摘要:
A metal base circuit substrate for an optical device, which effectively reflects the generated light and radiates heat from the substrate, comprises a metal base substrate made from aluminum or aluminum alloy that supports an electric circuit via an insulation layer, wherein the insulation layer is formed from a transparent cross-linked silicone body, and the electric circuit is formed directly on the insulation layer. And an efficient method for manufacturing the aforementioned substrate comprises the steps of: a) applying a cross-linkable silicone onto the surface of a metal base substrate made from aluminum or aluminum alloy, b) cross-link
摘要:
A method of fabricating a silicon single crystal ingot and a method of fabricating a silicon wafer using the ingot, characterized in that: the method is structured in such a manner that the silicon single crystal ingot is pulled up from the silicon fused liquid 7 in which nitrogen N and carbon C are doped in polycrystalline silicon, by using the Czochralski method, and its nitrogen density is 1×1013-5×1015 atoms/cm3, and the carbon density is 5×1015-3×1016 atoms/cm3.
摘要翻译:一种制造硅单晶锭的方法和使用该锭制造硅晶片的方法,其特征在于:该方法的结构是这样一种方式构成:将硅单晶锭从硅熔融液体7中拉出,其中, 通过使用Czochralski法将氮N和碳C掺杂在多晶硅中,其氮密度为1×10 13 -5×10 15原子/ cm 3,碳密度为5×10 15 -3×10 16原子/ cm 3。
摘要:
An electrically insulating crosslinked thin-film-forming organic resin composition comprising (A) an electrically insulating organic resin having silicon atom-bonded hydrogen atoms or silicon atom-bonded alkenyl groups and (B) a solvent, and a method for forming a crosslinked thin film therefrom.
摘要:
An ink jet apparatus has installed therein a retractable recovery device. The ink jet apparatus has a housing with a space accommodating a carriage for scanning a recording area, an ink jet head removably mounted on the carriage for ejecting ink onto a recording medium as the carriage scans the recording area, and a removable cover member forming a part of the housing covering said space. The recovery device includes a pressing member mounted in the space at a location outside the scanning area for movement between an accommodating position and an operating position. The pressing member extends from the space when moved to the operating position after removal of the cover member, whereby a recovery operation using the pressing member can be performed on the ink jet head by removing the ink jet head from the carriage. The pressing member, when in the accommodating position, is disposed within the space for concealment by the cover member.
摘要:
The instant invention pertains to a composition that can form silica thin films, wherein said composition performs well as a substrate planarizing coating when applied to a substrate and can be converted by exposure to high-energy radiation into silica thin film with an excellent electrical insulating performance. The composition for the formation of silica thin films comprises (A) a hydrogen silsesquioxane resin that contains at least 45 weight % hydrogen silsesquioxane resin with a molecular weight no greater than 1,500; and (B) solvent. A silica thin film is produced by evaporating the solvent (B), and then converting at least a portion of the hydrogen silsesquioxane resin (A) to silica by exposing the surface of the said substrate to high-energy radiation. The preferred substrate is a semiconductor substrate having at least one electrically conductive layer.
摘要:
To provide a composition and process for forming insulating films that can produce insulating films having low dielectric constants. The composition comprises (A) an electrically insulating curable inorganic or organic resin, (B) a solvent, and (C) at least one solvent-soluble substance (excluding the solvent used for component (B)) that upon heating or by interaction with the resin (A) can generate gas or undergo volatilization in the temperature range from 0.degree. C. to 800.degree. C. The insulating films are prepared by coating the surface of a substrate the composition; evaporating the solvent; and subsequently heating the substrate in order to generate gas from component (C) during the course of or after the cure of the said resin (A).
摘要:
To provide a composition for the formation of insulating films that can form an insulating film having a low dielectric constant. The composition comprises (A) an electrically insulating curable resin selected from the group consisting of electrically insulating curable organic resins and electrically insulating curable inorganic resins; and (B) at least two solvents: (B)(i) a solvent capable of dissolving resin (A) and (B)(ii) a solvent whose boiling point or vapor pressure curve differs from that of solvent (B)(i) or whose affinity for resin (A) differs from that of solvent (B)(i). Also claimed is a method for forming a insulating films that have a dielectric constant of less than 2.7.
摘要:
The present invention relates to an electroviscous fluid comprising the dispersion in an electrical insulating fluid of an organopolysiloxane having at least one metal sulfonate group in its molecule. The electroviscous fluid of the present invention can further comprise a polyether. The electroviscous fluid of the present invention does not wear or abrade surrounding equipment, is thermally stable, and that has a large electroviscous effect (yield value) and an excellent dispersion stability.
摘要:
A silicon wafer produced from a silicon single crystal ingot grown by Czochralski process is subjected to rapid heating/cooling thermal process at a maximum temperature (T1) of 1300° C. or more, but less than 1380° C. in an oxidizing gas atmosphere having an oxygen partial pressure of 20% or more, but less than 100%. The silicon wafer according to the invention has, in a defect-free region (DZ layer) including at least a device active region of the silicon wafer, a high oxygen concentration region having a concentration of oxygen solid solution of 0.7×1018 atoms/cm3 or more and at the same time, the defect-free region contains interstitial silicon in supersaturated state.
摘要翻译:将通过切克劳斯基法生长的硅单晶锭制成的硅晶片在氧化气体气氛中在1300℃以上但小于1380℃的最高温度(T1)下进行快速加热/冷却热处理 氧分压为20%以上但小于100%。 根据本发明的硅晶片在至少包括硅晶片的器件有源区的无缺陷区(DZ层)中具有0.7×10 18原子/ cm 3的氧固溶体浓度的高氧浓度区域 以上,同时无缺陷区域含有过饱和状态的间隙硅。