公开(公告)号：US07390429B2

公开(公告)日：2008-06-24

申请号：US11312823

申请日：2005-12-19

申请人： Feng Q. Liu ,  Tianbao Du ,  Alain Duboust ,  Wei-Yung Hsu

发明人： Feng Q. Liu ,  Tianbao Du ,  Alain Duboust ,  Wei-Yung Hsu

IPC分类号： C09K13/00 ,  C09K13/04 ,  C09K13/06

CPC分类号： H01L21/32125 ,  B23H5/08 ,  C25F3/02 ,  H01L21/7684

摘要： A method of processing a substrate having a conductive material layer disposed thereon is provided which includes positioning the substrate in a process apparatus and supplying a first polishing composition between to the substrate. The polishing composition comprises a first chelating agent, a second chelating agent, a first corrosion inhibitor, a second corrosion inhibitor, a suppressor, a solvent, and an inorganic acid based electrolyte to provide a pH between about 3 and about 10.

摘要翻译： 提供一种处理其上设置有导电材料层的基板的方法，其包括将基板定位在处理装置中并将第一抛光组合物提供到基板之间。 抛光组合物包括第一螯合剂，第二螯合剂，第一腐蚀抑制剂，第二腐蚀抑制剂，抑制剂，溶剂和无机酸基电解质，以提供约3至约10的pH。

公开(公告)号：US20070227902A1

公开(公告)日：2007-10-04

申请号：US11392193

申请日：2006-03-29

申请人： Tianbao Du ,  Feng Liu ,  May Yu ,  Alain Duboust ,  Wei-Yung Hsu

发明人： Tianbao Du ,  Feng Liu ,  May Yu ,  Alain Duboust ,  Wei-Yung Hsu

IPC分类号： B23H5/08

CPC分类号： B23H5/08 ,  B24B49/00 ,  B24B53/017

摘要： A method for controlling the removal rate of material from a substrate during a polishing process is described. In one embodiment, the pre-polish profile of the substrate is determined and polishing pad conditioning parameters are adjusted based on that profile. Parameters such as conditioning head sweep range and frequency, and conditioning element downforce and RPM may be adjusted to selectively condition portions of the pad to maintain optimum polishing qualities of the pad.

摘要翻译： 描述了一种用于在抛光过程中控制来自基底的材料的去除速率的方法。 在一个实施例中，确定基板的预抛光轮廓并且基于该轮廓来调整抛光垫调节参数。 可以调节诸如调节头扫描范围和频率以及调节元件下压力和RPM的参数以选择性地调节焊盘的部分以保持焊盘的最佳抛光质量。

公开(公告)号：US20060169597A1

公开(公告)日：2006-08-03

申请号：US11356352

申请日：2006-02-15

申请人： Feng Liu ,  Tianbao Du ,  Alain Duboust ,  Wei-Yung Hsu ,  Robert Ewald ,  Yuan Tian ,  You Wang ,  Stan Tsai

发明人： Feng Liu ,  Tianbao Du ,  Alain Duboust ,  Wei-Yung Hsu ,  Robert Ewald ,  Yuan Tian ,  You Wang ,  Stan Tsai

IPC分类号： B23H9/00 ,  B23H7/00

CPC分类号： C25F3/02 ,  B23H5/08

摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, a corrosion inhibitor having an azole group, an organic acid salt, a pH adjusting agent to provide a pH between about 2 and about 10, and a solvent, and a solvent. The composition may be used in a conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer. The polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface, such as copper, with a reduction in planarization type defects and yielding a desirable surface finish.

摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料的方法。 在一个方面，组合物包括酸基电解质体系，具有唑基的腐蚀抑制剂，有机酸盐，pH调节剂以提供约2至约10的pH以及溶剂和溶剂。 该组合物可以用于导电材料去除工艺中，包括在包括电极的工艺设备中设置其上形成有导电材料层的衬底，在电极和衬底之间提供组合物，在电极和衬底之间施加偏压，以及 从导电材料层去除导电材料。 本文所述的抛光组合物和方法提高了材料从衬底表面（例如铜）的有效去除速率，同时平坦化型缺陷减少并产生理想的表面光洁度。

公开(公告)号：US20060102872A1

公开(公告)日：2006-05-18

申请号：US11312823

申请日：2005-12-19

申请人： Feng Liu ,  Tianbao Du ,  Alain Duboust ,  Wei-Yung Hsu

发明人： Feng Liu ,  Tianbao Du ,  Alain Duboust ,  Wei-Yung Hsu

IPC分类号： C09K13/00 ,  C09K13/04

CPC分类号： H01L21/32125 ,  B23H5/08 ,  C25F3/02 ,  H01L21/7684

摘要： A method of processing a substrate having a conductive material layer disposed thereon is provided which includes positioning the substrate in a process apparatus and supplying a first polishing composition between to the substrate. The polishing composition comprises a first chelating agent, a second chelating agent, a first corrosion inhibitor, a second corrosion inhibitor, a suppressor, a solvent, and an inorganic acid based electrolyte to provide a pH between about 3 and about 10.

摘要翻译： 提供一种处理其上设置有导电材料层的基板的方法，其包括将基板定位在处理装置中并将第一抛光组合物提供到基板之间。 抛光组合物包括第一螯合剂，第二螯合剂，第一腐蚀抑制剂，第二腐蚀抑制剂，抑制剂，溶剂和无机酸基电解质，以提供约3至约10的pH。

公开(公告)号：US20110132884A1

公开(公告)日：2011-06-09

申请号：US12851442

申请日：2010-08-05

申请人： Antoine P. Manens ,  Wei-Sheng Lei ,  Wei-Yung Hsu ,  Bassam Shamoun ,  Yan Wang

发明人： Antoine P. Manens ,  Wei-Sheng Lei ,  Wei-Yung Hsu ,  Bassam Shamoun ,  Yan Wang

IPC分类号： B23K26/00

CPC分类号： H01L31/18 ,  B23K26/0673 ,  B23K26/082 ,  B23K26/364

摘要： Laser systems for laser scribing are provided. The systems include a remote module coupled to a laser module through a cable. The remote module includes a controller and a chiller. The laser module has at least a laser source and a cooling plate. The laser module is operable to remove material from at least a portion of a workpiece. The systems also include a plurality of termination modules coupled to the laser module through a plurality of optical fibers. Each of the termination modules includes a mechanical interface. The mechanical interface is coupled to a respective optical fiber. The systems further include a plurality of scanning devices operable to control a position of the output from the laser. Each of the scanning devices is coupled to a respective mechanical interface.

摘要翻译： 提供激光划线的激光系统。 该系统包括通过电缆耦合到激光模块的远程模块。 远程模块包括控制器和冷却器。 激光模块至少具有激光源和冷却板。 激光模块可操作以从工件的至少一部分去除材料。 该系统还包括通过多根光纤耦合到激光模块的多个端接模块。 每个终端模块包括机械接口。 机械接口耦合到相应的光纤。 该系统还包括可操作以控制来自激光器的输出位置的多个扫描装置。 每个扫描装置耦合到相应的机械接口。

公开(公告)号：US20120234238A1

公开(公告)日：2012-09-20

申请号：US13419121

申请日：2012-03-13

申请人： Wei-Yung Hsu ,  Hua Chung ,  Ting-Ruei Shiu ,  Jie Cui

发明人： Wei-Yung Hsu ,  Hua Chung ,  Ting-Ruei Shiu ,  Jie Cui

IPC分类号： C23C16/52 ,  G01N3/00

CPC分类号： G01N3/20 ,  G01N3/068 ,  G01N3/12 ,  G01N2203/0282 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/67207 ,  H01L21/67288 ,  H01L21/67754 ,  H01L21/68764 ,  H01L21/68771

摘要： Integrated wafer or substrate bow measurement modules are described. For example, a multi-chamber system includes a chamber housing a bow measurement module. In another example, a method of pre-screening a wafer includes inserting a wafer or a substrate into a multi-chamber system. A bow parameter of the wafer or the substrate is measured in a bow measurement module housed in a chamber of the multi-chamber system.

摘要翻译： 描述了集成的晶片或衬底弓测量模块。 例如，多室系统包括容纳弓测量模块的腔室。 在另一示例中，预筛选晶片的方法包括将晶片或基板插入多室系统中。 在容纳在多室系统的室中的弓测量模块中测量晶片或基板的弓形参数。

公开(公告)号：US20110253685A1

公开(公告)日：2011-10-20

申请号：US13076422

申请日：2011-03-30

申请人： Wei-Yung Hsu ,  Antoine P. Manens

发明人： Wei-Yung Hsu ,  Antoine P. Manens

IPC分类号： B23K26/00

CPC分类号： B23K26/046 ,  B23K26/364 ,  B23K26/40 ,  B23K2103/16 ,  B23K2103/42 ,  B23K2103/50

摘要： Systems for scribing a workpiece incorporate a motorized beam expander to change a laser beam spot size incident on a workpiece. A system includes a frame, a laser coupled with the frame and generating an output to remove material from at least a portion of a workpiece, a beam expander positioned along a path of the laser output and having a motorized mechanism operable to vary a beam expansion ratio applied to the laser output, and at least one scanning device coupled with the frame and operable to control a position of the laser output, after expansion, on the workpiece. The motorized beam expander can be used to selectively vary the width of a laser beam supplied to a scanning device so as to selectively vary the size of the laser beam incident on the workpiece. Alternatively, a variable aperture can be used instead of a beam expander.

摘要翻译： 用于对工件进行划线的系统包括电动束扩张器以改变入射在工件上的激光束斑点尺寸。 一种系统包括框架，激光器与框架耦合并且产生输出以从工件的至少一部分移除材料;沿着激光输出路径定位的光束扩展器，并具有可操作以改变光束膨胀的电动机构 以及至少一个与框架耦合的扫描装置，并可操作以控制激光输出在膨胀之后在工件上的位置。 电动光束扩展器可以用于选择性地改变提供给扫描装置的激光束的宽度，以便选择性地改变入射在工件上的激光束的尺寸。 或者，可以使用可变光圈来代替光束扩展器。

公开(公告)号：US20110198322A1

公开(公告)日：2011-08-18

申请号：US12851471

申请日：2010-08-05

申请人： Antoine P. Manens ,  Ting-Ruei Shiu ,  Bassam Shamoun ,  Wei-Yung Hsu ,  Manivannan Thothadri

发明人： Antoine P. Manens ,  Ting-Ruei Shiu ,  Bassam Shamoun ,  Wei-Yung Hsu ,  Manivannan Thothadri

IPC分类号： B23K26/00 ,  G01J1/42 ,  H04N7/18

CPC分类号： B23K26/048 ,  B23K26/032 ,  B23K26/0673 ,  B23K26/082 ,  B23K26/083 ,  B23K26/364 ,  B23K26/40 ,  B23K26/705 ,  B23K2103/172 ,  H01L31/046 ,  H01L31/0463 ,  Y02E10/50

摘要： In-line metrology methods and systems for use with laser-scribing systems used in solar-cell fabrication are disclosed. Such methods and systems can involve a variety of components, for example, a device for measuring the amount of power input to a laser, a power meter for measuring laser output power, a beam viewer for measuring aspects of a laser beam, a height sensor for measuring a workpiece height, a microscope for measuring workpiece features formed by the laser-scribing system, and a system for monitoring a laser-scribing system and annunciating a warning(s) and/or an error message(s) when operational limits are exceeded. In-line metrology methods can also include the processing of output beam reflections so as to track beam drift over time and/or provide for focusing of an imaging device.

摘要翻译： 公开了用于太阳能电池制造中使用的激光划线系统的在线测量方法和系统。 这样的方法和系统可以涉及各种部件，例如，用于测量激光输入功率的装置，用于测量激光输出功率的功率计，用于测量激光束的方面的光束观察器，高度传感器 用于测量工件高度的显微镜，用于测量由激光划线系统形成的工件特征的显微镜，以及用于监视激光划线系统的系统，并且当操作限度为...时，发出警告和/或错误消息 超过了 在线测量方法还可以包括输出光束反射的处理，以便随时间跟踪光束漂移和/或提供成像装置的聚焦。

公开(公告)号：US20100252543A1

公开(公告)日：2010-10-07

申请号：US12621316

申请日：2009-11-18

申请人： Antoine P. Manens ,  Wei-Yung Hsu

发明人： Antoine P. Manens ,  Wei-Yung Hsu

IPC分类号： B23K26/00

CPC分类号： B23K26/082 ,  B23K26/702

摘要： The present disclosure relates to apparatuses and systems for laser scribing a vertically-oriented workpiece. In many embodiments, a laser-scribing apparatus includes a frame, a first fixture coupled with the frame, a second fixture coupled with the frame, a laser operable to generate output able to remove material from at least a portion of the workpiece, and a scanning device coupled with the laser and the frame. The first fixture is configured for engagement with a first portion of the workpiece. The second fixture is configured for engagement with a second portion of the workpiece. When the workpiece is engaged by the first and second fixtures the workpiece is substantially vertically oriented. The scanning device is operable to control a position of the output from the laser relative to the workpiece.

摘要翻译： 本公开涉及用于激光划线垂直取向的工件的装置和系统。 在许多实施例中，激光划线设备包括框架，与框架连接的第一固定件，与框架连接的第二固定件，可操作以产生能够从工件的至少一部分移除材料的激光器，以及 与激光和框架耦合的扫描装置。 第一夹具构造成与工件的第一部分接合。 第二夹具被构造成与工件的第二部分接合。 当工件被第一和第二固定件接合时，工件基本上垂直定向。 扫描装置可操作以控制来自激光器的输出相对于工件的位置。

公开(公告)号：US20080293331A1

公开(公告)日：2008-11-27

申请号：US12124153

申请日：2008-05-21

申请人： Yufei Chen ,  Zhenhua Zhang ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Makoto Matsuo

发明人： Yufei Chen ,  Zhenhua Zhang ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Makoto Matsuo

IPC分类号： B24B9/06 ,  C08J5/14

CPC分类号： B24B9/065 ,  B24B21/002

摘要： Apparatus and methods are provided relating to polishing a substrate using a polishing device, such as a polishing tape. The polishing device may be formed to include a base, a resin layer adhering to the base, and a plurality of embossed abrasive particles and/or abrasive beads affixed to the base by the resin layer. The plurality of abrasive particles and/or beads may be embossed in the resin layer. The plurality of abrasive beads may include a plurality of abrasive particles suspended in binder material. The plurality of abrasive particles and/or beads and the resin layer combine to form an abrasive side of the polishing device adapted to contact the substrate. Polishing of the substrate preferably includes polishing an edge of the substrate while the substrate is rotated by a holding device such that no apparatus other than the polishing tape contacts the edge while the substrate is rotating.

摘要翻译： 提供的装置和方法涉及使用诸如抛光带的抛光装置来抛光衬底。 抛光装置可以形成为包括基底，粘附到基底的树脂层和由树脂层固定到基底的多个压花磨料颗粒和/或研磨珠。 多个研磨颗粒和/或珠可以在树脂层中压花。 多个研磨珠可以包括悬挂在粘合剂材料中的多个磨料颗粒。 多个研磨颗粒和/或珠粒和树脂层组合形成适于接触基底的抛光装置的研磨侧。 衬底的抛光优选包括在通过保持装置旋转衬底的同时抛光衬底的边缘，使得除了研磨带之外的其它装置在衬底旋转时不接触边缘。