Plasma processing equipment
    33.
    发明授权
    Plasma processing equipment 有权
    等离子体处理设备

    公开(公告)号:US06211622B1

    公开(公告)日:2001-04-03

    申请号:US09435768

    申请日:1999-11-08

    IPC分类号: H01J2702

    CPC分类号: H01J37/32009 H01J37/3233

    摘要: A plurality of extracting orifices 42 for extracting the electron beam from a discharge portion 2 into a plasma process chamber 3 via a compartment 4 are provided radially. A plurality of accelerating electrodes 36, 37 are arranged in the process chamber 3. The electron extracting direction from the extracting orifices 42 is set in substantially parallel with an object surface 35. The number and the arrangement of the accelerating electrodes 36, 37 are set such that a density distribution of the excited plasma has an oprimal state for processing the object. The object having a large area can be processed appropriately.

    摘要翻译: 多个提取孔42用于通过隔室4将电子束从排出部分2提取到等离子体处理室3中。 多个加速电极36,37布置在处理室3中。来自提取孔42的电子提取方向被设置为与物体表面35大致平行。加速电极36,37的数量和布置被设定 使得激发的等离子体的密度分布具有用于处理物体的oprimal状态。 可以适当地处理具有大面积的物体。

    Semiconductor device
    34.
    发明授权
    Semiconductor device 失效
    半导体器件

    公开(公告)号:US5629534A

    公开(公告)日:1997-05-13

    申请号:US691416

    申请日:1996-08-02

    CPC分类号: H01L31/173 H04B10/802

    摘要: There is provided a monolithic photocoupler which is easy to integrate. An SOI structure is formed by providing a first insulation layer on a silicon substrate. The semiconductor single crystal region is further divided by trench insulation layers into separate regions. Light emitting elements are formed on one of the separated semiconductor single crystal region and light receiving elements are formed on the other semiconductor single crystal region. The light emitting elements are obtained by forming light emitting diodes made of GaAs or the like on the substrate using a heterogeneous growth process. An optical waveguide made of a material which is optically transparent and electrically insulative such as a TiO.sub.2 film on each pair of light emitting and light receiving elements. The insulation layers constituted by SiO.sub.2 layers have a refractive index smaller that of the active layer of the substrate. Thus, the light emitted by the light emitting elements is almost entirely reflected without leaking out, and the light which has entered the optical waveguides reaches the light receiving elements without leaking out except those components which have entered perpendicularly or at an angle close thereto.

    摘要翻译: 提供了一种易于集成的单片光电耦合器。 通过在硅衬底上设置第一绝缘层来形成SOI结构。 半导体单晶区域进一步被沟槽绝缘层划分成不同的区域。 发光元件形成在分离的半导体单晶区域中的一个上,并且在另一个半导体单晶区域上形成光接收元件。 通过使用异质生长工艺在衬底上形成由GaAs等制成的发光二极管来获得发光元件。 一种光学波导,由光学透明和电绝缘的材料制成,例如在每对发光和光接收元件上的TiO 2膜。 由SiO 2层构成的绝缘层的折射率小于衬底的有源层的折射率。 因此,由发光元件发出的光几乎完全被反射而不会泄漏,进入光波导的光到达光接收元件而不会泄漏,除了垂直或以其附近的角度输入的那些元件。

    HEAT TREATMENT JIG AND HEAT TREATMENT METHOD FOR SILICON WAFER
    39.
    发明申请
    HEAT TREATMENT JIG AND HEAT TREATMENT METHOD FOR SILICON WAFER 有权
    热处理加热和硅热处理方法

    公开(公告)号:US20090127746A1

    公开(公告)日:2009-05-21

    申请号:US12339118

    申请日:2008-12-19

    IPC分类号: B29C71/02

    摘要: In this heat treatment jig and method for silicon wafers, a silicon wafer is heat-treated while being mounted on support projections provided on three support arms, having an intervening spacing, protruding from a support frame towards the center. At that time, all the support projections under the silicon wafer are positioned on a same circle within a region where a radial distance from the center is defined by 85 to 99.5% of the wafer radius, and the support arms form an angle of 120° with each other about the center. With this jig and method, free depth of a dislocation generated from a pin position can be controlled deeper than a device formation region, and a widest slip-free region where the surface is free from slip dislocation is obtained.

    摘要翻译: 在这种用于硅晶片的热处理夹具和方法中,将硅晶片安装在设置在三个支撑臂上的支撑突起上进行热处理,其具有从支撑框架向中心突出的中间间隔。 此时,硅晶片下面的所有支撑突起都位于与中心的径向距离限定晶片半径的85至99.5%的区域内的相同的圆上,并且支撑臂形成120°的角度 彼此围绕中心。 利用这种夹具和方法,可以将从销位置产生的位错的自由深度控制得比装置形成区域更深,并且获得表面没有滑移位错的最宽的无滑动区域。