Fluorescein-labelled peptides
    35.
    发明授权
    Fluorescein-labelled peptides 失效
    荧光素标记的肽

    公开(公告)号:US07608243B2

    公开(公告)日:2009-10-27

    申请号:US10560062

    申请日:2004-07-07

    IPC分类号: A61K51/00 A61M36/14

    CPC分类号: C07K14/70546 A61K38/00

    摘要: The invention relates to new peptide-based compounds and their use in diagnostic optical imaging. More specifically the invention relates to the use of such peptide-based compounds as targeting vectors that bind to receptors associated with angiogenesis. The compounds are labeled with fluorescein and may be used as contrast agents in optical imaging in diagnosis of angiogenesis-related diseases.

    摘要翻译: 本发明涉及新的基于肽的化合物及其在诊断光学成像中的应用。 更具体地,本发明涉及这种基于肽的化合物作为与血管发生相关的受体结合的靶向载体的用途。 这些化合物用荧光素标记,可用作造影剂用于光学成像诊断血管发生相关疾病。

    Method for fabricating conducting plates for a high-Q MIM capacitor
    37.
    发明授权
    Method for fabricating conducting plates for a high-Q MIM capacitor 有权
    制造高Q MIM电容器导电板的方法

    公开(公告)号:US07601604B2

    公开(公告)日:2009-10-13

    申请号:US11549052

    申请日:2006-10-12

    IPC分类号: H01L21/4763

    摘要: A method of forming one or more capacitors on or in a substrate and a capacitor structure resulting therefrom is disclosed. The method includes forming a trench in the substrate, lining the trench with a first copper-barrier layer, and substantially filling the trench with a first copper layer. The first copper layer is substantially chemically isolated from the substrate by the first copper-barrier layer. A second copper-barrier layer is formed over the first copper layer and a first dielectric layer is formed over the second copper-barrier layer. The dielectric layer is substantially chemically isolated from the first copper layer by the second copper-barrier layer. A third copper-barrier layer is formed over the dielectric layer and a second copper layer is formed over the third copper-barrier layer. The second copper layer is formed in a non-damascene process.

    摘要翻译: 公开了一种在衬底上或衬底中形成一个或多个电容器的方法以及由此产生的电容器结构。 该方法包括在衬底中形成沟槽,用第一铜阻挡层衬套沟槽,并用第一铜层基本上填充沟槽。 第一铜层通过第一铜阻挡层与衬底基本上化学隔离。 在第一铜层上形成第二铜阻挡层,在第二铜阻挡层上形成第一电介质层。 电介质层通过第二铜阻挡层与第一铜层基本上化学隔离。 在电介质层上形成第三铜阻挡层,在第三铜阻挡层上形成第二铜层。 第二铜层以非镶嵌工艺形成。

    RADIOFLORINATION METHODS
    38.
    发明申请
    RADIOFLORINATION METHODS 审中-公开
    放射学方法

    公开(公告)号:US20080274052A1

    公开(公告)日:2008-11-06

    申请号:US12098537

    申请日:2008-04-07

    CPC分类号: C07B59/008

    摘要: The present invention relates to methods and reagents for [18F]-fluorination, particularly of peptides. The resultant 18F-labelled compounds are useful as radiopharmaceuticals, specifically for use in Positron Emission Tomography (PET). Thus, a compound of formula 18F-(Linker)-SH, such as a compound of formula (IV), (V), or (VI): may be reacted with an activated peptide as a means for 18F-labelling.

    摘要翻译: 本发明涉及[F 18 F] - 氟化,特别是肽的方法和试剂。 所得的18 F标记的化合物可用作放射性药物,特别用于正电子发射断层扫描(PET)。 因此,式(Ⅳ),(Ⅴ)或(Ⅵ)化合物可以将式(ⅩⅥ)F-(接头)-SH的化合物与活化肽作为 用于 18 F标签的方法。

    Method to fabricate aligned dual damascene openings
    39.
    发明授权
    Method to fabricate aligned dual damascene openings 有权
    制造对准双镶嵌开口的方法

    公开(公告)号:US07372156B2

    公开(公告)日:2008-05-13

    申请号:US11174805

    申请日:2005-07-05

    IPC分类号: H01L29/40

    摘要: An aligned dual damascene opening structure, comprising the following. A structure having a metal structure formed thereover. A patterned layer stack over the metal structure; the layer stack comprising, in ascending order: a patterned bottom etch stop layer; a patterned lower dielectric material layer; a patterned middle etch stop layer; and a patterned middle dielectric material layer; the lower and middle dielectric layers being comprised of the same material. An upper trench opening in the patterned bottom etch stop layer and the patterned lower dielectric material layer; and a lower via opening in the patterned middle etch stop layer and the patterned middle dielectric material layer. The lower via opening being in communication with the upper trench opening. Wherein the upper trench opening and the lower via opening comprise an aligned dual damascene opening.

    摘要翻译: 对准的双镶嵌开口结构,包括以下。 具有形成在其上的金属结构的结构。 金属结构上的图案层叠层; 所述层堆叠按升序包括:图案化的底部蚀刻停止层; 图案化的下介电材料层; 图案化的中间蚀刻停止层; 和图案化的中间介电材料层; 下部和中间介电层由相同的材料组成。 在图案化的底部蚀刻停止层和图案化的下部介电材料层中的上部沟槽开口; 以及图案化的中间蚀刻停止层和图案化的中间介电材料层中的下通孔开口。 下通道开口与上沟槽开口连通。 其中上沟槽开口和下通孔开口包括对准的双镶嵌开口。

    Radiofluorination methods
    40.
    发明授权
    Radiofluorination methods 失效
    放射性氟化方法

    公开(公告)号:US07368474B2

    公开(公告)日:2008-05-06

    申请号:US10508682

    申请日:2003-03-20

    IPC分类号: A61K51/08 A61K101/02

    CPC分类号: C07B59/008

    摘要: The present invention relates to methods and reagents for [18F]-fluorination, particularly of peptides. The resultant 18F-labelled compounds are useful as radiopharmaceuticals, specifically for use in Positron Emission Tomography (PET). Thus, a compound of formula 18F-(Linker)-SH, such as a compound of formula (IV), (V), or (VI): 18F—(CH2CH2O)n—(CH2)m—SH   (IV) 18F—(CH2)p—SH   (V) may be reacted with an activated peptide as a means for 18F-labelling.

    摘要翻译: 本发明涉及[F 18 F] - 氟化,特别是肽的方法和试剂。 所得的18 F标记的化合物可用作放射性药物,特别用于正电子发射断层扫描(PET)。 因此,通式(IV)的化合物,如式(IV),(V)或(VI)的化合物: “在线公式”end =“lead”?> 18 F-(CH 2 2 CH 2 O) β-H(IV)<βin-line-formula description =“In-line Formulas”end =“tail”?> < ?in-line-formula description =“In-line Formulas”end =“lead”?> 18 F-(CH 2) -SH(V)<βin-line-formula description =“In-line Formulas”end =“tail”?>可与活化肽反应,作为标记的标记。