公开(公告)号：US20130256655A1

公开(公告)日：2013-10-03

申请号：US13726652

申请日：2012-12-26

申请人： E INK HOLDINGS INC.

发明人： Chih-Hsuan Wang ,  Chia-Chun Yeh ,  Ted-Hong Shinn

IPC分类号： H01L29/786

CPC分类号： H01L29/78693 ,  H01L29/7869

摘要： An active device is disposed on a substrate. The active device includes a metal layer, a semiconductor channel layer, an insulating layer, a source and a drain. The metal layer has a metal oxide surface away from the substrate. The insulating layer is disposed between the metal layer and the semiconductor channel layer. The source and the drain are disposed at one side of the semiconductor channel layer. A portion of the semiconductor channel layer is exposed between the source and the drain. An orthogonal projection of the metal layer on the substrate at least covers an orthogonal projection of the portion of the semiconductor channel layer exposed by the source and the drain on the substrate.

摘要翻译： 有源器件设置在衬底上。 有源器件包括金属层，半导体沟道层，绝缘层，源极和漏极。 金属层具有远离基板的金属氧化物表面。 绝缘层设置在金属层和半导体沟道层之间。 源极和漏极设置在半导体沟道层的一侧。 半导体沟道层的一部分暴露在源极和漏极之间。 金属层在基板上的正交投影至少覆盖由衬底上的源极和漏极暴露的半导体沟道层的部分的正交投影。

公开(公告)号：US11850833B2

公开(公告)日：2023-12-26

申请号：US17445954

申请日：2021-08-26

申请人： E Ink Holdings Inc.

发明人： Yi-Sheng Lin ,  Chen-Chu Tsai ,  Chia-Chun Yeh

IPC分类号： B32B3/12

CPC分类号： B32B3/12 ,  B32B2457/20

摘要： A flexible display panel can be bent around an axis, and includes a flexible substrate and an accommodating structure. The accommodating structure is disposed on the flexible substrate and includes a plurality of polygonal microcups connected to each other, where the polygonal microcups are arranged regularly, and the axis is not substantially parallel to any sidewall of each polygonal microcup.

公开(公告)号：US10921677B2

公开(公告)日：2021-02-16

申请号：US16171360

申请日：2018-10-25

申请人： E Ink Holdings Inc.

发明人： Yi-Sheng Lin ,  Chia-Chun Yeh ,  Kuo-Hsing Cheng ,  Hsing-Kai Wang

IPC分类号： G02B26/00 ,  G02F1/167 ,  G02F1/1333 ,  G02F1/1679

摘要： A flexible electronic device has a display region and a package region surrounding the display region. The flexible electronic device includes a substrate, a first protection film, a first adhesive layer, a display medium layer, and a flexible auxiliary layer. The first protection film is disposed to be opposite to the substrate. The first adhesive layer is disposed between the substrate and the first protection film, and at least located within the package region. The display medium layer is disposed between the substrate and the first protection film, and located within the display region. The flexible auxiliary layer is disposed on a surface of the first protection film, and located within the package region, wherein the flexible auxiliary layer overlaps the first adhesive layer in a thickness direction.

公开(公告)号：US10607932B2

公开(公告)日：2020-03-31

申请号：US16122871

申请日：2018-09-05

申请人： E Ink Holdings Inc.

发明人： Yu-Chieh Hung ,  Kuan-Yi Lin ,  Chun-Yu Lu ,  Chia-Chun Yeh

IPC分类号： H01L23/498 ,  H01L27/00 ,  H01L29/00 ,  H01L27/12 ,  H01L29/786

摘要： A circuit structure includes a flexible substrate, an inorganic barrier layer, a first wire, a second wire, a third wire, a fourth wire, an organic dielectric layer, a first conductive via, and a second conductive via. The inorganic barrier layer is disposed over the flexible substrate. The first and second wires are disposed on the inorganic barrier layer and contact the inorganic barrier layer. The first and second wires are separated from each other. The organic dielectric layer is disposed over the first and second wires. The third wire is disposed in the organic dielectric layer. The fourth wire is disposed above the organic dielectric layer. The first conductive via is disposed in the organic dielectric layer and contacts the first and third wires. The second conductive via is disposed in the organic dielectric layer and contacts the second and fourth wires.

公开(公告)号：US20180343756A1

公开(公告)日：2018-11-29

申请号：US15986822

申请日：2018-05-23

申请人： E Ink Holdings Inc.

发明人： Kuan-Yi Lin ,  Yu-Wen Chen ,  Yu-Chieh Hung ,  Chun-Yu Lu ,  Chia-Chun Yeh

IPC分类号： H05K5/00 ,  B32B7/14

摘要： A carrier apparatus is adapted to carry a flexible substrate. The carrier apparatus includes two carrier plates, two adhesive layers, and two supporting units. The carrier plates have a gap with respect to each other, and each of the carrier plates has a first region and a second region, wherein the second regions of the carrier plates are adjacent to each other and are located between the first regions. The adhesive layers are respectively disposed in the first regions of the carrier plates. The supporting units are respectively disposed in the second regions of the carrier plates and are coplanar with the adhesive layers, wherein the flexible substrate is fixed on the carrier plates through the adhesive layers, and the supporting units are detachably attached to a bending zone of the flexible substrate by attractive force. A display including the carrier apparatus and a flexible display panel is provided.

公开(公告)号：US09748482B2

公开(公告)日：2017-08-29

申请号：US14564106

申请日：2014-12-09

申请人： E Ink Holdings Inc.

发明人： Hsiao-Wen Zan ,  Chuang-Chuang Tsai ,  Pei-Chen Yu ,  Ming-Yen Chuang ,  Chia-Chun Yeh

IPC分类号： H01L51/00 ,  G01N27/12 ,  G01N27/414

CPC分类号： H01L51/0001 ,  G01N27/125 ,  G01N27/4141 ,  G01N27/4146

摘要： A semiconductor sensing device that includes a nanowire conductive layer, a semiconductor sensing layer, and a conductive layer is provided. The nanowire conductive layer includes a plurality of connected conductive nanowires, and gaps are formed between the conductive nanowires. The semiconductor sensing layer is electrically connected to the nanowire conductive layer. The conductive layer is electrically connected to the semiconductor sensing layer. The semiconductor sensing layer is located between the nanowire conductive layer and the conductive layer. A manufacturing method of a semiconductor sensing device is also provided.

公开(公告)号：US09614101B2

公开(公告)日：2017-04-04

申请号：US14845291

申请日：2015-09-04

申请人： E Ink Holdings Inc.

发明人： Wei-Chou Lan ,  Ted-Hong Shinn ,  Henry Wang ,  Chia-Chun Yeh

IPC分类号： H01L27/12 ,  H01L29/786 ,  H01L21/02 ,  H01L21/4763 ,  H01L29/49 ,  H01L29/51 ,  H01L29/66 ,  H01L29/24

CPC分类号： H01L29/7869 ,  H01L21/02554 ,  H01L21/02565 ,  H01L21/47635 ,  H01L27/1218 ,  H01L27/1225 ,  H01L27/127 ,  H01L27/1288 ,  H01L29/24 ,  H01L29/4908 ,  H01L29/51 ,  H01L29/66969 ,  H01L29/78603 ,  H01L29/78606

摘要： Disclosed herein is a method for manufacturing an array substrate. The method includes forming a source electrode and a drain electrode on a substrate. A semiconductor layer, an organic insulating layer, and a gate electrode layer are sequentially formed to cover the substrate, the source electrode, and the drain electrode. A patterned photoresist layer is formed on the gate electrode layer. The exposed portion of the gate electrode layer, and a portion of the organic insulative layer and a portion of the semiconductor layer thereunder are removed to form a gate electrode. An organic passivation layer is formed on the gate electrode, the source electrode, and the drain electrode. The organic passivation layer has a contact window to expose a portion of the drain electrode. A pixel electrode is formed on the organic passivation layer and the exposed portion of the drain electrode.

公开(公告)号：US09564537B2

公开(公告)日：2017-02-07

申请号：US14859371

申请日：2015-09-21

申请人： E Ink Holdings Inc.

发明人： Wei-Chou Lan ,  Ted-Hong Shinn ,  Henry Wang ,  Chia-Chun Yeh

IPC分类号： H01L29/786 ,  H01L21/02 ,  H01L21/4763 ,  H01L29/49 ,  H01L29/51 ,  H01L29/66 ,  H01L29/24 ,  H01L27/12

CPC分类号： H01L29/7869 ,  H01L21/02554 ,  H01L21/02565 ,  H01L21/47635 ,  H01L27/1218 ,  H01L27/1225 ,  H01L27/127 ,  H01L27/1288 ,  H01L29/24 ,  H01L29/4908 ,  H01L29/51 ,  H01L29/66969 ,  H01L29/78603 ,  H01L29/78606

摘要： Disclosed herein is a method for manufacturing an array substrate. The method includes forming a source electrode and a drain electrode on a substrate. A semiconductor layer, an organic insulating layer, and a gate electrode layer are sequentially formed to cover the substrate, the source electrode, and the drain electrode. A patterned photoresist layer is formed on the gate electrode layer. The exposed portion of the gate electrode layer, and a portion of the organic insulative layer and a portion of the semiconductor layer thereunder are removed to form a gate electrode. An organic passivation layer is formed on the gate electrode, the source electrode, and the drain electrode. The organic passivation layer has a contact window to expose a portion of the drain electrode. A pixel electrode is formed on the organic passivation layer and the exposed portion of the drain electrode.

摘要翻译： 这里公开了一种阵列基板的制造方法。 该方法包括在基板上形成源电极和漏电极。 依次形成半导体层，有机绝缘层和栅电极层，以覆盖基板，源电极和漏电极。 在栅电极层上形成图案化的光致抗蚀剂层。 除去栅电极层的露出部分，有机绝缘层的一部分及其下面的半导体层的一部分，形成栅电极。 在栅电极，源电极和漏电极上形成有机钝化层。 有机钝化层具有暴露漏电极的一部分的接触窗口。 在有机钝化层和漏电极的露出部分上形成像素电极。

公开(公告)号：US09443986B2

公开(公告)日：2016-09-13

申请号：US14195863

申请日：2014-03-04

申请人： E Ink Holdings Inc.

发明人： Chih-Hsuan Wang ,  Chia-Chun Yeh ,  Ted-Hong Shinn

IPC分类号： H01L29/10 ,  H01L29/786 ,  H01L29/26

CPC分类号： H01L29/7869 ,  H01L29/26

摘要： A thin file transistor includes a gate electrode, a source electrode, a drain electrode, a gate-insulating layer, and an oxide semiconductor layer. The oxide semiconductor layer includes indium-gallium-zinc oxide with a formula of InxGayZnzOw, in which x, y and z satisfy the following formulas 1.5≦(y/x)≦2 and 1.5≦(y/z)≦2. The gate-insulating layer is positioned between the gate electrode and the oxide semiconductor layer. The source electrode and the drain electrode are respectively connected to two different sides of the oxide semiconductor layer.

摘要翻译： 薄文件晶体管包括栅电极，源电极，漏电极，栅极绝缘层和氧化物半导体层。 氧化物半导体层包括具有InxGayZnzOw式的铟镓锌氧化物，其中x，y和z满足下式1.5≤（y / x）≤2和1.5≤（y / z）≤2。 栅极绝缘层位于栅电极和氧化物半导体层之间。 源电极和漏电极分别连接到氧化物半导体层的两个不同侧。

公开(公告)号：US09261265B1

公开(公告)日：2016-02-16

申请号：US14724831

申请日：2015-05-29

申请人： E Ink Holdings Inc.

发明人： Shu-Ping Yan ,  Pei-Lin Huang ,  Wei-Chou Lan ,  Chia-Chun Yeh

IPC分类号： G09G3/10 ,  F21V23/00 ,  H05B33/12 ,  F21S8/00 ,  F21Y105/00

CPC分类号： H05B33/12

摘要： A backlight display device includes a pixel region, a light-emitting region, a control element, a plurality of first flexible printed circuit board (FPCB) contacts, and a plurality of first driving circuits. The pixel region has a first edge, a second edge opposite to the first edge, a third edge, and a fourth edge opposite to the third edge. A corner region is formed between the first edge and the fourth edge. The light-emitting region is located on the corner region of the pixel region. The control element is located on the corner region of the pixel region and between the light-emitting region and the first edge. The first FPCB contacts are located on the second edge. Each of the first driving circuits is electrically connected to one of the first FPCB contacts and the control element.

摘要翻译： 背光源显示装置包括像素区域，发光区域，控制元件，多个第一柔性印刷电路板（FPCB）触点和多个第一驱动电路。 像素区域具有第一边缘，与第一边缘相对的第二边缘，第三边缘和与第三边缘相对的第四边缘。 在第一边缘和第四边缘之间形成角区域。 发光区域位于像素区域的拐角区域。 控制元件位于像素区域的角区域和发光区域与第一边缘之间。 第一FPCB触点位于第二边缘。 第一驱动电路中的每一个电连接到第一FPCB触点和控制元件中的一个。