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    DISK DRIVE DEVICE
    1.
    发明申请
    DISK DRIVE DEVICE 失效
    磁盘驱动器

    公开(公告)号：US20080005759A1

    公开(公告)日：2008-01-03

    申请号：US11766366

    申请日：2007-06-21

    申请人： Kiyoshi OMORI ,  Noriyoshi Ishii ,  Hideaki Tsutsumi ,  Shigeru Tamura ,  Katsunori Takahashi ,  Yuuji Suzuki ,  Yoichiro Mitsumoto ,  Manabu Obata

    发明人： Kiyoshi OMORI ,  Noriyoshi Ishii ,  Hideaki Tsutsumi ,  Shigeru Tamura ,  Katsunori Takahashi ,  Yuuji Suzuki ,  Yoichiro Mitsumoto ,  Manabu Obata

    IPC分类号： G11B7/24

    CPC分类号： G11B17/051 ,  G11B17/0515

    摘要： A disk drive device includes a device main body in which a disk slot for inserting and removing a disk-like recording medium is provided, a disk holding unit that rotatably holds the disk-like recording medium, a main chassis that supports the disk holding unit and a base unit, an arm unit rotatably supported on one or the other side in a plane parallel to the disk-like recording medium, an urging arm that urges the disk-like recording medium, a first centering member that supports the side of the disk-like recording medium, and a second centering member that supports the side of the disk-like recording medium. The first centering member and the second centering member are regulated in positions to support the side of the disk-like recording medium. The first centering member and the second centering member support the disk-like recording medium in a centering position.

    摘要翻译： 磁盘驱动装置包括：设置有用于插入和移除盘状记录介质的盘槽的装置主体;可旋转地保持盘状记录介质的盘保持单元;支撑盘保持单元的主机架; 基座单元，可旋转地支撑在与盘状记录介质平行的平面中的一侧或另一侧的臂单元，推动盘状记录介质的推动臂，支撑所述盘状记录介质的一侧的第一定心构件 盘状记录介质和支撑盘状记录介质侧的第二定心构件。 第一定心构件和第二定心构件被调节在支撑盘状记录介质的侧面的位置。 第一定心构件和第二定心构件将盘状记录介质支撑在定心位置。

    Ultrathin copper foil with carrier and printed circuit board using same
    3.
    发明授权
    Ultrathin copper foil with carrier and printed circuit board using same 有权
    超薄铜箔带载体和印刷电路板使用相同

    公开(公告)号：US07892655B2

    公开(公告)日：2011-02-22

    申请号：US11610799

    申请日：2006-12-14

    申请人： Yuuji Suzuki ,  Takami Moteki ,  Kazuhiro Hoshino ,  Satoshi Fujisawa ,  Akira Kawakami

    发明人： Yuuji Suzuki ,  Takami Moteki ,  Kazuhiro Hoshino ,  Satoshi Fujisawa ,  Akira Kawakami

    IPC分类号： B32B15/00

    CPC分类号： C25D5/10 ,  B32B7/06 ,  B32B15/08 ,  B32B15/20 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2457/08 ,  H05K3/022 ,  Y10T428/12812 ,  Y10T428/1284 ,  Y10T428/12847 ,  Y10T428/12861 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/24917

    摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, an ultrathin copper foil with a carrier comprising a carrier foil, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70 and a printed circuit board prepared by using such an ultrathin copper foil with a carrier.

    摘要翻译： 一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷 电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基底的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，剥离层和超薄 铜箔，其中释放层由用于保持剥离性的金属A形成，金属B用于促进超薄铜箔的镀覆，金属A的含量a和形成剥离层的金属B的含量b 满足等式：10＆nlE; a /（a + b）* 100＆nlE; 70以及通过使用这种超薄铜箔与载体制备的印刷电路板。

    ULTRATHIN COPPER FOIL WITH CARRIER AND PRINTED CIRCUIT BOARD USING SAME
    4.
    发明申请
    ULTRATHIN COPPER FOIL WITH CARRIER AND PRINTED CIRCUIT BOARD USING SAME 有权
    超薄铜箔与载体和印刷电路板使用相同

    公开(公告)号：US20070154692A1

    公开(公告)日：2007-07-05

    申请号：US11610799

    申请日：2006-12-14

    申请人： Yuuji Suzuki ,  Takami Moteki ,  Kazuhiro Hoshino ,  Satoshi Fujisawa ,  Akira Kawakami

    发明人： Yuuji Suzuki ,  Takami Moteki ,  Kazuhiro Hoshino ,  Satoshi Fujisawa ,  Akira Kawakami

    IPC分类号： B32B3/00 ,  C25D5/10 ,  B32B7/00

    CPC分类号： C25D5/10 ,  B32B7/06 ,  B32B15/08 ,  B32B15/20 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2457/08 ,  H05K3/022 ,  Y10T428/12812 ,  Y10T428/1284 ,  Y10T428/12847 ,  Y10T428/12861 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/24917

    摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, an ultrathin copper foil with a carrier comprising a carrier foil, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70and a printed circuit board prepared by using such an ultrathin copper foil with a carrier.

    摘要翻译： 一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷 电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基座的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，剥离层和超薄 铜箔，其中释放层由用于保持剥离性的金属A形成，金属B用于促进超薄铜箔的镀覆，金属A的含量a和形成剥离层的金属B的含量b 满足公式：<？in-line-formula description =“In-line formula”end =“lead”？> 10 <= A /（a + b）* 100 <= 70 <？in-line-formula description = “直线公式”end =“tail”？>和打印的c 通过使用这种超薄铜箔与载体制备的电路板。

    Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board
    5.
    发明授权
    Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board 失效
    用载体生产超薄铜箔的方法，由其制造的载体的超薄铜箔，印刷电路板，多层印刷电路板和薄膜电路板上的芯片

    公开(公告)号：US07223481B2

    公开(公告)日：2007-05-29

    申请号：US10929471

    申请日：2004-08-31

    申请人： Yuuji Suzuki ,  Akira Matsuda

    发明人： Yuuji Suzuki ,  Akira Matsuda

    IPC分类号： B32B15/00

    CPC分类号： C25D1/04 ,  H01L2924/0002 ,  H05K3/025 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2201/0723 ,  Y10T428/12028 ,  Y10T428/12472 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/12535 ,  Y10T428/12778 ,  Y10T428/12806 ,  H01L2924/00

    摘要： An object of the present invention is to produce an ultra-thin copper foil with a carrier which has few pinholes and small surface roughness and which has an the thickness of less than 5 μm, and to produce the method of producing the foil, and further to produce a printed circuit board for fine pattern, a multilayer printed circuit board and a chip on film circuit board by using the ultra-thin copper foil with a carrier. The present invention provides an ultra-thin copper foil with a carrier produced by stacking a peeling layer and an ultra thin copper foil in order on the surface of a carrier copper foil which is made smooth so that the mean surface roughness of at least one side is Rz of 0.01 to 2.0 μm by the chemical polishing, the electrochemical dissolution, or the smoothing plating processing method independently, combining two or more, or further combining the mechanical polishing.

    摘要翻译： 本发明的目的是制造具有针孔小，表面粗糙度小，厚度小于5μm的载体的超薄铜箔，制造箔的制造方法 通过使用具有载体的超薄铜箔制造精细图案的印刷电路板，多层印刷电路板和薄膜电路板上的芯片。 本发明提供一种具有载体的超薄铜箔，其通过在载体铜箔的表面上依次层叠剥离层和超薄铜箔而制造，该载体铜箔的表面平滑，使得至少一个侧面的平均表面粗糙度 通过化学抛光，电化学溶解或平滑电镀处理方法独立地组合了两个或更多个，或进一步组合机械抛光，Rz为0.01〜2.0μm。

    Semiconductor integrated circuit device
    6.
    发明授权
    Semiconductor integrated circuit device 失效
    半导体集成电路器件

    公开(公告)号：US07078928B2

    公开(公告)日：2006-07-18

    申请号：US10736673

    申请日：2003-12-17

    申请人： Ryusuke Sahara ,  Kozaburo Kurita ,  Yuuji Suzuki ,  Mitsugu Kusunoki ,  Hideki Sakakibara

    发明人： Ryusuke Sahara ,  Kozaburo Kurita ,  Yuuji Suzuki ,  Mitsugu Kusunoki ,  Hideki Sakakibara

    IPC分类号： H03K19/00 ,  G01R31/28 ,  H03H11/26

    CPC分类号： G01R31/318577

    摘要： The present invention provides a semiconductor integrated circuit device equipped with at least one pulse generator which generates a pulse of a pulse with shorter than a rising time up to the full amplitude of a transfer signal.A first signal and a second signal supplied from outside through a first signal path and a second signal path are respectively transferred to the pulse generator. When a rising time up to the full amplitude at any one of buffers in the first signal path and the second signal path is longer than a pulse width of a pulse to be formed by the pulse generator, the difference in phase between the first signal and the second signal is caused to correspond to a pulse width of a first pulse.

    摘要翻译： 本发明提供一种配备有至少一个脉冲发生器的半导体集成电路器件，该脉冲发生器产生的脉冲脉冲短于传输信号的全幅度的上升时间。 通过第一信号路径和第二信号路径从外部提供的第一信号和第二信号分别传送到脉冲发生器。 当在第一信号路径和第二信号路径中的任何一个缓冲器上的上升时间达到全幅度时，脉冲发生器将形成的脉冲的脉冲宽度大于第一信号与第二信号路径之间的相位差 使第二信号对应于第一脉冲的脉冲宽度。

    Ink, production method of the same materials for producing the same and printed matter with the same
    7.
    发明授权
    Ink, production method of the same materials for producing the same and printed matter with the same 有权
    油墨，生产方法相同的材料用于生产相同和印刷品相同

    公开(公告)号：US06939400B2

    公开(公告)日：2005-09-06

    申请号：US10723265

    申请日：2003-11-25

    申请人： Yuuji Suzuki

    发明人： Yuuji Suzuki

    IPC分类号： C09D11/00

    CPC分类号： C09D11/037

    摘要： An ink comprises 100 parts by weight of an aluminum flake containing aluminum flakes of 0.5 μm or less, more preferably 0.3 μm or less, in thickness and 20 μm2 to 2,000 μm2 in flake area in a content of 75% or more, 3 to 200 parts by weight of a binding agent, and 600 to 4,000 parts by weight of a solvent, wherein the solvent is the one containing 20 wt % or more of 3-methyl-3-methoxy-1-butanol (MMB).

    摘要翻译： 油墨包含100重量份的含有0.5μm或更小，更优选0.3μm或更小的铝薄片的铝薄片，厚度为20μm至2,000μm2 / > 75％以上，3〜200重量份粘合剂和600〜4000重量份溶剂的片状区域，其中溶剂为含有20重量％以上的3- 甲基-3-甲氧基-1-丁醇（MMB）。

    Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier
    8.
    发明授权
    Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier 失效
    带载体的超薄铜箔，生产方法，印刷电路板采用超薄铜箔与载体

    公开(公告)号：US06924043B2

    公开(公告)日：2005-08-02

    申请号：US10698014

    申请日：2003-10-31

    申请人： Yuuji Suzuki ,  Akira Matsuda

    发明人： Yuuji Suzuki ,  Akira Matsuda

    IPC分类号： H05K1/09 ,  C25D1/04 ,  C25D1/22 ,  C25D5/10 ,  H05K3/02 ,  H05K3/38 ,  B32B15/00

    CPC分类号： C25D5/10 ,  C25D1/04 ,  C25D1/22 ,  H05K3/025 ,  H05K3/384 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/12771 ,  Y10T428/12806 ,  Y10T428/12847 ,  Y10T428/1291

    摘要： An ultra-thin copper foil with a carrier having a peeling layer able to withstand even high temperature working in the case of using a high heat resistant resin, enabling the carrier foil and the ultra-thin copper foil to be easily peeled apart, and reduced in the number of pinholes by uniform plating without impairing the peelability of the peeling layer, that is, an ultra-thin copper foil with a carrier comprised of a carrier foil, a peeling layer, and an ultra-thin copper foil, wherein the peeling layer and the ultra-thin copper foil are provided between them with a strike plating layer at the surface on the peeling layer side, an ultra-thin layer of copper is provided on this according to need, and an ultra-thin copper foil comprised of copper or a copper alloy or a phosphorus-containing copper or phosphorus-containing copper alloy is provided. The peeling layer between the carrier foil and the ultra-thin copper foil is chromium, a chromium alloy, a chromium-containing oxide hydrate layer, nickel, iron, or an alloy layer of the same or an oxide hydrate layer of the same.

    摘要翻译： 一种具有载体的超薄铜箔，其具有能够在使用高耐热性树脂的情况下能够承受甚至高温加工的剥离层，使得载体箔和超薄铜箔容易剥离，并且减少 在不损害剥离层的剥离性的同时通过均匀镀覆的针孔数，即具有载体箔，剥离层和超薄铜箔的载体的超薄铜箔，其中剥离 层和超薄铜箔之间设置有在剥离层侧的表面的触击镀层，根据需要在其上设置超薄铜层，并且由超薄铜箔构成的超薄铜箔 铜或铜合金或含磷铜或含磷铜合金。 载体箔和超薄铜箔之间的剥离层是铬，铬合金，含铬氧化物水合物层，镍，铁或其合金层，或者是氧化物水合物层。

    Surface treated electrodeposited copper foil and circuit board
    10.
    发明授权
    Surface treated electrodeposited copper foil and circuit board 失效
    表面处理电沉积铜箔和电路板

    公开(公告)号：US08153273B2

    公开(公告)日：2012-04-10

    申请号：US11808049

    申请日：2007-06-06

    申请人： Takahiro Saito ,  Sadao Matsumoto ,  Yuuji Suzuki

    发明人： Takahiro Saito ,  Sadao Matsumoto ,  Yuuji Suzuki

    IPC分类号： B32B15/04 ,  B32B15/20

    CPC分类号： H05K3/384 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12431 ,  Y10T428/12569 ,  Y10T428/12903

    摘要： A surface treated electrodeposited copper foil having a smooth M surface; a surface treatment is performed on the M surface being an opposite surface of a surface which contacted with a drum in an electrodeposited copper foil, wherein Rz is 1.0 μm or smaller and Ra is 0.2 μm or smaller on the M surface, electrodeposited copper plating is performed to produce a copper foil under a condition of using a copper sulfate bath, wherein a copper concentration is 50 to 80 g/l, a sulfuric acid concentration is 30 to 70 g/l, a solution temperature is 35 to 45° C., a chloride concentration is 0.01 to 30 ppm, an adding concentration of a total of an organic sulfur based compound, low molecular weight glue and polymeric polysaccharide is 0.1 to 100 ppm and TOC is 400 ppm or smaller, and a current density is 20 to 50 A/dm2.

    摘要翻译： 具有光滑M表面的经表面处理的电沉积铜箔; 在M表面上进行表面处理，M表面是与电沉积铜箔中的鼓接触的表面的相对表面，其中Rz为1.0μm以下，Ra为50μm以下，电镀铜为 在使用硫酸铜浴的条件下进行铜箔的制造，铜浓度为50〜80g / l，硫酸浓度为30〜70g / l，溶液温度为35〜45℃。 氯化物浓度为0.01〜30ppm，有机硫系化合物，低分子量胶和聚合多糖的总添加浓度为0.1〜100ppm，TOC为400ppm以下，电流密度为20〜 50 A / dm2。