公开(公告)号：US09123874B2

公开(公告)日：2015-09-01

申请号：US14094341

申请日：2013-12-02

Applicant: Cree, Inc.

Inventor： Christopher P. Hussell ,  Sung Chul Joo

IPC: H01L33/60 ,  H01L33/64 ,  H01L25/075 ,  H01L33/48

CPC classification number: H01L33/647 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/60 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/09701 ,  H01L2924/12032 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Packages containing one or more light emitting devices, such as light emitting diodes (LEDs), are disclosed. In one embodiment, LED package can include a thermal element having improved solder reliability to improve heat dissipation capacity of the LED package. LED package can include a molded plastic body having one or more LEDs attached to one or more electrical elements. The LEDs can be connected to an upper surface of the thermal element. The thermal element can include a bottom surface which can extend further away in distance from a body of the LED package than a bottom surface of the electrical element. This configuration can result in an improved connection between the LED package and an external circuitry source, thereby increasing heat transfer ability of the LED package.

Abstract translation: 公开了包含一个或多个发光器件（例如发光二极管（LED））的封装。 在一个实施例中，LED封装可以包括具有改进的焊料可靠性以提高LED封装的散热能力的热元件。 LED封装可以包括具有连接到一个或多个电气元件的一个或多个LED的模制塑料体。 LED可以连接到热元件的上表面。 热元件可以包括底表面，该底表面可以远离电气元件的底部表面延伸远离LED封装体。 该配置可以改善LED封装和外部电路源之间的连接，从而增加LED封装的传热能力。

公开(公告)号：USD708156S1

公开(公告)日：2014-07-01

申请号：US29432988

申请日：2012-09-24

Applicant: CREE, Inc.

Designer： Sung Chul Joo ,  Christopher P. Hussell

CPC classification number: H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2924/00