Abstract:
The disclosure relates to a device for supplying to at least one integrated circuit a high voltage for erasing and/or programming of a memory. The device includes at least one contact terminal linked to at least one contact terminal of the integrated circuit, a monitor for monitoring a data signal received by the integrated circuit and detecting in the data signal a write command of the memory, and a voltage supplier for applying the high voltage to a terminal of the integrated circuit when a write command of the memory has been detected by the monitor.
Abstract:
Integrated circuit comprising doped zones (3 to 8) formed in a substrate (1, 2), forming a parasitic thyristor structure with two parasitic bipolar transistors (T1, T2), the integrated circuit comprising two metallizations (16, 19) interconnecting each of the two corresponding doped zones (4, 5; 6, 7) of the integrated circuit, to reduce the base resistances (RP−, RP−) of the two bipolar transistors, at least one of the metallizations (16, 19) performed to reduce the base resistances (RN−, RP−) of the two bipolar transistors, being connected to a power supply metallization (15, 16) in the integrated circuit, entirely through the substrate (1, 2).
Abstract:
An input stage of an integrated circuit, includes a comparator for comparing the voltage of an input signal of the input stage with a reference voltage, and supplying a binary output signal the value of which depends on the result of the comparison of the input signal with the reference voltage. The input stage comprises a feedback circuit measuring a parameter representative of the operation of the comparator, and raising the reference voltage while the measured parameter reveals a faulty operation of the comparator.
Abstract:
The disclosure relates to an electrically erasable and programmable memory, comprising memory cells arranged in bit lines and word lines transverse to bit lines, wherein each memory cell may be in a programmed or erased state, the memory comprising memory cell selection circuits configured to memorize and read data bits in two memory cells belonging to different bit lines and different word lines, and to avoid a memory cell from being written or read by mistake in another state than a default state after a gate oxide breakdown of a transistor of the memory, and a read circuit to determine a data bit to be read in the memory according to the states of the two memory cells memorizing the data bit.
Abstract:
Device for protecting an integrated circuit, comprising a device for detecting a latch-up condition, and a supply voltage control device for controlling a supply voltage of the integrated circuit, to modify a parameter of the supply voltage of the integrated circuit in order to prevent the latch-up from becoming permanently established.
Abstract:
An input stage of an integrated circuit, includes a comparator for comparing the voltage of an input signal of the input stage with a reference voltage, and supplying a binary output signal the value of which depends on the result of the comparison of the input signal with the reference voltage. The input stage comprises a feedback circuit measuring a parameter representative of the operation of the comparator, and raising the reference voltage while the measured parameter reveals a faulty operation of the comparator.
Abstract:
The disclosure concerns integrated circuits and, more particularly, their protection against electrostatic discharges. To protect a metallized pad in a CMOS circuit on an N substrate with P wells, an NPN type lateral bipolar transistor formed in a P-type well is used. The emitter is an N+ region connected to the pad. The collector is an N+ region connected to a metallization which is itself connected, like the substrate N, to the high supply voltage Vcc of the circuit. The well is taken to the potential of the pad to be protected by means of an ohmic contact by a P+ surface diffusion of the well. In the preferred embodiment of the invention, the region that acts as a collector includes a part extending laterally outside the P well, and it is in this external part that the contact with the metallization occurs. The contact is at a sufficient distance from the well for there to be no risk of damage to the trench/substrate junction when the density of current flowing through the metallization is high.
Abstract:
Embodiments of the disclosure relate to a method of evaluating a semiconductor wafer dicing process, comprising providing evaluation lines extending in at least one scribe line of the wafer, dicing the wafer in the scribe line, evaluating the length of the evaluation lines, providing an information about their length, and using the information to evaluate the dicing process.
Abstract:
The disclosure relates to an electrically erasable and programmable memory comprising at least one word of memory cells with first and second control gate transistors in parallel to apply a control gate voltage to the memory cells of the word. The memory also comprises s first control circuit to supply a first control voltage to a control terminal of the first control gate transistor through a first current limiter, and a second control circuit to supply a second control voltage to a control terminal of the second control gate transistor through second current limiter.
Abstract:
A method for electrically programming a non-volatile memory in which a programming cycle includes prior addressing of memory cells from an initial address corresponding to a first row and a column of a memory plane. The method may include addressing the memory cells in a second consecutive row when the end of the first row i is reached to store data on bits with consecutive and increasing addresses in two consecutive rows.