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    Polyimide and high-temperature adhesive of polyimide
    31.
    发明授权
    Polyimide and high-temperature adhesive of polyimide 失效
    聚酰亚胺和聚酰亚胺的高温粘合剂

    公开(公告)号：US5278276A

    公开(公告)日：1994-01-11

    申请号：US9091

    申请日：1993-01-26

    申请人： Masahiro Ohta ,  Saburo Kawashima ,  Yoshiho Sonobe ,  Shoji Tamai ,  Hideaki Oikawa ,  Kouji Ohkoshi ,  Akihiro Yamaguchi

    发明人： Masahiro Ohta ,  Saburo Kawashima ,  Yoshiho Sonobe ,  Shoji Tamai ,  Hideaki Oikawa ,  Kouji Ohkoshi ,  Akihiro Yamaguchi

    IPC分类号： C08G73/10 ,  C09J179/08

    CPC分类号： C08G73/105 ,  C08G73/1064 ,  C08G73/1071 ,  C09J179/08

    摘要： Polyimide having repeating units of the following formula (I) and its polyamic acid precursor having repeating units of the following formula (II) are disclosed; ##STR1## (where Y is a radical selected from the group consisting of a bond, divalent hydrocarbon having 1 to 10 carbons, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxide, and R is a tetra-valent radical selected from the group consisting of aliphatic radical having 2 and more carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non-condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function).Typical examples of polyimide and polyamic acid include where Y is thio radical and R is ##STR2## Y is a bond and R is III or IV, and Y is isopropylidene radical and R is IV.The polymers can be prepared from corresponding diamine and tetracarboxylic acid dianhydride.Polyimide or polyamic acid of this invention is excellent for high-temperature adhesive.

    摘要翻译： 公开了具有下式（I）的重复单元的聚酰亚胺及其具有下式（II）的重复单元的聚酰胺酸前体; （*化学结构*）（I）（*化学结构*）（II）（其中Y是选自由键，碳数1〜10的二价烃，六氟化异亚丙基，羰基，硫代，亚磺酰基， 磺酰基和氧化物，R是选自具有2个或更多个碳的脂族基团，环脂族基团，单芳族基团，缩合多芳族基团和非稠合多芳族基团中的四价基团，其中芳族基团相互连接 具有键或交联功能）。 聚酰亚胺和聚酰胺酸的典型实例包括其中Y为硫基，R为（*化学结构*）（III）（*化学结构*）（IV）Y为键，R为III或IV，Y为异丙叉基 而R是IV。 聚合物可以由相应的二胺和四羧酸二酐制备。 本发明的聚酰亚胺或聚酰胺酸对于高温粘合剂是优异的。

    Polyimide and high-temperature adhesive thereof
    34.
    发明授权
    Polyimide and high-temperature adhesive thereof 失效
    聚酰亚胺及其高温粘合剂

    公开(公告)号：US4931531A

    公开(公告)日：1990-06-05

    申请号：US210789

    申请日：1988-06-24

    申请人： Shoji Tamai ,  Masahiro Ohta ,  Saburo Kawashima ,  Katsuaki Iiyama ,  Hideaki Oikawa ,  Akihiro Yamaguchi

    发明人： Shoji Tamai ,  Masahiro Ohta ,  Saburo Kawashima ,  Katsuaki Iiyama ,  Hideaki Oikawa ,  Akihiro Yamaguchi

    IPC分类号： H01L21/265 ,  C08G73/10 ,  C08L79/08 ,  H01J37/317

    CPC分类号： C08G73/1064 ,  C08G73/1071

    摘要： This invention relates to a novel polyimide which is high-temperature resistant and capable of being molded in a fused state. This invention also relates to a high-temperature adhesive using the polyimide.The polyimide consists essentially of recurring units of the formula: ##STR1## where R is a tetra-valent radical selected from the group consisting of an aliphatic radical having 2 or more carbon atoms, alicyclic radical, monoaromatic radical, condensed polyaromatic radical, and non-condensed polyaromatic radical wherein aromatic radicals are linked to one another directly or via a bridge member.The polyimide can be prepared by reacting bis[4-(4-aminophenoxy)phenoxy)phenyl] sulfone with a tetracarboxylic dianhydride in an organic solvent and imidizing the resultant polyamic acid.Various tetracarboxylic dianhydrides can be used and preferred dianhydride are pyromellitic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, bis(3,4-diarboxyphenyl) ether dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, and 4,4'-(p-phenylenedioxy)diphthalic dianhydride.

    摘要翻译： 本发明涉及一种耐高温且能够熔融融合的新型聚酰亚胺。 本发明还涉及使用该聚酰亚胺的高温粘合剂。 聚酰亚胺基本上由下式的重复单元组成：其中R是选自具有2个或更多个碳原子的脂族基团，脂环族基团，单芳族基团，稠合多芳族基团和非芳族基团的四价基团， 其中芳族基团直接或通过桥连构件彼此连接。 聚酰亚胺可以通过使双[4-（4-（4-（4-氨基苯氧基）苯氧基）苯基]砜与四羧酸二酐在有机溶剂中反应制备，并酰亚胺化得到的聚酰胺酸。 可以使用各种四羧酸二酐，优选二酐是均苯四酸二酐，3,3分钟，4,4分钟 - 二苯甲酮四羧酸二酐，双（3,4-二羧基苯基）醚二酐，3,3分钟，4,4分钟 - 联苯四羧酸二酐， 和4,4分钟 - （对亚苯基二氧基）二邻苯二甲酸二酐。

    Polyimide
    35.
    发明授权
    Polyimide 失效
    聚酰亚胺

    公开(公告)号：US4908409A

    公开(公告)日：1990-03-13

    申请号：US119042

    申请日：1987-11-10

    申请人： Hideaki Oikawa ,  Katsuaki Liyama ,  Nobuhito Koga ,  Saburo Kawashima ,  Shoji Tamai ,  Masahiro Ohta ,  Akihiro Yamaguchi

    发明人： Hideaki Oikawa ,  Katsuaki Liyama ,  Nobuhito Koga ,  Saburo Kawashima ,  Shoji Tamai ,  Masahiro Ohta ,  Akihiro Yamaguchi

    IPC分类号： C08G73/10

    CPC分类号： C08G73/1071 ,  C08G73/1046

    摘要： Polyimide of this invention is almost colorless and has remarkably high light transmittance as well as excellent processability and adhesive properties at high temperatures in addition to its substantial high-temperature stability.The polyimide is a novel polyimide capable of being used for space and aeronautical materials, electric and electronic members, automotive parts, and furthermore for high-temperature adhesives.The polyimide has recurring units of the following formula ##STR1## wherein X is a radical selected from the group consisting of a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, sulfonyl radical and thio radical, and each nitrogen atom of imide ring is located simultaneously at meta- or para-position to ether linkage.The polyimide of this invention is prepared by reacting 4,4'-(p-phenylenedioxy)diphthalic dianhydride with an ether diamine having the following general formula (V): ##STR2## and successively imidizing the resultant polyamic acid. Examples of the ether diamine used for preparing the polyamide include,2,2-bis[4-(3-aminophenoxy)phenyl]propane,2,2-bis[4-(4-aminophenoxy)phenyl]propane,2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane,2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane,4,4'-bis(3-aminophenoxy)biphenyl,4,4'-bis(4-aminophenoxy)biphenyl,bis[4-(3-aminophenoxy)phenyl] ketone,bis[4-(4-aminophenoxy)phenyl] ketone,bis[4-(3-aminophenoxy)phenyl] sulfide,bis[4-(4-aminophenoxy)phenyl] sulfide,bis[4-(3-aminophenoxy)phenyl] sulfone andbis[4-(4-aminophenoxy)phenyl] sulfone.

    摘要翻译： 本发明的聚酰亚胺除了具有显着的高温稳定性外，几乎是无色的，并且具有非常高的透光率以及优异的加工性和高温下的粘合性。 该聚酰亚胺是一种能用于空间和航空材料，电气和电子部件，汽车部件以及高温粘合剂的新型聚酰亚胺。 聚酰亚胺具有以下结构式的重复单元：其中X是选自键，具有1至10个碳的二价烃基，六氟化异丙叉基，羰基，磺酰基 自由基和硫基，并且酰亚胺环的每个氮原子同时位于醚键或对位至醚键。 本发明的聚酰亚胺通过使4,4' - （对亚苯基二氧基）二邻苯二甲酸二酐与具有以下通式（V）的醚二胺反应：（V）并依次酰亚胺化得到的聚酰胺酸制备。 用于制备聚酰胺的醚二胺的实例包括2,2-双[4-（3-氨基苯氧基）苯基]丙烷，2,2-双[4-（4-氨基苯氧基）苯基]丙烷， 双[4-（3-氨基苯氧基）苯基] -1,1,1,3,3,3-六氟丙烷，2,2-双[4-（4-氨基苯氧基）苯基] -1,1,1,3， 3,3'-六氟丙烷，4,4'-双（3-氨基苯氧基）联苯，4,4'-双（4-氨基苯氧基）联苯，双[4-（3-氨基苯氧基）苯基]酮，双[4-（ 双[4-（3-氨基苯氧基）苯基]硫醚，双[4-（4-氨基苯氧基）苯基]硫醚，双[4-（3-氨基苯氧基）苯基]砜和双[4 - （4-氨基苯氧基）苯基]砜。