Abstract:
The invention is to provide an isolated transgenic mammalian neural cell, which comprises at least one heterologous vector expressing AhR/ARNT. Also provided is methods the detection of a sample containing a chemical substance damage to the nervous system and the selection of drugs for treating neurodegenerative disorders.
Abstract:
A complex circuit board including a printed circuit board assembly (PCBA) and a flexible printed circuit (FPC) for providing driving signals for light sources is disclosed. The PCBA includes a supporting portion and a connecting portion. The light sources are disposed above the supporting portion. The connection portion contacts electrically with a contacting portion of the FPC. The contacting portion of the FPC has a fixing hole. The connecting portion of the PCBA has a fixing portion. Moreover, the FPC has two or more than two first bend portions on the contacting portion. The fixing portion of the PCBA is inserted into the fixing hole of the FPC to complete the complex circuit board without extra attachment units. Therefore, the assembly procedure is simplified to increase throughput and the cost is reduced.
Abstract:
The present invention provides a high capacity hydrogen storage material in which a plural mesopore channels and fractal networks of nanopore channels communicating therewith and connecting to the micropores are formed in a microporous material, wherein a plural metal particles are formed on the surface of the mesopore and nanopore channels and of the micropores. In another embodiment, the present invention also provides a method for making the hydrogen storage material through oxidizing the microporous material so as to form a plural mesopore channels and fractal networks of nanopore channels, both of which are connected to the micropores to form a base for the deposition of metal particles capable of decomposing hydrogen molecules into hydrogen atoms. The high capacity hydrogen storage material is capable of increasing the capacity of hydrogen storage, and besides, the oxidizing process for making the hydrogen storage material is simple and has merits of saving cost.
Abstract:
The invention provides a heat-dissipation device and a heat-dissipation method thereof. The electronic device includes a heat source, a thermal interface material (TIM) in contact with the heat source, a heat-dissipation module in contact with the thermal interface material, and an elastic member pushing the heat-dissipation module toward the heat source. The elastic member includes a base and a compressible portion extending from the base, whereby a force, applied to the compressible portion, is transmitted to and uniformly distributed on the base. The heat-dissipation method includes the steps of overlapping a thermal interface material and a heat-dissipation module on the heat source, and exerting a force toward the heat source to the heat-dissipation module.
Abstract:
An extended fin array has a main heat-dissipation module and an extended heat-dissipation module. The main heat-dissipation module and the extended heat-dissipation module are stacked to increase the effective convective area to increase the heat-dissipation effect. The extended heat-dissipation module is in the main heat-dissipation module when the heat amount generated by an electronic device is normal. The extended heat-dissipation module extends out from the main heat-dissipation module to increase the heat convection area when the heat amount generated by the electronic device is large.
Abstract:
A heat dissipation device for dissipating heat form a heat source includes a control unit, a sensor, a first heat dissipation module, a second heat dissipation module, and a driving mechanism. The sensor electrical connects with the control unit and detects a temperature of the heat source, and reports the temperature to the control unit. The second heat dissipation module is retractably connected to the first heat dissipation module. The driving mechanism is electrically connected to the control unit and the second heat dissipation module. When the temperature exceeds a first temperature, the control unit informs the driving mechanism to extend away from the second heat dissipation module with respect to the first heat dissipation module.
Abstract:
A heat dissipation device for dissipating heat form a heat source includes a control unit, a sensor, a first heat dissipation module, a second heat dissipation module, and a driving mechanism. The sensor electrical connects with the control unit and detects a temperature of the heat source, and reports the temperature to the control unit. The second heat dissipation module is retractably connected to the first heat dissipation module. The driving mechanism is electrically connected to the control unit and the second heat dissipation module. When the temperature exceeds a first temperature, the control unit informs the driving mechanism to extend away from the second heat dissipation module with respect to the first heat dissipation module.
Abstract:
A power apparatus having a built-in powerline networking adapter is revealed. This invented power adapter includes one electrical plug and one body. The electrical plug is purposed to connect a called powerline networking, for instance, the home powerline. The body includes at least one electrical outlet and one networking adapter. The at least electrical outlet is purposed to connect this electrical plug for power supply. This networking adapter connects this electrical plug to transport the signal and data packets along the powerline. The above power apparatus having a built-in powerline networking adapter is capable of utilizing one cable to connect the electrical plug and the body in order to undergo electrical conductivity and possess the function of power line lengthening and networking physical extension.
Abstract:
A portable electronic device, which including a casing, a circuit board, a fan and a heat dissipating device, is disclosed. The circuit board is disposed in the casing and includes at least one electronic component thereon. The fan is disposed in the casing. The heat dissipating device is disposed in the casing and near the side of an air outlet of the fan. Gaps formed between the outer surfaces of the heat dissipating device and the inner surfaces of the casing as air flow channels. The portable electronic device isolates heat conducted to the casing of the portable electronic device via the gaps.