摘要:
A semiconductor device comprises a wiring layer. The wiring layer is provided by forming a sidewall film having a closed-loop along a sidewall of a hard mask, etching off the hard mask to leave the sidewall film, and then etching a target material to be etched with a mask of the sidewall film. The wiring layer includes a folded wiring section formed along an end of the hard mask, and a parallel section composed of two parallel wires continued from the folded wiring section. The wiring layer has a closed-loop cut made in a portion except for the folded wiring section and the parallel section. The folded wiring section and the parallel section are used as a contact region for connection to another wire.
摘要:
A semiconductor device comprises a wiring layer. The wiring layer is provided by forming a sidewall film having a closed-loop along a sidewall of a hard mask, etching off the hard mask to leave the sidewall film, and then etching a target material to be etched with a mask of the sidewall film. The wiring layer includes a folded wiring section formed along an end of the hard mask, and a parallel section composed of two parallel wires continued from the folded wiring section. The wiring layer has a closed-loop cut made in a portion except for the folded wiring section and the parallel section. The folded wiring section and the parallel section are used as a contact region for connection to another wire.
摘要:
An input/output connection device includes a generating section which generates an inspection packet that has a tag that uniquely identifies the packet, a transmitting section which transmits the inspection packet to the input/output device, a receiving section which receives a packet, a first determining section which determines, on the basis of a tag of the packet received by the receiving section, whether or not the received packet is a packet transmitted in response to the inspection packet transmitted by the transmitting section, and a second determining section which analyzes the received packet and determines whether or not the input/output device is normal when the first determining section determines that the received packet is the packet transmitted in response to the inspection packet.
摘要:
A solid-state imaging device with a structure such that an electrode for reading a signal charge is provided on one side of a light-receiving sensor portion constituting a pixel; a predetermined voltage signal V is applied to a light-shielding film formed to cover an image pickup area except the light-receiving sensor portion; a second-conductivity-type semiconductor area is formed in the center on the surface of a first-conductivity-type semiconductor area constituting a photo-electric conversion area of the light-receiving sensor portion; and areas containing a lower impurity concentration than that of the second-conductivity-type semiconductor area is formed on the surface of the first-conductivity-type semiconductor area at the end on the side of the electrode and at the opposite end on the side of a pixel-separation area.
摘要:
According to one embodiment, there are provided a first electrode, a second electrode, first and second variable-resistance layers that are arranged between the first electrode and the second electrode, and at least one non variable-resistance layer that is arranged so that positions of the first and second variable-resistance layers between the first electrode and the second electrode are symmetrical to each other.
摘要:
An ink jet type recording head includes a substrate, a nozzle plate having nozzles, and a sealing sheet, and the substrate and the nozzle plate are bonded to each other through a bonding film, and the substrate and the sealing sheet are bonded to each other through a bonding film. These bonding films are each obtained by drying and/or curing a liquid material containing an epoxy-modified silicone material. Further, by applying energy to each bonding film, the surface thereof is activated, and therefore, each bonding film exhibits a bonding property. By this bonding property, the substrate is bonded to the nozzle plate and to the sealing sheet.
摘要:
A brake includes an annular boot which can be expanded and contracted according to movements of a piston and is assembled to an opening part of a cylinder and to an annular groove on an outer peripheral face of the piston. The boot is assembled by: engaging one end of the boot with the opening part of the cylinder in a state where the piston is contained in the cylinder; moving the piston so that at least a part of the piston is withdrawn from the cylinder and that the other end of the boot is pressed by a pressing face of the piston; and fitting the other end of the boot into the annular groove of the piston, while a movable range of the other end of the boot is restricted by an expanding allowance of the boot whose one end is engaged with the opening part of the cylinder.
摘要:
In one embodiment, there is provided a method for a computer aiding a design of a power supply that includes extracting data of one of a plurality of power supplies of an apparatus from product data about the apparatus, extracting data of a power supply system from power supply system data, the one of the plurality power supplies system is not allocated to any of the plurality of power supplies of the apparatus and associating the extracted data of the power supply with the extracted data of the power supply system in power supply allocation result data.
摘要:
A warning device checks for errors in design object data and issues a warning for detected errors by storing allowance information, which allows issuance of warning prevention, cancel information, which cancels relevant allowance information to permit issuance of warning for each error identification, and instruction identification, which identifies an edit command for editing generated design object data for error identification. When said edit command is accepted, the error identification for the instruction identification of edit command is acquired. Cancel information can be registered for error identification. Respective errors corresponding to error identifications are checked, when an operation for checking the design object data is accepted, and when a type of an error is identified, whether to issue a warning based on the allowance information and cancel information for relevant error identification is determined.
摘要:
A method for manufacturing a semiconductor device, comprises providing a semiconductor layer deposited on a substrate with heat treatment by using a flame of a gas burner fueled by a hydrogen-and-oxygen mixed gas as a heat source.