公开(公告)号：US20050199422A1

公开(公告)日：2005-09-15

申请号：US10798389

申请日：2004-03-12

Applicant: Amid Hashim ,  Abner Joseph

Inventor： Amid Hashim ,  Abner Joseph

IPC: H01R12/04 ,  H01R24/00 ,  H05K1/02 ,  H05K1/11 ,  H05K1/16 ,  H05K3/46

CPC classification number: H05K1/0228 ,  H05K1/162 ,  H05K3/4626 ,  H05K3/4688 ,  H05K2201/09236 ,  H05K2201/09536 ,  H05K2201/09672

Abstract: A printed circuit board (PCB) is provided that maximizes compensation capacitance per unit area of the PCB while minimizing signal transmission delays in the PCB. The PCB includes a first section having a first dielectric constant (DK), a second section having a second DK lower than the first DK and provided above or below the first section, a plurality of crosstalk compensation elements provided in the first section, and a plurality of circuit elements provided in the second section.

Abstract translation: 提供了一个印刷电路板（PCB），可最大化印刷电路板每单位面积的补偿电容，同时最小化PCB中的信号传输延迟。 PCB包括具有第一介电常数（DK）的第一部分，具有低于第一DK的第二DK的第二部分并且设置在第一部分的上方或下方的第一部分，设置在第一部分中的多个串扰补偿元件，以及 设置在第二部分中的多个电路元件。

公开(公告)号：US20100190357A1

公开(公告)日：2010-07-29

申请号：US12359453

申请日：2009-01-26

Applicant: Amid Hashim

Inventor： Amid Hashim

IPC: H01R12/00 ,  H05K1/18

CPC classification number: H05K1/0228 ,  H01R4/2429 ,  H01R13/6464 ,  H01R13/6466 ,  H01R13/6467 ,  H01R13/6625 ,  H01R13/6633 ,  H01R13/6658 ,  H01R13/719 ,  H01R24/64 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/10189

Abstract: Printed wiring boards for communications connectors are provided that include a mounting substrate having at least first through third input terminals and first through third output terminals. A first conductive path connects the first input terminal to the first output terminal, a second conductive path connects the second input terminal to the second output terminal and a third conductive path connects the third input terminal to the third output terminal. A first inductor and a first capacitor are coupled between the first conductive path and the second conductive path, where the first inductor and the first capacitor are arranged in series to provide a first series inductor-capacitor circuit. A second capacitor is coupled between the third conductive path and the second conductive path through the first inductor to provide a second series inductor-capacitor circuit that shares the inductor of the first series inductor-capacitor circuit. Communications connectors that include such wiring boards or equivalent structures are also provided.

Abstract translation: 提供了用于通信连接器的印刷线路板，其包括具有至少第一至第三输入端子和第一至第三输出端子的安装基板。 第一导电路径将第一输入端子连接到第一输出端子，第二导电路径将第二输入端子连接到第二输出端子，第三导电路径将第三输入端子连接到第三输出端子。 第一电感器和第一电容器耦合在第一导电路径和第二导电路径之间，其中第一电感器和第一电容器串联布置以提供第一串联电感器 - 电容器电路。 第二电容器通过第一电感器耦合在第三导电路径和第二导电路径之间，以提供共享第一串联电感器 - 电容器电路的电感器的第二串联电感器 - 电容器电路。 还提供了包括这种接线板或等效结构的通信连接器。

公开(公告)号：US07677930B2

公开(公告)日：2010-03-16

申请号：US12168387

申请日：2008-07-07

Applicant: Amid Hashim ,  Julian Robert Pharney

Inventor： Amid Hashim ,  Julian Robert Pharney

IPC: H01R24/00

CPC classification number: H05K1/0228 ,  H01R13/6469 ,  H01R24/64 ,  H05K1/0298 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/09236 ,  H05K2201/10189 ,  Y10S439/941

Abstract: A connector is provided for simultaneously improving both the NEXT high frequency performance when low crosstalk plugs are used and the NEXT low frequency performance when high crosstalk plugs are used. The connector includes a first compensation structure provided on an inner metalized layer of the PCB at a first stage area of the PCB, and a second compensation structure, provided at a second stage area of the PCB, for increasing compensation capacitance with increasing frequency.

Abstract translation: 提供连接器，用于当使用低串扰插头时同时提高NEXT高频性能，并且当使用高串扰插头时NEXT低频性能。 连接器包括在PCB的第一级区域设置在PCB的内部金属化层上的第一补偿结构和设置在PCB的第二级区域的第二补偿结构，用于以增加的频率增加补偿电容。

公开(公告)号：US07559789B2

公开(公告)日：2009-07-14

申请号：US12362764

申请日：2009-01-30

Applicant: Amid Hashim

Inventor： Amid Hashim

IPC: H01R4/24

CPC classification number: H01R4/2433 ,  H01R4/245 ,  H01R13/6467 ,  Y10S439/922 ,  Y10S439/939

Abstract: Communications connectors are disclosed that include a housing having an upper end and a lower end, the upper end of the housing including a plurality of slits that define a plurality of pillars. First and second pairs of tip and ring insulation displacement contacts (IDCs) are mounted in the housing. Each of the IDCs has an upper end that has a first slot, a lower end that has a second slot and an intermediate portion between the upper end and the lower end, the lower end being offset from the upper end. The first slot of each IDC is aligned with a respective one of the slits. The housing further includes through slots that are separated by dividers, where each of the through slots is sized to receive the upper end of a respective one of the IDCs, and each slit of the plurality of slits exposes inner edges of the first slot of a respective one of the IDCs.

Abstract translation: 公开了通信连接器，其包括具有上端和下端的壳体，壳体的上端包括限定多个支柱的多个狭缝。 第一和第二对尖端和环形绝缘位移触点（IDC）安装在外壳中。 每个IDC具有上端，其具有第一槽，具有第二槽的下端和在上端和下端之间的中间部分，下端偏离上端。 每个IDC的第一槽与相应的一个狭缝对准。 壳体还包括通过分隔件隔开的通孔，其中每个通孔的尺寸被设计成接纳相应一个IDC的上端，并且多个狭缝的每个狭缝暴露出第一槽的内边缘 各自的IDC之一。

公开(公告)号：US07459640B2

公开(公告)日：2008-12-02

申请号：US11734263

申请日：2007-04-11

Applicant: Luc Adriaenssens ,  Amid Hashim ,  Troy Long

Inventor： Luc Adriaenssens ,  Amid Hashim ,  Troy Long

IPC: H05K1/00

CPC classification number: H01R13/6466 ,  H05K1/0228 ,  H05K1/0231 ,  H05K1/0298 ,  H05K1/162 ,  H05K3/4688 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09672 ,  H05K2201/10189

Abstract: A connector is provided for simultaneously improving both the NEXT high frequency performance when low crosstalk plugs are used and the NEXT low frequency performance when high crosstalk plugs are used. The connector includes PCB substrates made of materials having different dielectric frequency characteristics.

Abstract translation: 提供连接器，用于当使用低串扰插头时同时提高NEXT高频性能，并且当使用高串扰插头时NEXT低频性能。 连接器包括由具有不同介电频率特性的材料制成的PCB衬底。

公开(公告)号：US07410367B2

公开(公告)日：2008-08-12

申请号：US11657024

申请日：2007-01-24

Applicant: Amid Hashim ,  Julian Robert Pharney

Inventor： Amid Hashim ,  Julian Robert Pharney

IPC: H01R12/00

CPC classification number: H05K1/0228 ,  H01R13/6469 ,  H01R24/64 ,  H05K1/0298 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/09236 ,  H05K2201/10189 ,  Y10S439/941

Abstract: A connector is provided for simultaneously improving both the NEXT high frequency performance when low crosstalk plugs are used and the NEXT low frequency performance when high crosstalk plugs are used. The connector includes a first compensation structure provided on an inner metalized layer of the PCB at a first stage area of the PCB, and a second compensation structure, provided at a second stage area of the PCB, for increasing compensation capacitance with increasing frequency.

Abstract translation: 提供连接器，用于当使用低串扰插头时同时提高NEXT高频性能，并且当使用高串扰插头时NEXT低频性能。 连接器包括在PCB的第一级区域设置在PCB的内部金属化层上的第一补偿结构和设置在PCB的第二级区域的第二补偿结构，用于以增加的频率增加补偿电容。

公开(公告)号：US20070184724A1

公开(公告)日：2007-08-09

申请号：US11734263

申请日：2007-04-11

Applicant: Luc Adriaenssens ,  Amid Hashim ,  Troy Long

Inventor： Luc Adriaenssens ,  Amid Hashim ,  Troy Long

IPC: H01R24/00

CPC classification number: H01R13/6466 ,  H05K1/0228 ,  H05K1/0231 ,  H05K1/0298 ,  H05K1/162 ,  H05K3/4688 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09672 ,  H05K2201/10189

Abstract: A connector is provided for simultaneously improving both the NEXT high frequency performance when low crosstalk plugs are used and the NEXT low frequency performance when high crosstalk plugs are used. The connector includes PCB substrates made of materials having different dielectric frequency characteristics.

Abstract translation: 提供连接器，用于当使用低串扰插头时同时提高NEXT高频性能，并且当使用高串扰插头时NEXT低频性能。 连接器包括由具有不同介电频率特性的材料制成的PCB衬底。

公开(公告)号：US20070178772A1

公开(公告)日：2007-08-02

申请号：US11688458

申请日：2007-03-20

Applicant: Amid Hashim ,  Robert Goodrich

Inventor： Amid Hashim ,  Robert Goodrich

IPC: H01R24/00

CPC classification number: H01R13/6469 ,  H01R24/64 ,  Y10S439/941

Abstract: A communications jack assembly includes: a jack frame having a plug aperture; a dielectric mounting substrate attached to the jack frame; and a plurality of conductors engaged with the mounting substrate, each of the conductors including a fixed end portion mounted with the mounting substrate and a free end portion extending into the plug aperture for electrical contact with a mating plug, each of the free end portions having substantially the same profile and being substantially transversely aligned in side-by-side relationship. A first pair of conductors is sandwiched inside a second pair of conductors. The second pair of conductors includes a crossover, the positioning of crossover being selected to provide differential to common mode crosstalk compensation.

Abstract translation: 通信插座组件包括：具有插头孔的插座框架; 安装在所述插座框架上的电介质安装基板; 以及与安装基板接合的多个导体，每个导体包括安装有安装基板的固定端部和延伸到插头孔中的自由端部，用于与匹配插头电接触，每个自由端部具有 基本上相同的轮廓并且以并排关系基本上横向对齐。 第一对导体被夹在第二对导体内。 第二对导体包括交叉，选择交叉的定位以提供对共模串扰补偿的差分。

公开(公告)号：US20070111565A1

公开(公告)日：2007-05-17

申请号：US11621330

申请日：2007-01-09

Applicant: Amid Hashim

Inventor： Amid Hashim

IPC: H05K1/00

CPC classification number: H01R13/6466 ,  H01R13/6469 ,  H01R13/6658 ,  H01R24/64 ,  H05K1/0216 ,  H05K1/117 ,  H05K2201/09781 ,  Y10S439/941 ,  Y10S439/951

Abstract: A connector is provided for compensating crosstalk with respect to an adjacently placed connector. Each of the connectors includes a printed circuit board (PCB), a plurality of pairs of contacts on the PCB, a plurality of pads disposed at edge portions of the PCB for compensating crosstalk, and a plurality of connecting parts for connecting electrically the pads to the pairs of contacts.

Abstract translation: 提供连接器用于补偿相对于相邻放置的连接器的串扰。 每个连接器包括印刷电路板（PCB），PCB上的多对触点，设置在PCB的边缘部分以补偿串扰的多个焊盘，以及用于将焊盘电连接到多个连接部分 这对联系人。

公开(公告)号：US07186149B2

公开(公告)日：2007-03-06

申请号：US11230442

申请日：2005-09-20

Applicant: Amid Hashim

Inventor： Amid Hashim

IPC: H01R24/00 ,  H01R13/625

CPC classification number: H05K1/0228 ,  H01R4/242 ,  H01R13/6469 ,  H01R13/6658 ,  H01R24/64 ,  H05K2201/09245 ,  H05K2201/10189 ,  Y10S439/941

Abstract: A communications connector includes: a dielectric mounting substrate; at least four pairs of conductors mounted on the mounting substrate, each of the conductors including a free end segment, each of the free end segments being positioned in side-by-side and generally parallel relationship; and at least four pairs of terminals mounted on the mounting substrate, wherein each of the pairs of terminals is electrically connected to a respective pair of conductors. A first pair of conductor free end segments is immediately adjacent each other, a second pair of conductor free end segments is immediately adjacent each other and positioned one side of the first pair, a fourth pair of conductor free end segments is immediately adjacent each other and positioned on an opposite side of the first pair, and a third pair of conductor free end segments sandwiches the first pair, with one of the conductor free end segments of the third pair being disposed between the first and second pairs, and the other of the conductor free end segments being disposed between the first and fourth pairs. Each of the first, second and fourth pairs of conductors includes a crossover between the conductors of the pairs, and the third pair of conductors includes three crossovers between its conductors.

Abstract translation: 通信连接器包括：电介质安装基板; 安装在所述安装基板上的至少四对导体，每个所述导体包括自由端段，每个所述自由端段以并排方式并且大致平行的关系定位; 以及安装在安装基板上的至少四对端子，其中每对端子电连接到相应的一对导体。 第一对导体自由端段彼此紧邻，第二对导体自由端段彼此紧邻并且位于第一对的一侧，第四对导体自由端段彼此紧邻， 定位在第一对的相对侧上，第三对导体自由端段夹住第一对，第三对中的一个导体自由端段设置在第一对和第二对之间，另一个 导体自由端段设置在第一和第四对之间。 第一，第二和第四对导体中的每一个包括在对的导体之间的交叉，并且第三对导体在其导体之间包括三个交叉。