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公开(公告)号:US11439364B2
公开(公告)日:2022-09-13
申请号:US15638331
申请日:2017-06-29
Applicant: BFLY Operations, Inc.
Inventor: Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
IPC: A61B8/00 , G01S15/89 , A61B8/14 , G01S15/02 , G01S7/52 , B81C1/00 , B06B1/02 , A61N7/02 , A61N7/00 , H04R1/00 , A61B8/08
Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the “ultrasound-on-a-chip” solution disclosed herein.
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32.
公开(公告)号:US20220110529A1
公开(公告)日:2022-04-14
申请号:US17555351
申请日:2021-12-17
Applicant: BFLY Operations, Inc.
Inventor: Jonathan M. Rothberg , Nevada J. Sanchez , Gregory L. Charvat , Tyler S. Ralston
Abstract: Described herein are arrays of piezoelectric ultrasound elements. The piezoelectric ultrasound elements may be arranged in a checkerboard pattern. The piezoelectric ultrasound elements in one column may be shifted along the vertical dimension of the array with respect to piezoelectric ultrasound elements in an adjacent column. A piezoelectric ultrasound element in one column may be coupled to a different circuit than all other piezoelectric ultrasound elements in the column. The circuit may be, for example, an analog-to-digital converter or a circuit configured to transmit ultrasound signals from the array. Each piezoelectric ultrasound element in a column may be configured so that it can operate at a different frequency from each of the other piezoelectric ultrasound elements in the column. There array may include at least 1,000 piezoelectric ultrasound elements. The array may be monolithically integrated with a substrate comprising different circuits for each piezoelectric ultrasound element in the array.
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公开(公告)号:US12243208B2
公开(公告)日:2025-03-04
申请号:US18386801
申请日:2023-11-03
Applicant: BFLY OPERATIONS, INC.
Inventor: Alex Rothberg , Igor Lovchinsky , Jimmy Jia , Tomer Gafner , Matthew de Jonge , Jonathan M. Rothberg
Abstract: Aspects of the technology described herein relate to techniques for calculating, during imaging, a quality of a sequence of images collected during the imaging. Calculating the quality of the sequence of images may include calculating a probability that a medical professional would use a given image for clinical evaluation and a confidence that an automated analysis segmentation performed on the given image is correct. Techniques described herein also include receiving a trigger to perform an automatic measurement on a sequence of images, calculating a quality of the sequence of images, determining whether the quality of the sequence of images exceeds a threshold quality, and performing the automatic measurement on the sequence of images based on determining that the quality of the sequence of images exceeds the threshold quality.
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公开(公告)号:US20240407759A1
公开(公告)日:2024-12-12
申请号:US18806916
申请日:2024-08-16
Applicant: BFLY Operations, Inc
Inventor: Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
IPC: A61B8/00 , A61B8/08 , A61B8/14 , A61N7/00 , A61N7/02 , B06B1/02 , B81C1/00 , G01S7/52 , G01S15/02 , G01S15/89 , H04R1/00
Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the “ultrasound-on-a-chip” solution disclosed herein.
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公开(公告)号:US12076189B2
公开(公告)日:2024-09-03
申请号:US17890985
申请日:2022-08-18
Applicant: BFLY Operations, Inc.
Inventor: Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
IPC: A61B8/00 , A61B8/14 , A61N7/00 , A61N7/02 , B06B1/02 , B81C1/00 , G01S7/52 , G01S15/02 , G01S15/89 , H04R1/00 , A61B8/08
CPC classification number: A61B8/4494 , A61B8/14 , A61B8/145 , A61B8/4483 , A61B8/4488 , A61B8/54 , A61N7/00 , A61N7/02 , B06B1/02 , B81C1/00246 , G01S7/52019 , G01S7/52034 , G01S7/52047 , G01S7/5208 , G01S15/02 , G01S15/8915 , G01S15/8977 , H04R1/00 , A61B8/485
Abstract: A hand-held ultrasound device, for placement on a subject, includes a semiconductor device and a housing to support the semiconductor device. The semiconductor device includes: a plurality of ultrasonic transducer elements; a plurality of pulsers coupled to the plurality of ultrasonic transducer elements; a plurality of waveform generators configured to drive the plurality of pulsers; receive processing circuitry configured to process ultrasound signals received by the plurality of ultrasonic transducer elements; and a plurality of independently controllable registers configured to store a plurality of different parameters for the waveform generators.
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公开(公告)号:US11638931B2
公开(公告)日:2023-05-02
申请号:US16680956
申请日:2019-11-12
Applicant: BFLY OPERATIONS, INC.
Inventor: Keith G. Fife , Lingyun Miao , Jianwei Liu , Jonathan M. Rothberg
Abstract: A method of forming an ultrasonic transducer device includes bonding a membrane to seal a transducer cavity with at least a portion of a getter material layer being exposed, the getter material layer comprising a portion of a bilayer stack compatible for use in damascene processing.
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公开(公告)号:US11620740B2
公开(公告)日:2023-04-04
申请号:US16816076
申请日:2020-03-11
Applicant: BFLY Operations, Inc.
Inventor: Alex Rothberg , Igor Lovchinsky , Jimmy Jia , Tomer Gafner , Matthew de Jonge , Jonathan M. Rothberg
Abstract: Aspects of the technology described herein relate to techniques for calculating, during imaging, a quality of a sequence of images collected during the imaging. Calculating the quality of the sequence of images may include calculating a probability that a medical professional would use a given image for clinical evaluation and a confidence that an automated analysis segmentation performed on the given image is correct. Techniques described herein also include receiving a trigger to perform an automatic measurement on a sequence of images, calculating a quality of the sequence of images, determining whether the quality of the sequence of images exceeds a threshold quality, and performing the automatic measurement on the sequence of images based on determining that the quality of the sequence of images exceeds the threshold quality.
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公开(公告)号:US20220313219A1
公开(公告)日:2022-10-06
申请号:US17845940
申请日:2022-06-21
Applicant: BFLY Operations, Inc.
Inventor: Kailiang Chen , Nevada J. Sanchez , Susan A. Alie , Tyler S. Ralston , Jonathan M. Rothberg , Keith G. Fife , Joseph Lutsky
Abstract: Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application-specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.
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39.
公开(公告)号:US11435458B2
公开(公告)日:2022-09-06
申请号:US16459293
申请日:2019-07-01
Applicant: BFLY Operations, Inc.
Inventor: Jonathan M. Rothberg , Tyler S. Ralston , Nevada J. Sanchez , Andrew J. Casper
Abstract: Aspects of the technology described herein relate to ultrasound device circuitry as may form part of a single substrate ultrasound device having integrated ultrasonic transducers. The ultrasound device circuitry may facilitate the generation of ultrasound waveforms in a manner that is power- and data-efficient.
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公开(公告)号:US20240100566A1
公开(公告)日:2024-03-28
申请号:US18530629
申请日:2023-12-06
Applicant: BFLY OPERATIONS, INC.
Inventor: Lingyun Miao , Keith G. Fife , Jianwei Liu , Jonathan M. Rothberg
CPC classification number: B06B1/0292 , B81B3/001 , B81C1/00984 , B81B2203/0127 , B81B2203/0315 , B81B2203/0392 , B81C2201/0109 , B81C2201/0125 , B81C2201/0176
Abstract: An ultrasound transducer device made by a process that includes the steps of forming depositing a first layer on a substrate, depositing a second layer on the first layer, patterning the second layer at a region corresponding to a location of a transducer cavity, depositing a third layer that refills regions created by patterning the second layer, planarizing the third layer to a top surface of the second layer, removing the second layer, conformally depositing a fourth layer over the first layer and the third layer, defining the transducer cavity in a support layer formed over the fourth layer; and bonding a membrane to the support layer.
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