中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

41 records (took 0.03 seconds)

    PRINT COMPONENT WITH MEMORY ARRAY USING INTERMITTENT CLOCK SIGNAL
    34.
    发明申请
    PRINT COMPONENT WITH MEMORY ARRAY USING INTERMITTENT CLOCK SIGNAL 有权

    公开(公告)号：US20210221127A1

    公开(公告)日：2021-07-22

    申请号：US16767914

    申请日：2019-02-06

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： James Michael GARDNER ,  Scott A. LINN ,  Michael W. CUMBIE

    IPC: B41J2/045

    Abstract: A print component includes a plurality of data pads, a clock pad to receive an intermittent clock signal, and a plurality of actuator groups each corresponding to a different liquid type and to a different one of the data pads. Each actuator group includes a plurality of configuration functions, an array of fluid actuators, and an array of memory elements including a first portion corresponding to the plurality of configuration functions and a second portion corresponding to the array of fluid actuators. Each time the intermittent clock signal is present on the clock pad, the array of memory elements to serially load a segment of data bits from the corresponding data pad, including loading a first portion of data bits into the first portion of memory elements, and loading a second portion of data bits into the second portion of memory elements.

    LOGIC CIRCUITRY PACKAGE
    35.
    发明申请
    LOGIC CIRCUITRY PACKAGE 有权

    公开(公告)号：US20210221121A1

    公开(公告)日：2021-07-22

    申请号：US16768321

    申请日：2019-10-25

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Scott A. LINN ,  Michael W. CUMBIE ,  James Michael GARDNER

    IPC: B41J2/045

    Abstract: A logic circuitry package for a replaceable print apparatus component includes an I2C interface to communicate with a print apparatus logic circuit and at least one logic circuit. The at least one logic circuit is configured to respond to communications over the I2C interface that are directed to an initial or reconfigured I2C address. The at least one logic circuit is configured to receive, via the I2C interface, a write command to a first memory address of the logic circuit to initiate a first function of the logic circuit. The at least one logic circuit is configured to generate first data in response to the first function. The at least one logic circuit is configured to receive, via the I2C interface, a first read command to a second memory address of the logic circuit. The at least one logic circuit is configured to transmit, via the I2C interface, the first data in response to the first read command to the second memory address.

    MULTIPLE CIRCUITS COUPLED TO AN INTERFACE
    36.
    发明申请
    MULTIPLE CIRCUITS COUPLED TO AN INTERFACE 有权

    公开(公告)号：US20210213732A1

    公开(公告)日：2021-07-15

    申请号：US16956331

    申请日：2019-02-06

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： James Michael GARDNER ,  Scott A. LINN ,  Michael W. CUMBIE

    IPC: B41J2/045

    Abstract: An integrated circuit to drive a plurality of fluid actuation devices includes an interface, a first sensor, a second sensor, and control logic. The interface is to connect to a single contact pad of a host print apparatus. The first sensor is of a first type and is coupled to the interface. The second sensor is of a second type and is coupled to the interface. The second type is different from the first type. The control logic enables the first sensor or the second sensor to provide an enabled sensor. A voltage bias or a current bias applied to the interface generates a sensed current or a sensed voltage, respectively, on the interface indicating the state of the enabled sensor.

    TEMPERATURE-CYCLING MICROFLUIDIC DEVICES
    38.
    发明申请
    TEMPERATURE-CYCLING MICROFLUIDIC DEVICES 有权

    公开(公告)号：US20210060548A1

    公开(公告)日：2021-03-04

    申请号：US16643954

    申请日：2017-11-22

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Adam HIGGINS ,  Alexander GOVYADINOV ,  Michael W. CUMBIE

    IPC: B01L3/00 ,  B01L7/00 ,  C12Q1/68

    Abstract: The present disclosure is drawn to temperature-cycling microfluidic devices. In one example, a temperature-cycling microfluidic device can include a driver chip having a top surface and a heat exchange substrate having a top surface coplanar with the top surface of the driver chip. A fluid chamber can be located on the top surface of the driver chip. A first and second microfluidic loop can have fluid driving ends and fluid outlet ends connected to the fluid chamber and can include portions thereof located on the top surface of the heat exchange substrate. A first and second fluid actuator can be on the driver chip. The first and second fluid actuators can be associated with the fluid driving ends of the first and second microfluidic loops, respectively, to circulate fluid through the first and second microfluidic loops.

Patent Agency Ranking