公开(公告)号：US20180295720A1

公开(公告)日：2018-10-11

申请号：US15762791

申请日：2015-09-24

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Adel A. Elsherbini ,  Javier Soto Gonzalez ,  Dilan Seneviratne ,  Shruti R. Jaywant ,  Sashi S. Kandanur ,  Srinivas Pietambaram ,  Nadine L. Dabby ,  Braxton Lathrop ,  Rajat Goyal ,  Vivek Raghunathan

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H05K3/18 ,  H05K3/46 ,  H05K3/00 ,  H05K3/34 ,  H05K3/28 ,  H05K3/42

CPC classification number: H05K1/0283 ,  H01L23/145 ,  H01L23/5387 ,  H05K1/038 ,  H05K1/111 ,  H05K1/189 ,  H05K3/0023 ,  H05K3/0047 ,  H05K3/0052 ,  H05K3/0055 ,  H05K3/18 ,  H05K3/205 ,  H05K3/284 ,  H05K3/341 ,  H05K3/429 ,  H05K3/4661 ,  H05K3/4682 ,  H05K2201/0133 ,  H05K2201/0329 ,  H05K2201/09263 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: Some forms relate to an example stretchable electronic assembly. The stretchable electronic assembly includes a stretchable body that includes electronic components. A plurality of meandering conductors electrically connect the electronic components. The plurality of meandering conductors may be exposed from the stretchable body. A plurality of conductive pads are electrically connected to at least one of the electronic components or some of the plurality of meandering conductors. The plurality of conductive pads may be exposed from the stretchable body. The stretchable body includes an upper surface and lower surface. The plurality of meandering conductors may be exposed from the lower surface (in addition to, or alternatively to, the upper surface) of the stretchable body.

公开(公告)号：US10672701B2

公开(公告)日：2020-06-02

申请号：US15762548

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Vivek Raghunathan ,  Yonggang Li ,  Aleksandar Aleksov ,  Adel A. Elsherbini ,  Johanna M. Swan

IPC: H01L23/498 ,  H01L21/48 ,  B23K26/06 ,  B23K26/36 ,  H01L21/768 ,  B23K103/16

Abstract: Discussed generally herein are methods and devices for flexible fabrics or that otherwise include thin traces. A device can include a flexible polyimide material, and a first plurality of traces on the flexible polyimide material, wherein the first plurality of traces are patterned on the flexible polyimide material using laser spallation.

公开(公告)号：US10327330B2

公开(公告)日：2019-06-18

申请号：US15762791

申请日：2015-09-24

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Adel A. Elsherbini ,  Javier Soto Gonzalez ,  Dilan Seneviratne ,  Shruti R. Jaywant ,  Sashi S. Kandanur ,  Srinivas Pietambaram ,  Nadine L. Dabby ,  Braxton Lathrop ,  Rajat Goyal ,  Vivek Raghunathan

IPC: H05K1/02 ,  H01L23/14 ,  H01L23/538 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/18 ,  H05K3/28 ,  H05K3/34 ,  H05K3/42 ,  H05K3/46 ,  H05K3/20

Abstract: Some forms relate to an example stretchable electronic assembly. The stretchable electronic assembly includes a stretchable body that includes electronic components. A plurality of meandering conductors electrically connect the electronic components. The plurality of meandering conductors may be exposed from the stretchable body. A plurality of conductive pads are electrically connected to at least one of the electronic components or some of the plurality of meandering conductors. The plurality of conductive pads may be exposed from the stretchable body. The stretchable body includes an upper surface and lower surface. The plurality of meandering conductors may be exposed from the lower surface (in addition to, or alternatively to, the upper surface) of the stretchable body.

公开(公告)号：US12078853B2

公开(公告)日：2024-09-03

申请号：US17474484

申请日：2021-09-14

Applicant: Intel Corporation

Inventor： Vivek Raghunathan ,  Myung Jin Yim

IPC: G02B6/42 ,  G02B6/122 ,  G02B6/132 ,  H01L25/16

CPC classification number: G02B6/4206 ,  G02B6/122 ,  G02B6/132 ,  G02B6/42 ,  G02B6/4212 ,  G02B6/4225 ,  G02B6/428 ,  H01L25/167

Abstract: Semiconductor package with one or more optical die(s) embedded therein is disclosed. The optical die(s) may have one or more overlying interconnect layers. Electrical contact to the optical die may be via the one or more overlying interconnect layers. An optical waveguide may be disposed next to the optical die and embedded within the semiconductor package. An optical fiber may be optically coupled to the optical waveguide.

公开(公告)号：US11156788B2

公开(公告)日：2021-10-26

申请号：US16317796

申请日：2016-07-14

Applicant: Intel Corporation

Inventor： Vivek Raghunathan ,  Myung Jin Yim

IPC: G02B6/42 ,  H01L25/16 ,  G02B6/132 ,  G02B6/122

Abstract: Semiconductor package with one or more optical die(s) embedded therein is disclosed. The optical die(s) may have one or more overlying interconnect layers. Electrical contact to the optical die may be via the one or more overlying interconnect layers. An optical waveguide may be disposed next to the optical die and embedded within the semiconductor package. An optical fiber may be optically coupled to the optical waveguide.