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1.发明授权公开(公告)号：US07985488B2
公开(公告)日：2011-07-26
申请号：US12827018
申请日：2010-06-30
IPC分类号： B32B15/00
CPC分类号： H05K3/025 , C25D1/04 , C25D1/20 , Y10T428/12438 , Y10T428/12458 , Y10T428/12514 , Y10T428/12771 , Y10T428/12812 , Y10T428/1284 , Y10T428/12854 , Y10T428/12861 , Y10T428/1291 , Y10T428/12931
摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content “a” of the metal A and a content “b” of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70 and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.
摘要翻译： 一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷 电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基底的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，扩散防止层，释放 层和超薄铜箔，其中剥离层由用于保持剥离性质的金属A形成，金属B由金属A的含量“a”和含量“b 形成释放层的金属B满足等式：10＆nlE; a /（a + b）* 100＆nlE; 70以及通过使用这种超薄铜箔与载体制备的印刷电路板。
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2.发明授权公开(公告)号：US07985485B2
公开(公告)日：2011-07-26
申请号：US12556410
申请日：2009-09-09
CPC分类号： C25D1/04 , C25D7/0614 , H05K1/0237 , H05K1/09 , H05K2201/0355 , Y10S428/935 , Y10T428/12431 , Y10T428/12438 , Y10T428/12569 , Y10T428/1291
摘要： A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.
摘要翻译： 铜箔在高频下降低传输损耗，并且与树脂基板的粘合强度优异，其厚度方向至少包括粒状层和柱状层，所述柱状层形成在所述粒状层的至少一个表面上 铜箔或颗粒层形成在形成铜箔的柱状层的至少一个表面上，粒状层的厚度A与铜箔中柱状层的厚度B的关系优选为A /（ A + B）= 40〜99％，制造方法及其制造装置以及使用该方法的高频电路。
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3.发明申请COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND APPARATUS FOR PRODUCTION OF SAME, AND HIGH FREQUENCY CIRCUIT USING COPPER FOIL 失效用于高频电路的铜箔，用于生产它们的生产方法和装置以及使用铜箔的高频电路公开(公告)号：US20090324988A1
公开(公告)日：2009-12-31
申请号：US12556410
申请日：2009-09-09
CPC分类号： C25D1/04 , C25D7/0614 , H05K1/0237 , H05K1/09 , H05K2201/0355 , Y10S428/935 , Y10T428/12431 , Y10T428/12438 , Y10T428/12569 , Y10T428/1291
摘要： A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.
摘要翻译： 铜箔在高频下降低传输损耗，并且与树脂基板的粘合强度优异，其厚度方向至少包括粒状层和柱状层，所述柱状层形成在所述粒状层的至少一个表面上 铜箔或颗粒层形成在形成铜箔的柱状层的至少一个表面上，粒状层的厚度A与铜箔中柱状层的厚度B的关系优选为A /（ A + B）= 40〜99％，制造方法及其制造装置以及使用该方法的高频电路。
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4.发明授权公开(公告)号：US07892655B2
公开(公告)日：2011-02-22
申请号：US11610799
申请日：2006-12-14
IPC分类号： B32B15/00
CPC分类号： C25D5/10 , B32B7/06 , B32B15/08 , B32B15/20 , B32B2255/06 , B32B2255/205 , B32B2457/08 , H05K3/022 , Y10T428/12812 , Y10T428/1284 , Y10T428/12847 , Y10T428/12861 , Y10T428/1291 , Y10T428/12931 , Y10T428/24917
摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, an ultrathin copper foil with a carrier comprising a carrier foil, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70 and a printed circuit board prepared by using such an ultrathin copper foil with a carrier.
摘要翻译： 一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷 电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基底的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，剥离层和超薄 铜箔，其中释放层由用于保持剥离性的金属A形成，金属B用于促进超薄铜箔的镀覆，金属A的含量a和形成剥离层的金属B的含量b 满足等式：10＆nlE; a /（a + b）* 100＆nlE; 70以及通过使用这种超薄铜箔与载体制备的印刷电路板。
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5.发明申请公开(公告)号：US20070154692A1
公开(公告)日：2007-07-05
申请号：US11610799
申请日：2006-12-14
CPC分类号： C25D5/10 , B32B7/06 , B32B15/08 , B32B15/20 , B32B2255/06 , B32B2255/205 , B32B2457/08 , H05K3/022 , Y10T428/12812 , Y10T428/1284 , Y10T428/12847 , Y10T428/12861 , Y10T428/1291 , Y10T428/12931 , Y10T428/24917
摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, an ultrathin copper foil with a carrier comprising a carrier foil, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70and a printed circuit board prepared by using such an ultrathin copper foil with a carrier.
摘要翻译： 一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷 电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基座的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，剥离层和超薄 铜箔，其中释放层由用于保持剥离性的金属A形成，金属B用于促进超薄铜箔的镀覆，金属A的含量a和形成剥离层的金属B的含量b 满足公式：<？in-line-formula description =“In-line formula”end =“lead”？> 10 <= A /（a + b）* 100 <= 70 <？in-line-formula description = “直线公式”end =“tail”？>和打印的c 通过使用这种超薄铜箔与载体制备的电路板。
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6.发明申请COPPER FOIL FOR HIGH FREQUENCY CIRCUIT, METHOD OF PRODUCTION AND APPARATUS FOR PRODUCTION OF SAME, AND HIGH FREQUENCY CIRCUIT USING COPPER FOIL 审中-公开用于高频电路的铜箔，用于生产它们的生产方法和装置以及使用铜箔的高频电路公开(公告)号：US20110171486A1
公开(公告)日：2011-07-14
申请号：US13072220
申请日：2011-03-25
CPC分类号： C25D1/04 , C25D7/0614 , H05K1/0237 , H05K1/09 , H05K2201/0355 , Y10S428/935 , Y10T428/12431 , Y10T428/12438 , Y10T428/12569 , Y10T428/1291
摘要： A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.
摘要翻译： 铜箔在高频下降低传输损耗，并且与树脂基板的粘合强度优异，其厚度方向至少包括粒状层和柱状层，所述柱状层形成在所述粒状层的至少一个表面上 铜箔或颗粒层形成在形成铜箔的柱状层的至少一个表面上，粒状层的厚度A与铜箔中柱状层的厚度B的关系优选为A /（ A + B）= 40〜99％，制造方法及其制造装置以及使用该方法的高频电路。
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7.发明申请公开(公告)号：US20100270063A1
公开(公告)日：2010-10-28
申请号：US12827018
申请日：2010-06-30
CPC分类号： H05K3/025 , C25D1/04 , C25D1/20 , Y10T428/12438 , Y10T428/12458 , Y10T428/12514 , Y10T428/12771 , Y10T428/12812 , Y10T428/1284 , Y10T428/12854 , Y10T428/12861 , Y10T428/1291 , Y10T428/12931
摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content “a” of the metal A and a content “b” of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70 and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.
摘要翻译： 一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷 电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基底的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，扩散防止层，释放 层和超薄铜箔，其中剥离层由用于保持剥离性质的金属A形成，金属B由金属A的含量“a”和含量“b 形成释放层的金属B满足等式：10＆nlE; a /（a + b）* 100＆nlE; 70以及通过使用这种超薄铜箔与载体制备的印刷电路板。
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8.发明授权公开(公告)号：US07771841B2
公开(公告)日：2010-08-10
申请号：US11639439
申请日：2006-12-15
IPC分类号： B32B15/00
CPC分类号： H05K3/025 , C25D1/04 , C25D1/20 , Y10T428/12438 , Y10T428/12458 , Y10T428/12514 , Y10T428/12771 , Y10T428/12812 , Y10T428/1284 , Y10T428/12854 , Y10T428/12861 , Y10T428/1291 , Y10T428/12931
摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70 and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.
摘要翻译： 一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷 电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基底的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，扩散防止层，释放 层和超薄铜箔，其中剥离层由用于保持剥离性的金属A形成，并且金属B用于促进超薄铜箔的镀覆，金属A的含量a和金属的含量b B形成满足以下等式的剥离层：10＆lt; nlE; a /（a + b）* 100＆nlE; 70以及通过使用这种超薄铜箔与载体制备的印刷电路板。
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9.发明申请公开(公告)号：US20070141381A1
公开(公告)日：2007-06-21
申请号：US11639439
申请日：2006-12-15
IPC分类号： B22D25/00
CPC分类号： H05K3/025 , C25D1/04 , C25D1/20 , Y10T428/12438 , Y10T428/12458 , Y10T428/12514 , Y10T428/12771 , Y10T428/12812 , Y10T428/1284 , Y10T428/12854 , Y10T428/12861 , Y10T428/1291 , Y10T428/12931
摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, a ultrathin copper foil with a carrier comprising a carrier foil, a diffusion prevention layer, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70and a printed circuit board prepared by using such a ultrathin copper foil with a carrier.
摘要翻译： 一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷 电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基底的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，扩散防止层，释放 层和超薄铜箔，其中剥离层由用于保持剥离性的金属A形成，并且金属B用于促进超薄铜箔的镀覆，金属A的含量a和金属的含量b B形成释放层，满足以下等式：<？in-line-formula description =“In-line Formulas”end =“lead”？> 10 <= a /（a + b）* 100 <= 70 < line-formula description =“In-Line Formulas”end =“尾”？和通过使用这种超薄铜箔与载体制备的印刷电路板。
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10.发明申请Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil 审中-公开铜箔用于高频电路，生产方法及其生产设备，以及使用铜箔的高频电路公开(公告)号：US20070042212A1
公开(公告)日：2007-02-22
申请号：US11585881
申请日：2006-10-25
CPC分类号： C25D1/04 , C25D7/0614 , H05K1/0237 , H05K1/09 , H05K2201/0355 , Y10S428/935 , Y10T428/12431 , Y10T428/12438 , Y10T428/12569 , Y10T428/1291
摘要： A copper foil reducing transmission loss at a high frequency and excellent in bond strength with a resin substrate, including at least a granular layer and a columnar layer in its thickness direction, the columnar layer being formed on at least one surface of the granular layer forming the copper foil or the granular layer being formed on at least one surface of the columnar layer forming the copper foil, the relation of the thickness A of the granular layer and the thickness B of the columnar layer in the copper foil being preferably A/(A+B)=40 to 99%, a method of production and apparatus for production for the same, and a high frequency circuit using the same.
摘要翻译： 铜箔在高频下降低传输损耗，并且与树脂基板的粘合强度优异，其厚度方向至少包括粒状层和柱状层，所述柱状层形成在所述粒状层的至少一个表面上 铜箔或颗粒层形成在形成铜箔的柱状层的至少一个表面上，粒状层的厚度A与铜箔中柱状层的厚度B的关系优选为A /（ A + B）= 40〜99％，制造方法及其制造装置以及使用该方法的高频电路。
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