摘要:
A layer of a mask material is deposited on a substrate. A beam of energy is scanned across the mask material in a rasterized linear pattern and in accordance with a scan pitch that is based on a pitch of conductive structure segments to be formed on the substrate. The beam of energy is defined to transform the mask material upon which the beam of energy is incident into a removable state. During scanning the beam of energy across the mask material, the beam of energy is turned on at locations where a conductive structure is to be formed on the substrate, and the beam of energy is turned off at locations where a conductive structure is not to be formed on the substrate.
摘要:
Selected cells in a semiconductor chip layout are replaced with corresponding PCT pre-processed cells. Each PCT pre-processed cell represents a particular selected cell having been previously subjected to a cell-level-PCT-processing operation so as to include PCT-based cell layout adjustments. Following replacement of the selected cells in the semiconductor chip layout with corresponding PCT pre-processed cells, a chip-wide PCT processing operation is performed on the semiconductor chip layout for a given chip level. The presence of the PCT pre-processed cells in the semiconductor chip layout serves to accelerate the chip-wide PCT processing of the semiconductor chip layout. The chip-wide PCT processed semiconductor layout for the given chip level is recorded on a persistent storage medium.
摘要:
A cell of a semiconductor device includes a substrate portion formed to include a plurality of diffusion regions, including at least one p-type diffusion region and at least one n-type diffusion region separated from each other by one or more non-active regions. The cell includes a gate electrode level including a number of conductive features defined to extend in only a first parallel direction. Each of the conductive features within the gate electrode level is fabricated from a respective originating rectangular-shaped layout feature. Some of the conductive features form respective PMOS and/or NMOS transistor devices. A total number of the PMOS and NMOS transistor devices in the cell is greater than or equal to eight. The cell also includes a number of interconnect levels formed above the gate electrode level.
摘要:
A cell layout of a semiconductor device includes a diffusion level layout including a plurality of diffusion region layout shapes. The cell layout also includes a gate electrode level layout defined to include linear-shaped layout features placed to extend in only a first parallel direction. Adjacent linear-shaped layout features that share a common line of extent in the first parallel direction are separated from each other by an end-to-end spacing that is substantially equal across the gate electrode level layout and that is minimized to an extent allowed by a semiconductor device manufacturing capability. The gate electrode level layout includes linear-shaped layout features defined along at least four different lines of extent in the first parallel direction. The cell layout also includes a number of interconnect level layouts each defined to pattern conductive features within corresponding interconnect levels above the gate electrode level of the cell.
摘要:
A cell of a semiconductor device includes a substrate portion formed to include a plurality of diffusion regions, including at least one p-type diffusion region and at least one n-type diffusion region separated from each other by one or more non-active regions. The cell includes a gate electrode level including a number of conductive features defined to extend in only a first parallel direction. Each of the conductive features within the gate electrode level is fabricated from a respective originating rectangular-shaped layout feature. Some of the conductive features form respective PMOS and/or NMOS transistor devices. A number of the PMOS transistor devices is equal to a number of the NMOS transistor devices in the gate electrode level of the cell. The cell also includes a number of interconnect levels formed above the gate electrode level.
摘要:
A cell of a semiconductor device is disclosed to include a diffusion level including a plurality of diffusion regions separated by inactive regions. The cell also includes a gate electrode level including a number of conductive features defined to extend in only a first parallel direction. Each of the conductive features within the gate electrode level is fabricated from a respective originating rectangular-shaped layout feature. The gate electrode level includes conductive features defined along at least four different virtual lines of extent in the first parallel direction. A width of the conductive features within the gate electrode level is measured perpendicular to the first parallel direction and is less than a wavelength of light used in a photolithography process to fabricate the conductive features. The cell also includes a number of interconnect levels formed above the gate electrode level.
摘要:
A cell of a semiconductor device includes a substrate portion formed to include at least one p-type diffusion region and at least one n-type diffusion region separated by non-active regions. The cell includes a gate electrode level including a number of conductive features defined to extend in only a first parallel direction. Each of the conductive features within the gate electrode level is fabricated from a respective originating rectangular-shaped layout feature. A width size of the conductive features within a five wavelength photolithographic interaction radius within the gate electrode level is less than a wavelength of light of 193 nanometers. Some of the conductive features form respective PMOS and/or NMOS transistor devices. A total number of the PMOS and NMOS transistor devices in the cell is greater than or equal to eight. The cell also includes a number of interconnect levels formed above the gate electrode level.
摘要:
A layout of a cell of a semiconductor device is disclosed to include a diffusion level layout including a plurality of diffusion region layout shapes, including a p-type and an n-type diffusion region separated by a central inactive region. The layout of the cell includes a gate electrode level layout corresponding to an entire gate level of the cell. The gate electrode layout includes a number of linear-shaped layout features placed to extend in only a first parallel direction. Each of the number of the linear-shaped layout features within the gate electrode level layout of the restricted layout region is rectangular-shaped. Linear-shaped layout features within the gate electrode level layout extend over one or more of the p-type and/or n-type diffusion regions to form PMOS and NMOS transistor devices. A total number of the PMOS and NMOS transistor devices in the cell is greater than or equal to eight.
摘要:
A semiconductor device includes a substrate portion having a plurality of diffusion regions defined therein. A gate electrode level region is formed above the substrate portion to include conductive features defined to extend in only a first parallel direction. Adjacent ones of the conductive features that share a common line of extent are fabricated from respective originating layout features separated from each other by an end-to-end spacing of substantially equal and minimum size across the gate electrode level region. A width of the conductive features within a 5 wavelength photolithographic interaction radius is less than a 193 nanometer wavelength of light used in a photolithography process for their fabrication. Some conductive features extend over the plurality of diffusion regions to form PMOS or NMOS transistor devices. A total number of the PMOS and NMOS transistor devices in the gate electrode level region is greater than or equal to eight.
摘要:
A cell of a semiconductor device includes a diffusion level including a plurality of diffusion regions separated by inactive regions. The cell also includes a gate electrode level including conductive features defined to extend in only a first parallel direction. Adjacent ones of the conductive features that share a common line of extent in the first parallel direction are fabricated from respective originating layout features that are separated from each other by an end-to-end spacing having a size that is substantially equal and minimized across the gate electrode level. Some of the conductive features form respective PMOS and/or NMOS transistor devices. A total number of the PMOS and NMOS transistor devices in the cell is greater than or equal to eight. A width of the conductive features in the gate electrode level is less than a wavelength of light used in a photolithography process for their fabrication.