公开(公告)号：US20200236205A1

公开(公告)日：2020-07-23

申请号：US16843791

申请日：2020-04-08

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios Dogiamis ,  Vijay K. Nair

IPC: H04M1/02 ,  H01Q1/38 ,  G06F1/16 ,  H01Q9/04 ,  H01Q21/00 ,  H01Q23/00 ,  H01Q25/00 ,  H01Q1/40 ,  H01Q21/28 ,  H01Q1/24 ,  H01Q21/22

Abstract: Embodiments of the invention include a microelectronic device that includes a die having at least one transceiver unit, a redistribution package coupled to the die, and a substrate coupled to the redistribution package. The substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US10535634B2

公开(公告)日：2020-01-14

申请号：US15106761

申请日：2015-07-22

Applicant: INTEL CORPORATION

Inventor： Vijay K. Nair ,  Chuan Hu ,  Thorsten Meyer

IPC: H01L23/04 ,  H01L25/065 ,  H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

Abstract: Embodiments herein relate to a system in package (SiP). The SiP may have a first layer of one or more first functional components with respective first active sides and first inactive sides opposite the first active sides. The SiP may further include a second layer of one or more second functional components with respective second active sides and second inactive sides opposite the second active sides. In embodiments, one or more of the first active sides are facing and electrically coupled with one or more of the second active sides through a through-mold via or a through-silicon via.

公开(公告)号：US10432167B2

公开(公告)日：2019-10-01

申请号：US15088814

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Feras Eid ,  Baris Bicen ,  Telesphor Kamgaing ,  Vijay K. Nair ,  Johanna M. Swan ,  Georgios C. Dogiamis ,  Valluri R. Rao

IPC: H03H9/17 ,  H03H9/02 ,  H03H9/24 ,  H03H9/15

Abstract: Embodiments of the invention include a piezoelectric resonator which includes an input transducer having a first piezoelectric material, a vibrating structure coupled to the input transducer, and an output transducer coupled to the vibrating structure. In one example, the vibrating structure is positioned above a cavity of an organic substrate. The output transducer includes a second piezoelectric material. In operation the input transducer causes an input electrical signal to be converted into mechanical vibrations which propagate across the vibrating structure to the output transducer.

公开(公告)号：US20190267336A1

公开(公告)日：2019-08-29

申请号：US16334965

申请日：2016-09-23

Applicant: Intel Corporation

Inventor： Digvijay Ashokkumar Raorane ,  Vijay K. Nair

IPC: H01L23/66 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01Q1/22 ,  H05K1/18 ,  H05K1/02 ,  H05K3/46

Abstract: Generally discussed herein are systems, devices, and methods that include a communication cavity. According to an example a device can include a substrate with a first cavity formed therein, first and second antennas exposed in and enclosed by the cavity, and an interconnect structure formed on the substrate, the interconnect structure including alternating conductive material layers and inter-layer dielectric layers.

公开(公告)号：US10122089B2

公开(公告)日：2018-11-06

申请号：US15206428

申请日：2016-07-11

Applicant: Intel Corporation

Inventor： Vijay K. Nair ,  Chuan Hu ,  Shawna M. Liff ,  Larry E. Mosley

IPC: H01Q7/00 ,  H01Q7/06 ,  H01Q1/22 ,  G06F1/16 ,  H01F1/00 ,  H01Q23/00 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L23/66 ,  H01L23/31

Abstract: A method apparatus and material are described for radio frequency passives and antennas. In one example, an electronic component has a synthesized magnetic nanocomposite material with aligned magnetic domains, a conductor embedded within the nanocomposite material, and contact pads extending through the nanocomposite material to connect to the conductor.

公开(公告)号：US09647636B1

公开(公告)日：2017-05-09

申请号：US15088825

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Telesphor Kamgaing ,  Feras Eid ,  Vijay K. Nair ,  Georgios C. Dogiamis ,  Johanna M. Swan ,  Valluri R. Rao

IPC: G06K19/06 ,  H03H9/30 ,  H03H9/205 ,  H03H9/17 ,  G06K7/10

CPC classification number: G06K7/10297 ,  G06K7/10316 ,  G06K19/0672 ,  G06K19/0675 ,  H03H9/30

Abstract: Embodiments of the invention include delay line circuitry that is integrated with an organic substrate. Organic dielectric material and a plurality of conductive layers form the organic substrate. The delay line circuitry includes a piezoelectric transducer to receive a guided electromagnetic wave signal and to generate an acoustic wave signal to be transmitted with an acoustic transmission medium. An acoustic reflector is communicatively coupled to the acoustic transmission medium. The acoustic reflector receives a plurality of acoustic wave signals from the acoustic transmission medium and reflects acoustic wave signals to the piezoelectric transducer using the acoustic transmission medium. The transducer converts the reflected acoustic signals into electromagnetic waves which are then transmitted back through the antenna and decoded by the reader.