ARRAY SUBSTRATE, METHOD FOR PREPARING ARRAY SUBSTRATE, AND BACKLIGHT MODULE

    公开(公告)号:US20220123024A1

    公开(公告)日:2022-04-21

    申请号:US17281015

    申请日:2020-01-03

    IPC分类号: H01L27/12 H01L27/15

    摘要: An array substrate, a method for preparing the array substrate, and a backlight module are disclosed. Before electroplating a first metal layer on a pattern of a seed layer, the method further includes: forming a pattern of a compensation electrode wire electrically connected with a lead electrode on a side, where the lead electrode is formed, of a base substrate. The compensation electrode wire is at least on a second side of a wiring region, the pattern of the lead electrode is formed at a first side of the wiring region, and the first side and the second side are different sides. In the electroplating process, the lead electrode is connected with a negative pole of a power supply, the compensation electrode wire is electrically connected with the lead electrode, thus an area of an electroplating negative pole generating electric field lines is increased by utilizing the compensation electrode wire.

    DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY APPARATUS

    公开(公告)号:US20210264852A1

    公开(公告)日:2021-08-26

    申请号:US17254088

    申请日:2020-03-20

    摘要: A display substrate, a manufacturing method thereof and a display apparatus are provided. The display substrate includes a base substrate structure and a display structure on the base substrate structure, the display structure includes a plurality of light emitting units and is divided into multiple light-transmissive regions and multiple opaque regions; and a driving circuit for driving the display structure to display and comprising a pixel driving circuit between the base substrate structure and the display structure, and a peripheral circuit driving the pixel driving circuit and arranged on a side of the base substrate structure distal to the display structure and in the opaque regions, and the peripheral circuit is coupled to the pixel driving circuit through at least one through hole formed in the base substrate structure. The display substrate can realize frameless display, which is beneficial to realize seamless splicing display of a plurality of display substrates.

    DISPLAY SUBSTRATE, SPLICING SCREEN AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20210210522A1

    公开(公告)日:2021-07-08

    申请号:US16650690

    申请日:2019-10-08

    摘要: The disclosure relates to the technical field of display devices and discloses a display substrate, a splicing screen and a manufacturing method thereof. The display substrate includes a flexible substrate; a plurality of signal lines located at one side of the flexible substrate; a plurality of plating electrodes located at one side of the signal lines toward the flexible substrate and electrically connected to the signal lines in one-to-one correspondence; a plurality of first through holes in one-to-one correspondence to the plating electrodes and penetrating the flexible substrate and exposing the plating electrodes, the first through roles being filled with a conductive material inside; and a plurality of binding electrodes located at one side of the flexible substrate away from the signal lines and in one-to-one correspondence to the first through holes, the binding electrodes being electrically connected to corresponding plating electrode through conductive material in corresponding first through hole.

    DRIVING SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND MICRO LED BONDING METHOD

    公开(公告)号:US20210091057A1

    公开(公告)日:2021-03-25

    申请号:US17010575

    申请日:2020-09-02

    IPC分类号: H01L25/16 H01L27/12 H01L23/00

    摘要: The present disclosure provides a driving substrate and a manufacturing method thereof, and a micro LED bonding method. The driving substrate includes: a base substrate; a driving function layer provided on the base substrate, and including a plurality of driving thin film transistors and a plurality of common electrode lines; a pad layer including a plurality of pads provided on a side of the driving function layer away from the base substrate, each pad including a pad body and a microstructure of hard conductive material provided on a side of the pad body away from the base substrate; and a plurality of buffer structures provided on the side of the driving function layer away from the base substrate, each buffer structure surrounding a portion of a corresponding microstructure close to the base substrate, and a height of the buffer structure being lower than a height of the microstructure.

    OLED DISPLAY SUBSTRATE, METHOD OF FORMING THE SAME AND DISPLAY DEVICE

    公开(公告)号:US20210066425A1

    公开(公告)日:2021-03-04

    申请号:US16641560

    申请日:2019-08-26

    摘要: An Organic Light-emitting Diode (OLED) display substrate, a method of forming the same and a display device are provided. The OLED display substrate includes: a driving thin film transistor located on a base substrate and configured to drive an OLED light-emitting unit to emit light; and a photosensitive thin film transistor located on the base substrate and configured to be capable of detecting light emitted by the OLED light-emitting unit and generating an electrical signal, at least a part of film layers of the photosensitive thin film transistor and at least a part of film layers of the driving thin film transistor are disposed at a same layer and made of a same material.

    DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF, REPAIRING METHOD FOR DISPLAY APPARATUS

    公开(公告)号:US20190109180A1

    公开(公告)日:2019-04-11

    申请号:US16150374

    申请日:2018-10-03

    IPC分类号: H01L27/32 H01L51/56

    摘要: A display apparatus is provided, which includes a rigid substrate; a first carrier plate provided on a first surface of the rigid substrate; a first substrate provided on the first carrier plate, the first substrate including a thin film transistor with a drain; a light emitting assembly provided on a second surface of the rigid substrate distal to the first surface, the light emitting assembly including an anode and a light emitting layer provided successively along a direction distal to the rigid substrate; and a via hole provided penetrating the rigid substrate and the first carrier plate, the anode electrically coupled to the drain through the via hole. In the display apparatus of the present disclosure the light emitting assembly is separated from the array substrate such that when the light emitting assembly or the first substrate suffers from failure, it can be replaced easily.

    FINGERPRINT IDENTIFICATION SENSOR, FINGERPRINT IDENTIFICATION METHOD AND ELECTRONIC DEVICE

    公开(公告)号:US20190087624A1

    公开(公告)日:2019-03-21

    申请号:US15767704

    申请日:2017-09-30

    IPC分类号: G06K9/00

    CPC分类号: G06K9/0004 G06K9/00087

    摘要: A fingerprint identification sensor, a fingerprint identification method and an electronic device are disclosed. The fingerprint identification sensor includes a substrate; a fingerprint sensing element disposed on the substrate and including a thin film transistor, an off-state leakage current of the thin film transistor varying with the intensity of light irradiating onto an active area thereof; and a fingerprint identification light source arranged to emit light that irradiates onto a finger and is reflected thereby, the reflected light irradiating onto the active area of the thin film transistor. Thus, the fingerprint identification can be realized conveniently, and the fingerprint identification sensor has at least one of the advantages like high sensitivity and simple structure.

    Array Substrate and Method for Manufacturing the Same, Display Device

    公开(公告)号:US20190067332A1

    公开(公告)日:2019-02-28

    申请号:US16041020

    申请日:2018-07-20

    IPC分类号: H01L27/12

    摘要: The present disclosure provides an array substrate, a method for manufacturing the array substrate and a display device. The array substrate includes a base substrate and a signal line provided in a display region at a first side of the base substrate, an electrode is provided at a second side of the base substrate, the second side of the base substrate is opposite to the first side of the base substrate, a via-hole penetrating through the base substrate is provided at a position of the base substrate at which the electrode is provided, a connecting electrode is provided in the via-hole, and the signal line is electrically connected to the electrode provided at the second side of the base substrate through the connecting electrode.