公开(公告)号：US20210091443A1

公开(公告)日：2021-03-25

申请号：US16577478

申请日：2019-09-20

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Telesphor Kamgaing ,  Georgios Dogiamis ,  Feras Eid ,  Johanna M. Swan

IPC: H01P1/203 ,  H01P1/20 ,  H01P7/10 ,  H01P11/00 ,  H01P7/06

Abstract: Embodiments may relate to an assembly that includes a first package substrate with a first electromagnetic cavity. The assembly may further include a second package substrate with a second electromagnetic cavity that is adjacent to the first electromagnetic cavity. The first and second electromagnetic cavities may form a millimeter wave (mmWave) resonant cavity of a mmWave filter. Other embodiments may be described or claimed.

公开(公告)号：US10951248B1

公开(公告)日：2021-03-16

申请号：US16725494

申请日：2019-12-23

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Feras Eid ,  Georgios Dogiamis ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC: H04B1/00 ,  H04B1/04 ,  H03H7/38

Abstract: Embodiments may relate to a radio frequency (RF) front-end module (FEM) with a first filter and a second filter. The RF FEM may include a termination inductor coupled to ground, and a switch that is to selectively couple the first filter and the second filter to the termination inductor. Other embodiments may be described or claimed.

公开(公告)号：US20210043573A1

公开(公告)日：2021-02-11

申请号：US16533215

申请日：2019-08-06

Applicant: Intel Corporation

Inventor： Feras Eid ,  Telesphor Kamgaing ,  Georgios Dogiamis ,  Aleksandar Aleksov ,  Johanna M. Swan

IPC: H01L23/538 ,  H01L23/498 ,  H01L27/20 ,  H01L25/18 ,  H01L23/00 ,  H01L41/053 ,  H03H9/205 ,  H01L23/14 ,  H01L23/66 ,  H01L23/31 ,  H01L23/38 ,  H01L35/32 ,  H01L23/427 ,  H03H9/05 ,  H03H9/02

Abstract: Disclosed herein are structures and assemblies that may be used for thermal management in integrated circuit (IC) packages.

公开(公告)号：US10816733B2

公开(公告)日：2020-10-27

申请号：US16072240

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Sasha N. Oster ,  Johanna M. Swan ,  Feras Eid ,  Thomas L. Sounart ,  Aleksandar Aleksov ,  Shawna M. Liff ,  Baris Bicen ,  Valluri R. Rao

IPC: G02B6/35 ,  H04Q11/00 ,  G02B26/08 ,  H04B10/25

Abstract: Embodiments of the invention include an optical routing device that includes an organic substrate. According to an embodiment, an array of cavities are formed into the organic substrate and an array of piezoelectrically actuated mirrors may be anchored to the organic substrate with each piezoelectrically actuated mirror extending over a cavity. In order to properly rout incoming optical signals, the optical routing device may also include a routing die mounted on the organic substrate. The routing die may be electrically coupled to each of the piezoelectrically actuated mirrors and is able to generated a voltage across the first and second electrodes of each piezoelectrically actuated mirror. Additionally, a photodetector may be electrically coupled to the routing die. According to an embodiment, an array of fiber optic cables may be optically coupled with one of the piezoelectrically actuated mirrors and optically coupled with the photodetector.

公开(公告)号：US20200303327A1

公开(公告)日：2020-09-24

申请号：US16394514

申请日：2019-04-25

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Georgios Dogiamis ,  Johanna M. Swan ,  Aleksandar Aleksov ,  Telesphor Kamgaing ,  Henning Braunisch

IPC: H01L23/66 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L21/48 ,  H01L21/683 ,  H01L25/00

Abstract: Embodiments may relate to a microelectronic package that includes a substrate signal path and a waveguide. The package may further include dies that are communicatively coupled with one another by the substrate signal path and the waveguide. The substrate signal path may carry a signal with a frequency that is different than the frequency of a signal that is to be carried by the waveguide. Other embodiments may be described or claimed.

公开(公告)号：US20200296823A1

公开(公告)日：2020-09-17

申请号：US16399024

申请日：2019-04-30

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Johanna M. Swan ,  Georgios Dogiamis ,  Henning Braunisch ,  Adel A. Elsherbini ,  Aleksandar Aleksov

IPC: H05K1/02 ,  H01L23/66 ,  H01P5/08

Abstract: Embodiments may relate to an electronic module for use in an electronic device. The electronic module may include a printed circuit board (PCB) with a first die and a second die. A waveguide channel may be communicatively coupled with the first die and the second die and configured to convey an electromagnetic signal from the first die to the second die. In embodiments, the electromagnetic signal may have a frequency greater than 30 gigahertz (GHz). Other embodiments may be described or claimed.

公开(公告)号：US20200280121A1

公开(公告)日：2020-09-03

申请号：US16369452

申请日：2019-03-29

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Aleksandar Aleksov ,  Telesphor Kamgaing ,  Gilbert W. Dewey ,  Hyung-Jin Lee

IPC: H01Q1/22 ,  H01L23/00 ,  H01L23/66 ,  H01L25/065 ,  H01L23/552 ,  H01L25/00

Abstract: Embodiments may relate to an semiconductor package. The semiconductor package may include a die coupled with the face of the package substrate. The semiconductor package may further include a waveguide coupled with the face of the package substrate adjacent to the die, wherein the waveguide is to receive an electromagnetic signal from the die and facilitate conveyance of the electromagnetic signal in a direction parallel to the face of the package substrate. Other embodiments may be described or claimed.

公开(公告)号：US10763216B2

公开(公告)日：2020-09-01

申请号：US16677533

申请日：2019-11-07

Applicant: Intel Corporation

Inventor： Henning Braunisch ,  Chia-Pin Chiu ,  Aleksandar Aleksov ,  Hinmeng Au ,  Stefanie M. Lotz ,  Johanna M. Swan ,  Sujit Sharan

IPC: H01L23/538 ,  H01L23/13 ,  H01L23/00 ,  H01L25/065 ,  H01L21/683

Abstract: A multi-chip package includes a substrate (110) having a first side (111), an opposing second side (112), and a third side (213) that extends from the first side to the second side, a first die (120) attached to the first side of the substrate and a second die (130) attached to the first side of the substrate, and a bridge (140) adjacent to the third side of the substrate and attached to the first die and to the second die. No portion of the substrate is underneath the bridge. The bridge creates a connection between the first die and the second die. Alternatively, the bridge may be disposed in a cavity (615, 915) in the substrate or between the substrate and a die layer (750). The bridge may constitute an active die and may be attached to the substrate using wirebonds (241, 841, 1141, 1541).

公开(公告)号：US10714434B1

公开(公告)日：2020-07-14

申请号：US16236435

申请日：2018-12-29

Applicant: Intel Corporation

Inventor： Srinivas V. Pietambaram ,  Kristof Darmawikarta ,  Aleksandar Aleksov

IPC: H01L21/00 ,  H01L23/64 ,  H01L49/02 ,  H01L23/13 ,  H01L21/48 ,  H01L23/538

Abstract: An embedded magnetic inductor coil is at least partially exposed in a recess that seats an embedded multi-chip interconnect bridge die on the coil. The embedded multi-chip interconnect bridge die provides a communications bridge between a dominant semiconductive device and a first semiconductive device.

公开(公告)号：US10672701B2

公开(公告)日：2020-06-02

申请号：US15762548

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Vivek Raghunathan ,  Yonggang Li ,  Aleksandar Aleksov ,  Adel A. Elsherbini ,  Johanna M. Swan

IPC: H01L23/498 ,  H01L21/48 ,  B23K26/06 ,  B23K26/36 ,  H01L21/768 ,  B23K103/16

Abstract: Discussed generally herein are methods and devices for flexible fabrics or that otherwise include thin traces. A device can include a flexible polyimide material, and a first plurality of traces on the flexible polyimide material, wherein the first plurality of traces are patterned on the flexible polyimide material using laser spallation.