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    Amide Combinations for Cleaning and Stripping of Electronic Parts
    32.
    发明申请
    Amide Combinations for Cleaning and Stripping of Electronic Parts 审中-公开

    公开(公告)号：US20200150542A1

    公开(公告)日：2020-05-14

    申请号：US16628598

    申请日：2017-07-06

    Applicant: Dow Global Technologies LLC

    Inventor： Qi Jiang ,  Xin Jiang ,  Hua Ren ,  Eungkyu Kim ,  Jianhai Mu ,  Kaoru Ohba ,  William J. Harris

    IPC: G03F7/42 ,  C11D7/32

    Abstract: A solvent consisting essentially of: (A) a first component consisting of N,N-diethylacetamide (DEAC); (B) a second component consisting of 3-methoxy-N, N-dimethyl propionamide (M3DMPA); and (C) an optional third component consisting of one or more glycol ethers or glycol ether acetates; or a solvent consisting essentially of: (1) a first component consisting of one or more acyclic amides of Formula (I): and (2) an optional second component consisting of one or more of DEAC, M3DMPA, N,N-dimethylpropionamide, one or more glycol ethers or glycol ether acetates, and one or more cyclic amides of Formulae (II-IV).

    EMULSIFIABLE CONCENTRATES OF INDOXACARB
    37.
    发明申请
    EMULSIFIABLE CONCENTRATES OF INDOXACARB 有权

    公开(公告)号：US20170223963A1

    公开(公告)日：2017-08-10

    申请号：US15501694

    申请日：2014-08-05

    Applicant: Dow Global Technologies LLC

    Inventor： Ling Zhong ,  Jianhai Mu ,  Jing Ji ,  Wei Lu ,  Hua Ren

    IPC: A01N47/38 ,  A01N25/04

    CPC classification number: A01N47/38 ,  A01N25/04 ,  A01N25/02 ,  A01N25/30 ,  A01N43/90 ,  A01N47/40

    Abstract: A formulation contains (a) 1-20 wt % of indoxacarb; (b) 10-30 wt % of a primary emulsifier mixture containing: (i) 1-15 wt % of a polyalkylene glycol having the following structure : R1O—(CH2CH(CH3)x—(CH2CH2O)y—H where R1 is a branched or linear alkyl having 4-16 carbons; x is a number from 0-11 and y is a number from 1-20; (ii) 5-15 wt % of an ethylene oxide/propylene oxide block copolymer hydroxyl terminated on both ends and having a molecular weight of 2000 to 8000 g/mol and an ethylene oxide moiety that is 40-60 wt %of total copolymer weight; and (iii) 1-10 wt % of sodium bisulfate adduct of bis (2-ethylhexyl) maleate; (c) 1-15 wt % of a non-aromatic methyl ester co-emulsifier; and (d) 10-70 wt % of a solvent consisting of cyclohexanone and at least one additional non-aromatic solvent; where the composition is flee of aromatic solvents, amides, silicone containing components and azone.

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