是 沉积有粗糙颗粒以使具有1.5至4.0μm的表面粗糙度和不大于30的表面粗糙度的粗糙化处理侧的处理过的铜箔具有由粗糙度为1至5μm，优选6至5μm的粗糙颗粒形成的突起 35均匀分布在观察到的铜箔截面的25μm的表面长度上，其最大宽度为25μm以上的0.01μm以上2倍以下，除以25μm的表面长度的突起数。
-
公开(公告)号：US20080005759A1
公开(公告)日：2008-01-03
申请号：US11766366
申请日：2007-06-21
申请人： Kiyoshi OMORI , Noriyoshi Ishii , Hideaki Tsutsumi , Shigeru Tamura , Katsunori Takahashi , Yuuji Suzuki , Yoichiro Mitsumoto , Manabu Obata
发明人： Kiyoshi OMORI , Noriyoshi Ishii , Hideaki Tsutsumi , Shigeru Tamura , Katsunori Takahashi , Yuuji Suzuki , Yoichiro Mitsumoto , Manabu Obata
IPC分类号： G11B7/24
CPC分类号： G11B17/051 , G11B17/0515
摘要： A disk drive device includes a device main body in which a disk slot for inserting and removing a disk-like recording medium is provided, a disk holding unit that rotatably holds the disk-like recording medium, a main chassis that supports the disk holding unit and a base unit, an arm unit rotatably supported on one or the other side in a plane parallel to the disk-like recording medium, an urging arm that urges the disk-like recording medium, a first centering member that supports the side of the disk-like recording medium, and a second centering member that supports the side of the disk-like recording medium. The first centering member and the second centering member are regulated in positions to support the side of the disk-like recording medium. The first centering member and the second centering member support the disk-like recording medium in a centering position.
摘要翻译： 磁盘驱动装置包括：设置有用于插入和移除盘状记录介质的盘槽的装置主体;可旋转地保持盘状记录介质的盘保持单元;支撑盘保持单元的主机架; 基座单元，可旋转地支撑在与盘状记录介质平行的平面中的一侧或另一侧的臂单元，推动盘状记录介质的推动臂，支撑所述盘状记录介质的一侧的第一定心构件 盘状记录介质和支撑盘状记录介质侧的第二定心构件。 第一定心构件和第二定心构件被调节在支撑盘状记录介质的侧面的位置。 第一定心构件和第二定心构件将盘状记录介质支撑在定心位置。
-
36.发明申请公开(公告)号：US20070141381A1
公开(公告)日：2007-06-21
申请号：US11639439
申请日：2006-12-15
IPC分类号： B22D25/00
CPC分类号： H05K3/025 , C25D1/04 , C25D1/20 , Y10T428/12438 , Y10T428/12458 , Y10T428/12514 , Y10T428/12771 , Y10T428/12812 , Y10T428/1284 , Y10T428/12854 , Y10T428/12861 , Y10T428/1291 , Y10T428/12931
摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.
摘要翻译： 一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷 电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基底的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，扩散防止层，释放 层和超薄铜箔，其中剥离层由用于保持剥离性的金属A形成，并且金属B用于促进超薄铜箔的镀覆，金属A的含量a和金属的含量b B形成释放层，满足以下等式：<？in-line-formula description =“In-line Formulas”end =“lead”？> 10 <= a /（a + b）* 100 <= 70 < line-formula description =“In-Line Formulas”end =“尾”？和通过使用这种超薄铜箔与载体制备的印刷电路板。
-
37.发明授权公开(公告)号：US06944280B2
公开(公告)日：2005-09-13
申请号：US09945753
申请日：2001-09-05
申请人： Yuuji Suzuki
发明人： Yuuji Suzuki
CPC分类号： H04M7/1255
摘要： In a gateway system for connecting a telephone network utilizing a common channel signaling system No. 7 to an IP (Internet Protocol) network, the gateway system includes a media gateway and a media gateway controller group including a plurality of media gateway controllers which are assigned a common point code. Any one of the media gateway controllers is for terminating a No. 7 signal representative of a control signal of the common channel signaling system No. 7 in the telephone network and for carrying out call control and connection control to the IP network by controlling the media gateway through the IP network so that a communication path is established between the telephone network and the media gateway. Each of the media gateway controllers comprises a No. 7 signal processing portion for terminating the No. 7 signal and a call processing control portion for carrying out the call control and the connection control to the IP network by controlling the media gateway through the IP network so that the communication path is established between the telephone network and the media gateway. The No. 7 signal processing portion and the call processing control portion have a M3UA (SS7 (Signaling System No. 7) MTP3-User Adaptation Layer) function.
摘要翻译： 在用于将使用公共信道信令系统7的电话网络连接到IP（因特网协议）网络的网关系统中，网关系统包括媒体网关和媒体网关控制器组，所述媒体网关和媒体网关控制器组包括被分配的多个媒体网关控制器 一个常见的点代码。 任何一个媒体网关控制器用于终止代表电话网络中公共信道信令系统No.7的控制信号的7号信号，并通过控制媒体来对IP网络进行呼叫控制和连接控制 网关通过IP网络，从而在电话网络和媒体网关之间建立通信路径。 每个媒体网关控制器包括用于终止No.7信号的7号信号处理部分和用于通过IP网络控制媒体网关来对IP网络执行呼叫控制和连接控制的呼叫处理控制部分 使得在电话网络和媒体网关之间建立通信路径。 No.7信号处理部分和呼叫处理控制部分具有M3UA（SS7（信令系统No.7）MTP3-用户适配层）功能。
-
公开(公告)号：US20050175826A1
公开(公告)日：2005-08-11
申请号：US11052998
申请日：2005-02-07
申请人： Yuuji Suzuki
发明人： Yuuji Suzuki
CPC分类号： C25D1/04 , C25D5/16 , C25D7/0614 , H05K3/384 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10T428/12063 , Y10T428/12438 , Y10T428/12903 , Y10T428/1291 , Y10T428/12993 , Y10T428/24917 , Y10T428/25
摘要： An object of the present invention is to provide a treated copper foil laminated with a mesomorphic polymer film having low hygroscopicity and superior high thermal resistance to make a circuit board composite materials having large peel strength and compatibility with fine pattern processes, which a copper foil being deposited with roughening particles to make the treated copper foil having a roughening treated side with surface roughness of 1.5 to 4.0 μm and luminosity of not more than 30, having projections formed from the roughening particles with a height of 1 to 5 μm, preferably 6 to 35 thereof are uniformly distributed in a 25 μm of surface length of copper foil cross-section observed, and its maximum width being at least 0.01 μm and not more than twice of 25 μm divided by the number of projections in the 25 μm surface length.
摘要翻译： 本发明的目的是提供一种具有低吸湿性和优异的高耐热性的介晶聚合物膜的处理铜箔，以制造具有大的剥离强度和与精细图案工艺相容的电路板复合材料，铜箔是 沉积有粗糙颗粒以使具有1.5至4.0μm的表面粗糙度和不大于30的表面粗糙度的粗糙化处理侧的处理过的铜箔具有由粗糙度为1至5μm，优选6至5μm的粗糙颗粒形成的突起 35均匀分布在观察到的铜箔截面的25μm的表面长度上，其最大宽度为25μm以上的0.01μm以上2倍以下，除以25μm的表面长度的突起数。
-
-
-
-
-
-
-
搜索结果
38 条记录 (耗时 0.08 秒)
