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公开(公告)号：US07268061B2
公开(公告)日：2007-09-11
申请号：US11001575
申请日：2004-12-01
申请人： Atsushi Miyanari , Kosuke Doi , Ken Miyagi , Yoshihiro Inao , Koichi Misumi
发明人： Atsushi Miyanari , Kosuke Doi , Ken Miyagi , Yoshihiro Inao , Koichi Misumi
IPC分类号： H01L21/20
CPC分类号： H01L21/6835 , H01L21/6836 , H01L21/78 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , Y10T428/28
摘要： A method for attaching a substrate such as a semiconductor wafer in which cracking or chipping can be prevented when the substrate is thinned involves applying adhesive liquid onto a circuit (element)-formed surface of a semiconductor wafer. The adhesive liquid undergoes preliminary drying, so that its flowability is reduced and it can keep its shape as an adhesive layer. For the preliminary drying, heating is conducted for 5 minutes at a temperature of 80° C. by using an oven. The thickness of the adhesive layer is determined based on the irregularities of the circuit which has been formed on the surface of the semiconductor wafer. Next, a supporting plate is attached to the semiconductor wafer on which the adhesive layer of a desired thickness has been formed.
摘要翻译： 一种用于安装诸如半导体晶片的衬底的方法，其中当衬底变薄时可以防止裂纹或碎裂，包括将粘合剂液体施加到半导体晶片的电路（元件）形成表面上。 粘合剂液体进行预干燥，其流动性降低，并且可以保持其作为粘合剂层的形状。 对于预干燥，通过使用烘箱在80℃的温度下加热5分钟。 基于在半导体晶片的表面上形成的电路的凹凸来确定粘合剂层的厚度。 接下来，将支撑板安装到其上形成有所需厚度的粘合剂层的半导体晶片上。
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公开(公告)号：US20050180744A1
公开(公告)日：2005-08-18
申请号：US10997816
申请日：2004-11-24
申请人： Akihiko Nakamura , Yoshihiro Inao
发明人： Akihiko Nakamura , Yoshihiro Inao
IPC分类号： G03F7/30 , B05C11/08 , B05C11/10 , G03D3/08 , H01L21/027
CPC分类号： G03D3/08
摘要： A developing apparatus and method is provided in which the use amount of a developing solution can be reduced without deteriorating the accuracy of development. The developing apparatus comprises a new solution tank for storing an unused developing solution and a used solution tank for storing a used developing solution which is withdrawn from a material to be treated. A new solution feeding nozzle extends from the new solution tank, and the tip end of the nozzle faces toward the upper portion of the cup of each developing unit. A used solution feeding nozzle extends from the used solution tank, and the tip end of the nozzle faces toward the upper portion of the cup of each developing unit.
摘要翻译： 提供一种显影装置和方法，其中可以降低显影液的使用量，而不会降低显影精度。 显影装置包括用于储存未使用的显影液的新溶液罐和用于储存从待处理材料中取出的用过的显影液的用过的溶液罐。 新的溶液供给喷嘴从新的溶液罐延伸，并且喷嘴的尖端面向每个显影单元的杯的上部。 使用的溶液供给喷嘴从使用的溶液罐延伸，并且喷嘴的前端朝向每个显影单元的杯的上部。
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公开(公告)号：US08167687B2
公开(公告)日：2012-05-01
申请号：US12309285
申请日：2007-05-24
CPC分类号： B24B41/068 , B24B7/228 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L2221/68318 , H01L2221/68327
摘要： A wafer can be thinned without occurrences of dimples. A support plate 1 has a number of through holes 10. A circuit forming surface of a wafer 2 is adhered to one surface of the support plate by an adhesive member 4, and a dimple prevention member 3 having a thickness of 100 μm or more and having an adhesive layer 30 on one face is adhered to the other surface, thus the openings at both ends of the through holes 10 are blocked. The support plate is vacuum adsorbed to a support table through the dimple prevention member, and a non circuit-forming face of the wafer is ground/polished to thin the wafer. The dimple prevention member is stripped off, and a solvent is penetrated into the adhesive member through the through holes to detach the wafer from the support plate.
摘要翻译： 晶片可以变薄而不发生凹坑。 支撑板1具有多个通孔10.晶片2的电路形成表面通过粘合构件4和厚度为100μm以上的凹坑防止构件3粘附到支撑板的一个表面，以及 在一个面上具有粘合剂层30粘附到另一个表面，因此通孔10的两端的开口被阻挡。 支撑板通过凹坑防止构件被真空吸附到支撑台上，并且将晶片的非电路形成面研磨/抛光以使晶片变薄。 剥去防止凹坑的构件，并且通过通孔将溶剂渗透到粘合构件中，以将晶片从支撑板上分离。
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34.发明授权公开(公告)号：US07919394B2
公开(公告)日：2011-04-05
申请号：US11517157
申请日：2006-09-07
CPC分类号： H01L21/78 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68363
摘要： A method for thinning a substrate and a method for manufacturing a circuit device which make it possible to prevent the pattern of penetrating holes of a supporting plate from being transferred to the surface of the substrate and prevent non-uniform grinding of the surface of the substrate from occurring. The supporting plate and the substrate are joined by using an adhesive layer, and a sheet is attached to the supporting plate. The surface of the supporting plate to which the sheet has been attached is mounted and fixed by attraction onto an attracting head. The surface of the semiconductor wafer on which no circuit device is formed is ground by a grinder in this state.
摘要翻译： 一种用于使基板变薄的方法和用于制造电路器件的方法，其可以防止支撑板的穿透图案被转移到基板的表面并防止基板表面的不均匀研磨 从发生。 支撑板和基板通过使用粘合剂层接合，并且片材附接到支撑板。 已经安装了片材的支撑板的表面通过吸引安装和固定到吸引头上。 在该状态下，通过研磨机研磨不形成电路器件的半导体晶片的表面。
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35.发明申请ADHESIVE COMPOSITION, FILM ADHESIVE, AND PROCESS FOR PRODUCTION OF THE COMPOSITION 审中-公开胶粘组合物，胶粘剂和组合物的生产方法公开(公告)号：US20100178497A1
公开(公告)日：2010-07-15
申请号：US12377155
申请日：2007-08-03
申请人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura , Koji Saito
发明人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura , Koji Saito
IPC分类号： C08F120/18 , B32B27/36 , B32B27/32
CPC分类号： C09J133/10 , C09J7/381 , C09J125/14 , C09J2425/00 , C09J2433/00 , Y10T428/2891
摘要： Disclosed is an adhesive composition which is mainly composed of a polymer obtained by copolymerizing a monomer composition containing styrene, (meth)acrylic acid ester having a cyclic structure and alkyl (meth)acrylate having a chain structure. The monomer composition may additionally contain a bifunctional monomer, thereby improving heat resistance, adhesive strength under high temperature conditions, and alkali resistance, and easiness in stripping of an adhesive composition that has been processed at a high temperature. Consequently, there can be obtained an adhesive composition which has high heat resistance, adhesion strength under high temperature conditions, and alkali resistance, and which can be easily stripped off after the adhesive composition is processed at a high temperature.
摘要翻译： 公开了主要由通过共聚包含苯乙烯的单体组合物，具有环状结构的（甲基）丙烯酸酯和具有链结构的（甲基）丙烯酸烷基酯）而得到的聚合物的粘合剂组合物。 单体组合物可以另外含有双官能单体，从而提高耐热性，高温条件下的粘合强度和耐碱性，以及在高温下处理的粘合剂组合物的剥离容易性。 因此，可以获得在高温条件下具有高耐热性，粘合强度和耐碱性的粘合剂组合物，并且在粘合剂组合物在高温下加工后可以容易地剥离。
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公开(公告)号：US20100069593A1
公开(公告)日：2010-03-18
申请号：US12516363
申请日：2007-09-27
IPC分类号： C08F18/02
CPC分类号： C09J133/04 , C09J7/381 , C09J125/14 , C09J135/06 , C09J2203/326 , C09J2205/114 , C09J2425/00 , C09J2433/00 , H01L21/6835 , H01L2221/6834 , H01L2924/30105 , Y10T428/2852 , Y10T428/2891
摘要： An adhesive composition of the present invention includes, as a main component, a polymer produced by copolymerization of a monomer composition including: styrene; a (meth)acrylic acid alkyl ester having a chain structure; a (meth)acrylic acid ester having an aliphatic ring; and a (meth)acrylic acid ester having an aromatic ring, wherein: the styrene is contained in a range of 40 to 69 parts by mass; the (meth)acrylic acid alkyl ester having the chain structure is contained in a range of 20 to 30 parts by mass; the (meth)acrylic acid ester having the aliphatic ring is contained in a range of 10 to 25 parts by mass; and the (meth)acrylic acid ester having the aromatic ring is contained in a range of 1 to 5 parts by mass, where the total amount of the above components is 100 parts by mass. This allows for provision of an adhesive composition having high adhesive strength under high-temperature environment, as well as high heat resistance, high alkali resistance, and easiness in stripping from semiconductor wafers and the like even after high-temperature processing.
摘要翻译： 作为主要成分，本发明的粘合剂组合物包含通过使包含苯乙烯的单体组合物共聚而制造的聚合物， 具有链结构的（甲基）丙烯酸烷基酯; 具有脂肪族环的（甲基）丙烯酸酯; 和具有芳香环的（甲基）丙烯酸酯，其中：所述苯乙烯的含量为40〜69质量份; 具有链结构的（甲基）丙烯酸烷基酯的含量为20〜30质量份; 具有脂肪族环的（甲基）丙烯酸酯的含量为10〜25质量份; 具有芳环的（甲基）丙烯酸酯的含量为1〜5质量份，上述成分的总量为100质量份。 这允许在高温环境下提供具有高粘合强度的粘合剂组合物，以及即使在高温处理之后也具有高耐热性，高耐碱性和从半导体晶片等剥离的容易性。
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公开(公告)号：US20090137760A1
公开(公告)日：2009-05-28
申请号：US12090343
申请日：2006-10-23
申请人： Koichi Misumi , Ken Miyagi , Atsushi Miyanari , Yoshihiro Inao
发明人： Koichi Misumi , Ken Miyagi , Atsushi Miyanari , Yoshihiro Inao
IPC分类号： C08F118/02
CPC分类号： C09J133/06 , B24B37/30 , B24B37/34 , C09J7/385 , C09J133/08 , C09J133/10 , C09J2203/326 , H01L21/67132 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , Y10T428/2861 , Y10T428/2891 , Y10T428/31935
摘要： An adhesive composition which is reduced in gas generation upon heating (has low hygroscopicity), has high alkali resistance, has heat resistance of 200° C. or higher, and can be easily removed with a stripping liquid; and an adhesive film made with the adhesive composition. The adhesive composition is prepared using, at least as a major ingredient, an acrylic polymer produced from (a) styrene, (b) a (meth)acrylic ester monomer containing a cyclic skeleton, and (c) an alkyl (meth)acrylate monomer. The adhesive film has an adhesive composition layer formed from this adhesive composition.
摘要翻译： 在加热时气体产生减少（吸湿性低）的粘合剂组合物具有高耐碱性，耐热性为200℃以上，并且可以容易地用剥离液除去; 和由粘合剂组合物制成的粘合膜。 粘合剂组合物使用（a）苯乙烯，（b）含有环状骨架的（甲基）丙烯酸酯单体，（c）（甲基）丙烯酸烷基酯单体 。 粘合剂膜具有由该粘合剂组合物形成的粘合剂组合物层。
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公开(公告)号：USD552565S1
公开(公告)日：2007-10-09
申请号：US29255502
申请日：2006-03-08
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公开(公告)号：US08449691B2
公开(公告)日：2013-05-28
申请号：US12448916
申请日：2008-01-11
IPC分类号： B08B3/00
CPC分类号： H01L21/67132 , H01L21/67086 , Y10T156/1111
摘要： In order to provide a liquid solvent abutment unit for accelerating the reaction of a liquid solvent against an adhesive member existing between a perforated support plate and a wafer, a liquid solvent abutment unit includes a supply part for supplying a support plate surface with a liquid solvent, a retention part for retaining the supplied liquid solvent in the hole-formed region on the support plate surface; a recovery part for recovering the liquid solvent retained in the hole-formed region, and a vibration unit for vibrating the liquid solvent.
摘要翻译： 为了提供液体溶剂抵靠单元，用于加速液体溶剂与存在于多孔支撑板和晶片之间的粘合剂的反应，液体溶剂抵靠单元包括用于向支撑板表面供给液体溶剂的供应部件 ，用于将所提供的液体溶剂保持在支撑板表面上的孔形区域中的保持部分; 用于回收保留在孔形区域中的液体溶剂的回收部分和用于使液体溶剂振动的振动单元。
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公开(公告)号：US08097087B2
公开(公告)日：2012-01-17
申请号：US12837790
申请日：2010-07-16
IPC分类号： B08B5/00
CPC分类号： B08B7/0035
摘要： A method of cleaning a support plate according to which, while no waste solution is produced after cleaning the support plate, the support plate can be treated at low cost. The method of cleaning the support plate includes the step of removing an organic substance adhered to the support plate by putting the support plate in contact with oxygen plasma.
摘要翻译： 一种清洁支撑板的方法，其中，在清洁支撑板之后不会产生废溶液的情况下，可以以低成本处理支撑板。 清洁支撑板的方法包括通过将支撑板与氧等离子体接触来去除附着到支撑板上的有机物质的步骤。
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