公开(公告)号：US20180074226A1

公开(公告)日：2018-03-15

申请号：US15701537

申请日：2017-09-12

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yoshiro NOMOTO ,  Yoshitaka KUROSAKA ,  Kazuyoshi HIROSE ,  Takahiro SUGIYAMA ,  Soh UENOYAMA

IPC: G02B1/00 ,  G02B5/00 ,  G02F1/19

CPC classification number: G02B1/002 ,  G02B5/008 ,  G02B2207/101 ,  G02F1/19 ,  G02F2202/30

Abstract: A metasurface includes a substrate including a light input surface into which input light is input and a light output surface facing the light input surface, and a plurality of V-shaped antenna elements disposed on the light output surface of the substrate and including a first arm and a second arm continuing on one end of the first arm. The each of the V-shaped antenna elements has a thickness in a range of 100 nm to 400 nm.

公开(公告)号：US20170338624A1

公开(公告)日：2017-11-23

申请号：US15538219

申请日：2015-12-24

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yuu TAKIGUCHI ,  Kazuyoshi HIROSE ,  Yoshitaka KUROSAKA ,  Takahiro SUGIYAMA ,  Yoshiro NOMOTO

IPC: H01S5/042 ,  H01S5/12 ,  H01S5/022 ,  H01S5/18 ,  H01S5/026 ,  H01S5/343

CPC classification number: H01S5/0425 ,  G02F1/13 ,  H01S3/1065 ,  H01S5/0228 ,  H01S5/026 ,  H01S5/0624 ,  H01S5/06243 ,  H01S5/105 ,  H01S5/12 ,  H01S5/14 ,  H01S5/18 ,  H01S5/18302 ,  H01S5/18361 ,  H01S5/34313 ,  H01S5/34353 ,  H01S2301/02 ,  H01S2301/20

Abstract: This semiconductor laser device includes a semiconductor laser chip and a spatial light modulator SLM optically coupled to the semiconductor laser chip. The semiconductor laser chip LDC includes an active layer 4, a pair of cladding layers 2 and 7 sandwiching the active layer 4, a diffraction grating layer 6 optically coupled to the active layer 4, and a drive electrode E3 that is disposed between the cladding layer 2 and the spatial light modulator SLM and supplies an electric current to the active layer 4, and the drive electrode E3 is positioned within an XY plane and has a plurality of openings as viewed from a Z-axis direction and has a non-periodic structure.